JPS59101287A - Joining method of amorphous metal - Google Patents
Joining method of amorphous metalInfo
- Publication number
- JPS59101287A JPS59101287A JP57210182A JP21018282A JPS59101287A JP S59101287 A JPS59101287 A JP S59101287A JP 57210182 A JP57210182 A JP 57210182A JP 21018282 A JP21018282 A JP 21018282A JP S59101287 A JPS59101287 A JP S59101287A
- Authority
- JP
- Japan
- Prior art keywords
- amorphous
- mirror
- scanning
- thin
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、母相であるアモルファス金属同士あるいは
、アモルファス金属と他の金属とを接合する方法に関す
るもりである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for bonding amorphous metals that are matrix phases or bonding amorphous metals and other metals.
現在、アモルファス金属は細い線状の、ものとが、薄い
板状のものしか製造する技術がなく、太い線あるいは厚
い板のものの出現がその用途を拡大する上で非常に重要
となっている。しかし、その技術が開発されていない現
状では、過渡的な技術として、薄いアモルファス金属同
士を重ね合わせて厚くしたり、アモルファス金属と他の
金属とを重ね合わせて厚いものにするための接合技術が
必要である。Currently, there is no technology for manufacturing amorphous metals except in the form of thin wires or thin plates, and the emergence of thick wires or thick plates is extremely important in expanding their uses. However, at present, this technology has not been developed, and as a transitional technology, there are bonding technologies that overlap thin amorphous metals to make them thicker, or overlap amorphous metals and other metals to make them thicker. is necessary.
このような接合に従来から知られている一般的な接合技
術を適用すると、次のような問題がある。When conventionally known general bonding techniques are applied to such bonding, the following problems arise.
一般に金属同士を結合する場合には、溶接、ろう付、接
着、機械的結合等の方法があるが、通常の溶接やろう付
では比較的広範囲に被加工物が加熱され、加熱部分が冷
却するまでに時間がかがり、その加熱部分において再結
晶化が進行するため、アモルファス金属を溶接やろう付
しようとしても溶接部分が再結晶↓てしまい、アモルフ
ァス金パを使用した意味がうすれ、あるいはそれが消失
する。Generally, when joining metals, there are methods such as welding, brazing, adhesion, and mechanical joining, but in normal welding and brazing, the workpiece is heated over a relatively wide area, and the heated part is cooled. It takes a long time to complete the process, and recrystallization progresses in the heated part, so even if you try to weld or braze amorphous metal, the welded part will recrystallize, and the purpose of using amorphous metal will be lost, or it will be removed. Disappear.
また、アモルファス金属薄板を接着により重ね合わせて
厚ぐすることもできるが、この場合は接着剤が一般に高
分子相打であって１００℃近辺でその性能が低下する等
、接着によって得られたアモルファス金属に使用上の制
限がある。しかも、接着する場合には表面を極めて清浄
にしたり、活性化したシする手間がかかる。また、製品
の厚さを高ｆｉ９ ＭＥのものにすることは接着剤の硬
化収縮等により極めて困Ｍｌである。It is also possible to thicken amorphous metal sheets by overlapping them with adhesive, but in this case, the adhesive is generally a polymer compound, and its performance decreases at around 100°C. There are restrictions on the use of metals. Moreover, when adhering, it takes time and effort to extremely clean and activate the surface. Further, it is extremely difficult to make the product thick with high fi9 ME due to curing shrinkage of the adhesive and the like.
機械的結合については、例えばボルト結合等が考えられ
るが、この場合、ボルト穴による強度の低下、ボルトの
頭が突出するのを避けられない等の問題がある。As for the mechanical connection, for example, bolt connection can be considered, but in this case, there are problems such as a decrease in strength due to the bolt hole and the unavoidable protrusion of the bolt head.
