JPS59111097U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59111097U
JPS59111097U JP359883U JP359883U JPS59111097U JP S59111097 U JPS59111097 U JP S59111097U JP 359883 U JP359883 U JP 359883U JP 359883 U JP359883 U JP 359883U JP S59111097 U JPS59111097 U JP S59111097U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
insertion hole
mounting screw
screw insertion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP359883U
Other languages
Japanese (ja)
Inventor
誠一 小川
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP359883U priority Critical patent/JPS59111097U/en
Publication of JPS59111097U publication Critical patent/JPS59111097U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案半導体装置の実施の一例を示すもので、第
1図は斜め裏側から見た斜視図、第2図は放熱板に取付
けた状態を示す斜視図、第3図は第2図のA−A線に沿
う断面図である。 符号の説明、1・・・半導体装置、5・・・取付ねじ挿
通孔、6・・・放熱面、7・・・切粉収納凹部。
The drawings show an example of the implementation of the semiconductor device of the present invention. FIG. 1 is a perspective view as seen diagonally from the back side, FIG. 2 is a perspective view showing the state where it is attached to a heat sink, and FIG. It is a sectional view along the AA line. Explanation of symbols: 1... Semiconductor device, 5... Mounting screw insertion hole, 6... Heat dissipation surface, 7... Chip storage recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 出力用半導体素子が封止され取付ねじ挿通孔を有する半
導体装置において、上記取付ねじ挿通孔の放熱面に開口
する部分に切粉収納凹部を形成してなることを特徴とす
る半導体装置。
1. A semiconductor device in which an output semiconductor element is sealed and has a mounting screw insertion hole, characterized in that a chip storage recess is formed in a portion of the mounting screw insertion hole that opens to a heat radiation surface.
JP359883U 1983-01-14 1983-01-14 semiconductor equipment Pending JPS59111097U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP359883U JPS59111097U (en) 1983-01-14 1983-01-14 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP359883U JPS59111097U (en) 1983-01-14 1983-01-14 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59111097U true JPS59111097U (en) 1984-07-26

Family

ID=30135211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP359883U Pending JPS59111097U (en) 1983-01-14 1983-01-14 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59111097U (en)

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