JPS5891587A - Installing method of driving coil for magnetic bubble memory - Google Patents
Installing method of driving coil for magnetic bubble memoryInfo
- Publication number
- JPS5891587A JPS5891587A JP56190344A JP19034481A JPS5891587A JP S5891587 A JPS5891587 A JP S5891587A JP 56190344 A JP56190344 A JP 56190344A JP 19034481 A JP19034481 A JP 19034481A JP S5891587 A JPS5891587 A JP S5891587A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- bubble memory
- board
- memory chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C19/00—Digital stores in which the information is moved stepwise, e.g. shift registers
- G11C19/02—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements
- G11C19/08—Digital stores in which the information is moved stepwise, e.g. shift registers using magnetic elements using thin films in plane structure
- G11C19/085—Generating magnetic fields therefor, e.g. uniform magnetic field for magnetic domain stabilisation
Abstract
Description
【発明の詳細な説明】
本発明は駆動コイルの位置決めを正しく行うと共に磁界
効率を高めた磁気バブルメモリ用駆動コイルの装着方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for mounting a drive coil for a magnetic bubble memory, which positions the drive coil correctly and improves magnetic field efficiency.
磁気パズルメモリチップ（以下バブルメモリチップ）は
印刷配線基板に装着され、これに駆動コイルが巻回装着
されて駆動磁界を与えるヱうに構成されている。A magnetic puzzle memory chip (hereinafter referred to as a bubble memory chip) is mounted on a printed circuit board, and a drive coil is wound around the chip to apply a drive magnetic field.
第１図はか＼る基板の正面図で第２図は印刷配線パター
ンを省略した基板の斜視図である。FIG. 1 is a front view of the board, and FIG. 2 is a perspective view of the board with the printed wiring pattern omitted.
バブルメモリチップは深い切）込み部１をもつ基板２の
中央凹部３に接着剤を用いて固着されており、基板上に
設けられている印刷配線４とポンディングパッド部５に
おいてボンデング接続されている。The bubble memory chip is fixed with adhesive to a central recess 3 of a substrate 2 having a deep notch 1, and is bonded to a printed wiring 4 provided on the substrate at a bonding pad 5. There is.
こ＼で基板２はアルミナ磁器のような無機材料或はガラ
スエポキシ、ポリイミドのような高分子材料からなって
お９、この上に施された単層或は多層からなる印刷配線
４は基板の端間にある端子部６において図示していない
パッケージのリード端子と爆着される構造となっている
。Here, the substrate 2 is made of an inorganic material such as alumina porcelain or a polymeric material such as glass epoxy or polyimide 9, and the printed wiring 4 formed of a single layer or multiple layers formed on the substrate is The terminal portion 6 located between the ends is structured to be explosively bonded to a lead terminal of a package (not shown).
次に基板２に設けられている深い切ル込み部１はバブル
メモリチップに駆動磁界を与えるためのＸ方向コイル、
を挿着するために設けられているもので、Ｘ方向コイル
はＹ方向コイル挿着後に基板２の深い切シ込み部１を用
いて挿着されるようＫなっている。Next, the deep notch 1 provided in the substrate 2 is an X-direction coil for applying a driving magnetic field to the bubble memory chip.
The X-direction coil is inserted into the substrate 2 using the deep notch 1 after the Y-direction coil is inserted.
本発明はか＼る駆動コイルの形成方法に関するもので、
第３図囚〜口は本発明にか＼る形成手順を示し良もので
ある。The present invention relates to a method of forming such a drive coil,
Figures 3-3 illustrate the forming procedure according to the present invention.
さて駆動コイルはバブルメモリチップに駆動磁界を与え
るものであ夛、そのためにＸ方向コイルおよびＹ方向コ
イルよｐなる駆動コイルはバブルメモリチップを中央と
して位置精度よくまた磁界効率よく設けられていること
が必要である０そのために従来は基板の寸法公差に合わ
せてＸ方向コイルおよびＹ方向コイルの寸法公差が厳し
く決められて基板に密着するよう形成されておシか＼る
コイルはパッケージングの際に行われる樹脂注入によ如
固定する方法がとられていた０然し乍らＸ方向コイルお
よびＹ方向コイルからなる駆動コイルは第１図および第
２図で示した基板２の中央凹部３にバブルメモリチップ
を鋏着後に基板２を巻き芯としてコイル線を巻回して作
るものではなく、予め巻回されたソレノイドコイルを基
板２に挿入し位置決めする方法で作られている０
そのため寸法公差は厳しく規制してあっても挿着を量産
的に行うためには基板２とＹ方向コイルおよびＹ方向コ
イルと更にこの上に挿着されるＸ方向コイルとの間には
多少の間隙を必要とし、そのためバブルメモリチップ面
とコイルの中心との位置関係は製造過程においてバラツ
キ易く、またコイル挿着後の工程においても変動し易い
と云う欠点があった。Now, the drive coil is to provide a drive magnetic field to the bubble memory chip, and for this purpose, the drive coils such as the X-direction coil and the Y-direction coil are provided with good positional accuracy and magnetic field efficiency with the bubble memory chip in the center. Therefore, in the past, the dimensional tolerances of the X-direction coil and Y-direction coil were strictly determined according to the dimensional tolerance of the board, and the coils were formed so as to be in close contact with the board. However, the drive coil consisting of the X-direction coil and the Y-direction coil is placed in the central recess 3 of the substrate 2 shown in FIGS. 1 and 2 as a bubble memory chip. The solenoid coil is not made by winding a coil wire around the board 2 as a core after attaching it with scissors, but by inserting and positioning a pre-wound solenoid coil into the board 2. Therefore, dimensional tolerances are strictly regulated. However, in order to mass-produce the insertion and insertion, some gaps are required between the board 2 and the Y-direction coil, and between the Y-direction coil and the The disadvantage is that the positional relationship between the memory chip surface and the center of the coil tends to vary during the manufacturing process, and also tends to vary during the process after the coil is inserted.