本発明は、このような問題を解決したアモルファス金属
の接合法を提供しようとするものであって、アモルファ
ス金属の薄板同士あるいはアモルファス金属の薄板と他
の金属とを京ね合わせまたは突き合わせにより接触させ
、その接合部分に対して両者の接合に十分な高エネルギ
密度の細い電子ビームあるいはレーザ光を相対的に冒速
移動させながら走査することにより、その接触部分の瞬
間的な急加熱を行うと共に、その後の急冷却を行い、ア
モルファス金属をアモルファス状態を保持させて接合す
ることを％徴とするものである。The present invention aims to provide a method for joining amorphous metals that solves these problems, and involves bringing thin sheets of amorphous metal into contact with each other or a thin sheet of amorphous metal with another metal by aligning or butting them together. , By scanning the bonded portion with a thin electron beam or laser beam having a high energy density sufficient for bonding the two while moving at a relatively high speed, the contact portion is heated rapidly and instantaneously. The process is then rapidly cooled to maintain the amorphous state of the amorphous metals before joining.
本発明についてさらに詳細に説明すると、本発明に基づ
いて接合される被加工物としては、アモルファス金属の
薄板同士あるいはアモルファス金属の薄板とそれに溶融
接合できる他の金属板があり、これらの薄板はその２枚
あるいは多数枚を重ね合わせあるいは突き合わせにより
接触させ、その接触部分を細い電子ビームあるいはレー
ザ光による瞬間的な加熱溶融によシ接合させる。To explain the present invention in more detail, the workpieces to be joined according to the present invention include thin plates of amorphous metal or thin plates of amorphous metal and other metal plates that can be melted and bonded to the thin plates. Two or more sheets are brought into contact by overlapping or butting, and the contact portions are instantaneously heated and melted using a narrow electron beam or laser beam to join.
上記電子ビームあるいはレーザ光は、それによって高速
で走査する際に、被加工物の瞬間的な加熱溶融を行うの
に十分な高エネルギ密度を有することが必要であると同
時に、その後加熱部周辺がアモルファス状態を保持して
いる間に熱の拡散によって急冷却を行える程就に細いこ
とが必要である。The electron beam or laser beam needs to have a high enough energy density to instantaneously heat and melt the workpiece when it is scanned at high speed, and at the same time, the surrounding area of the heated part is heated. It needs to be so thin that it can be rapidly cooled by heat diffusion while maintaining an amorphous state.
このような電子ビームあるいはレーザ光によるアモルフ
ァス金属等の接合にあたっては、その電子ビーム等を、
２枚あるいは多数枚を重ね合わせたアモルファス金属等
の表面に対して相対的に高速移動させながら走査し、あ
るいはアモルファス金属等の互いに突き合わせた部分に
宿って走査し、それによってアモルファス金属等を重ね
合わせあるいは突き合わせにより接触させた接触部分の
瞬間的な急加熱を行うと共に、その後の急冷却を行い、
アモルファス金属をそれがアモルファス状態を保持した
状態で局部的に溶融接合させる。When bonding amorphous metals using such an electron beam or laser beam, the electron beam, etc.
Scans the surface of two or many stacked amorphous metals while moving them at relatively high speed, or scans the parts of the amorphous metals that abut against each other, thereby stacking the amorphous metals, etc. Alternatively, the contact parts brought into contact by butt are instantaneously heated rapidly, and then rapidly cooled.
Amorphous metals are locally fused and bonded while maintaining their amorphous state.
このような方法によって接合させる場合、一度電子ビー
ム等が通過した個所の周辺を接合するには、アモルファ
ス状態で冷却するに十分な時間の経過後に再び電子ビー
ム等を通過させる必要がある。When bonding by such a method, in order to bond the periphery of a portion through which an electron beam or the like has passed, it is necessary to pass the electron beam or the like again after a sufficient time has elapsed to cool the amorphous state.
また、電子ビーム等で走査するとき、十分に急速に冷却
させるために、電子ビーム等を連続的に照射せず、断続
的に照射しながら走査するのも一つの方法である。Furthermore, when scanning with an electron beam or the like, one method is to perform scanning while irradiating the electron beam or the like intermittently, rather than continuously, in order to cool the area sufficiently rapidly.
さらに、重ね合わせた金属同士の間に空気が入るのを防
ぐため、真空中で作業を行うことも考えられる。この場
合、重ね合わせた金属を密着させるために一度真空中で
金属薄板の周辺をくまなく溶接し、その後大気中でその
大気圧によ多金属薄板を密着状態にして各部をくまなく
溶融接合させればよい。また、加熱部分の急冷を助ける
だめに金属薄板の下面を冷却することもできる。なお、
これらの作業を特に宇宙空間の日陰で行えば、真空状態
は常に容易に得られるし、冷却媒体等も不要である。Furthermore, in order to prevent air from entering between the stacked metals, it is also possible to carry out the work in a vacuum. In this case, in order to make the stacked metals stick together, the thin metal plates are welded all over in a vacuum, and then the multi-metal thin plates are brought into close contact with each other in the atmosphere by the atmospheric pressure, and each part is melted and joined all over. That's fine. It is also possible to cool the lower surface of the metal sheet to aid in rapid cooling of the heated portion. In addition,
If these operations are performed especially in the shade of outer space, a vacuum state can always be easily obtained and no cooling medium is required.
電子ビームによって接合を行う場合は、電場を高速に変
化させることにより走査の方向を任意に変化させること
ができるため、必要に応じて金属薄板の各部を雁１次接
合することができる。しかし、レーザ光については複数
個の多面あるいは曲面の鏡を方向をかえて配列し、回転
数や位相等を適当に組み合わせることにより、金属薄板
上を縦横にあるいはランダム、に走査させることが必要
である。When bonding is performed using an electron beam, the direction of scanning can be arbitrarily changed by changing the electric field at high speed, so each part of the thin metal plate can be primary bonded as needed. However, for laser light, it is necessary to scan a thin metal plate vertically and horizontally or randomly by arranging multiple multifaceted or curved mirrors in different directions and appropriately combining the rotation speed and phase. be.
一方、金属薄板を高速で移動させる方法としては、それ
をドラムに巻き付けて高速回転させるとか、回転円板の
上に乗せるとか、圧延ローラー風に送る七か、いろいろ
の方法がある。On the other hand, there are various ways to move a thin metal sheet at high speed, such as wrapping it around a drum and rotating it at high speed, placing it on a rotating disk, or sending it through rolling rollers.
なお、金属薄板の２枚または多数枚を重ねて電子ビーム
またはレーザ光で縦横まだはランダムに走査するとき、
その走査密肢が粗いと金属薄板同士の接合のない部分が
生じることになるが、接合した金属薄板の用途によって
それが問題にならないことが比較的多く、その場合には
格別の障害になるようなことはない。Furthermore, when two or many thin metal plates are overlapped and scanned vertically and horizontally with an electron beam or laser beam,
If the scanning density is rough, there will be areas where the thin metal sheets are not joined, but this is relatively often not a problem depending on the application of the joined thin metal sheets, and in that case, it may become a particular hindrance. Nothing happens.
次に、レーザ光によって走査する場合の走査装置の構成
の一例について説明する。Next, an example of the configuration of a scanning device for scanning with laser light will be described.
第１図に示す走査装置において、ｌＯはレーザ光源、１
１及び１２は多面の回転鏡、１３は固定鏡、 １４は被
加工物である重ね合わせた金属薄板、１５は各回転鏡１
１ 、１２の位相に対応して動作するエネルギ吸収機構
を示している。In the scanning device shown in FIG. 1, lO is a laser light source, 1
1 and 12 are multifaceted rotating mirrors, 13 is a fixed mirror, 14 is a workpiece that is a stacked metal thin plate, and 15 is each rotating mirror 1.
An energy absorption mechanism that operates in accordance with phases 1 and 12 is shown.
この走査装置において、レーザ光源１０から投射したレ
ーザ光は、回転鏡１１ 、１２及び固定鏡１３において
反射して金属薄板１４上に照射するが、回転鏡ｊ１に比
して回転鏡１２の方を高速に回転させれば、レーザ光は
金属薄板１４上をＡ−＋Ｂ 、 Ｃ−＋Ｄ 、 Ｅ→Ｆ
、・・・・・と走査する。ＡＢ 、 ＣＤ 、 Ｅｌｉ
’ 、 、、、、、の間には適当な間隔を設け、それら
の間は前述したような十分な冷却時間の後に順次走査す
るが、その方法は回転鏡１１及び１２の位相を変えるか
、固定鏡１３を低速で傾動させればよい。また、α→Ａ
、ｃ→ｄ、ｅ→ｆの走査は、回転ｆｉ１２に比して回転
鏡Ｈの方を高速に回転さぜることによシ行うことができ
る。In this scanning device, the laser beam projected from the laser light source 10 is reflected by the rotating mirrors 11 and 12 and the fixed mirror 13 and irradiated onto the thin metal plate 14. If it is rotated at high speed, the laser beam will move on the thin metal plate 14 from A-+B, C-+D, E→F.
,... and so on. AB, CD, Eli
' , , , , , are provided with appropriate intervals, and scanning is performed sequentially between them after a sufficient cooling time as described above. This method involves changing the phases of the rotating mirrors 11 and 12, The fixed mirror 13 may be tilted at low speed. Also, α→A
, c→d, and e→f can be performed by rotating the rotating mirror H at a higher speed than the rotation fi12.
上記エネルギ吸収機宿１５は、レーザ光が金属薄板１４
以外の部分を照射するのを防ぐためのもので、回転鏡１
１ 、１２の位相に対応して動作させる必要があるが、
このレーザ光による走査装置の全体を遮蔽板あるいけエ
ネルギ吸収板で囲む場合にはその構成が著しく簡単に７
ｒる。The energy absorbing device 15 is configured so that the laser beam is transmitted through the metal thin plate 14.
This is to prevent the irradiation of parts other than the rotating mirror 1.
It is necessary to operate according to the phases of 1 and 12, but
If the entire scanning device using laser light is surrounded by a shielding plate or an energy absorbing plate, the configuration can be significantly simplified.
ru.
第２図は、第１図におけるＡ−＋Ｂ 、Ｃ→Ｄ、・・・
・の方向の走査とａ→ｂ、ｃ−＋ｄ、・・・・・の方向
の走査とを個別的に行うようにした走査装置を示すもの
で、２０はし〜ザ光汀、２１ 、２２及び２１’ 、
２２’は回転鏡、２：４ 、’ ２３’は固定鏡、２４
は金属薄板、２５はエネルギ吸収機構、２６はレーザ光
を回転鏡２１または２１′側へ切換える鏡を示している
。Figure 2 shows A-+B, C→D,... in Figure 1.
This shows a scanning device that separately performs scanning in the direction of ・ and scanning in the directions of a→b, c-+d, . . . and 21',
22' is a rotating mirror, 2:4, '23' is a fixed mirror, 24
25 is a metal thin plate, 25 is an energy absorption mechanism, and 26 is a mirror for switching the laser beam to the rotating mirror 21 or 21' side.
この装置によれば、各回転鏡の回転速度制御力ｉ極めて
簡単化される点で第１図の走査装置よ）も有利となる。This device is also advantageous over the scanning device shown in FIG. 1 in that the rotational speed control force i of each rotating mirror is greatly simplified.
以上に詳述した本発明の接合法によれば、従来の一般的
な接合技術を適用した場合の問題点が解消され、アモル
ファス状態を保持させた状態でアモルファス金属薄板の
接合を行うことができる。According to the joining method of the present invention described in detail above, the problems encountered when applying conventional general joining techniques are solved, and amorphous metal sheets can be joined while maintaining their amorphous state. .
第１図及び第２図は本発明の実施に利用されるレーザ光
による走査装置の斜視図及び側面図である。
１４ 、２４・・・金属薄板。FIGS. 1 and 2 are a perspective view and a side view of a laser beam scanning device used to implement the present invention. 14, 24... Metal thin plate.
Claims (1)
ス全屈の薄板と他の金属とを重ね合わせまたは突き合わ
ぜにより接触させ、その接合部分に対して両者の接合に
十分な高エネルギ密度の細い電子ビームあるいはレーザ
光を相対的に高速移動させながら走査することによ）、
その接触部分の瞬間的な急加熱を行うと共に、５その後
の急冷却を行い、アモルファス金属をアモルファス状態
を保持させて接合することを特゛徴とするアモルファス
金属の接合法。1. Contact thin sheets of amorphous metal or a fully bent amorphous thin sheet with another metal by overlapping or butting them together, and apply a thin electron beam or laser beam to the joint with a high energy density sufficient to bond the two. (by scanning the light while moving it at relatively high speed),
A method for joining amorphous metals, which is characterized by instantaneous rapid heating of the contact portion and subsequent rapid cooling to join the amorphous metals while maintaining the amorphous state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57210182A JPS59101287A (en) | 1982-11-30 | 1982-11-30 | Joining method of amorphous metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57210182A JPS59101287A (en) | 1982-11-30 | 1982-11-30 | Joining method of amorphous metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59101287A true JPS59101287A (en) | 1984-06-11 |
| JPH037475B2 JPH037475B2 (en) | 1991-02-01 |
Family
ID=16585135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57210182A Granted JPS59101287A (en) | 1982-11-30 | 1982-11-30 | Joining method of amorphous metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101287A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05261565A (en) * | 1992-03-13 | 1993-10-12 | Mitsubishi Electric Corp | Working method using electron beam |
| JP2006088201A (en) * | 2004-09-24 | 2006-04-06 | Kuroki Kogyosho:Kk | Welding method by high energy beam of metallic glass and crystalline metal |
| WO2009014221A1 (en) * | 2007-07-25 | 2009-01-29 | Kumamoto University | Method of welding metallic glass with crystalline metal by high-energy beam |
| CN102430862A (en) * | 2011-08-04 | 2012-05-02 | 比亚迪股份有限公司 | Laser welding method for amorphous matrix material |
-
1982
- 1982-11-30 JP JP57210182A patent/JPS59101287A/en active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05261565A (en) * | 1992-03-13 | 1993-10-12 | Mitsubishi Electric Corp | Working method using electron beam |
| JP2006088201A (en) * | 2004-09-24 | 2006-04-06 | Kuroki Kogyosho:Kk | Welding method by high energy beam of metallic glass and crystalline metal |
| JP4596523B2 (en) * | 2004-09-24 | 2010-12-08 | 株式会社黒木工業所 | Welding method of metallic glass and crystalline metal by high energy beam |
| WO2009014221A1 (en) * | 2007-07-25 | 2009-01-29 | Kumamoto University | Method of welding metallic glass with crystalline metal by high-energy beam |
| US8404992B2 (en) | 2007-07-25 | 2013-03-26 | Kumamoto University | Method of welding metallic glass with crystalline metal by high-energy beam |
| JP5268002B2 (en) * | 2007-07-25 | 2013-08-21 | 国立大学法人 熊本大学 | Welding method of metallic glass and crystalline metal by high energy beam |
| KR101491585B1 (en) * | 2007-07-25 | 2015-02-09 | 고꾸리쯔다이가꾸호오진 구마모또 다이가꾸 | Method of welding metallic glass with crystalline metal by high-energy beam |
| CN102430862A (en) * | 2011-08-04 | 2012-05-02 | 比亚迪股份有限公司 | Laser welding method for amorphous matrix material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH037475B2 (en) | 1991-02-01 |
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