本発明の目的は駆動コイルをバブルメモリチップに対し
て正しく位置決めすると共に位置変動のない装着方法を
提供するにあシ、その方法として基板にソレノイドコイ
ルを装着する際に加圧成形することにより基板に対し不
動の位置決めを行うものである。An object of the present invention is to correctly position a drive coil with respect to a bubble memory chip and to provide a mounting method that does not cause positional fluctuations. This is for immovable positioning.
以下図面により本発明を説明する。The present invention will be explained below with reference to the drawings.
第３１囚はバブルメモリチップ装着後の基板２にＹ方向
コイル７を挿入した状態図である０こ＼で従来は基板２
の断面と相似で最小限の寸法公差をもつＹ方向コイルが
挿入されていた。The 31st prisoner is a state diagram in which the Y-direction coil 7 is inserted into the board 2 after the bubble memory chip is attached.
A Y-direction coil with a cross section similar to the one with minimum dimensional tolerance was inserted.
然し本発明による場合はＹ方向コイルは基板断面と相似
の断面形状を示すが、寸法公差は従来のように厳しく規
制する必要はなく、治具を用いて正しく位置めした状態
で、そのｔ〜圧着して同図（６）のように成形固定させ
る。こ＼でよシ効果的に成形するにはＹ方向コイル７を
加熱し乍ら圧着して焼鈍効果を加味させるとよい。However, in the case of the present invention, although the Y-direction coil has a cross-sectional shape similar to the board cross-section, the dimensional tolerance does not need to be strictly regulated as in the past, and when correctly positioned using a jig, the t~ Crimp and mold and fix as shown in the same figure (6). In order to effectively shape the Y-direction coil 7, the Y-direction coil 7 may be heated and crimped to add an annealing effect.
かくすることによｊＤＹ方向コイルは基板２に対し固着
すると共にそのコイル間隔が接近しバブルメモリチップ
に対する磁界効率が向上しまた治具を用いて固着するた
め基板毎による位置の変動が抑えられる。By doing this, the jDY direction coils are fixed to the substrate 2, and the coil spacing becomes closer, improving the magnetic field efficiency for the bubble memory chip.Furthermore, since the jDY direction coils are fixed using a jig, variations in position depending on the substrate can be suppressed.
次に同図ＯＫ示すようにＸ方向コイル８を挿入し治具を
用いて位置決めした状態でＹ方向コイル７を成形したと
同様な方法で圧着成形することによって同図０に示すよ
うな駆動コイルが形成されるＯ
と＼で本発明に係る方法によシ装着した第３図■の駆動
コイルを従来の駆動コイルと比較するとバブルメモリチ
ップに対して正確に位置決めされ、基板毎の位置変動が
少く、磁界効率が高いなどの利点を有する以外にソレノ
イドコイルの寸法公差を従来程厳しく規制する必要がな
いためソレノイドコイルの製造歩留を格段に高めること
ができ、そのため大幅な価格低下が可能となった。Next, as shown in FIG. 0, the X-direction coil 8 is inserted and positioned using a jig, and the drive coil as shown in FIG. Comparing the drive coil shown in Figure 3 (■) mounted by the method according to the present invention with the conventional drive coil, it is found that the drive coil is accurately positioned with respect to the bubble memory chip, and positional fluctuations from board to board are eliminated. In addition to having advantages such as small size and high magnetic field efficiency, it is not necessary to regulate the dimensional tolerance of solenoid coils as strictly as before, so the manufacturing yield of solenoid coils can be significantly increased, which makes it possible to significantly reduce prices. became.
本発明は基板に駆動コイルを装着する際当初如何に正確
に位置決めした場合でも基板、Ｙ方向コイルおよびＸ方
向コイルの相互間に隙き関があるためパッケージング工
程で低圧成形成いは樹脂注入を行うまでの工程で駆動コ
イルの位置決めが変動し、そのため特性のバラツキが大
きくなりてい九のを改めるため咳なされたもので本発明
の実施によシ特性の向上に止まらず価格低減も行うこと
ができた。In the present invention, when mounting the drive coil on the board, there is a gap between the board, the Y-direction coil, and the X-direction coil no matter how accurately they are initially positioned, so low-pressure molding or resin injection is required in the packaging process. The positioning of the drive coil fluctuates during the process up to the process, and as a result, the variation in characteristics becomes large, and it was necessary to improve the characteristics.The implementation of the present invention not only improves the characteristics, but also reduces the price. was completed.
第１図は磁気パズルメモリ用基板の正面図、第２図はこ
の斜視図、また第３図Ｋ（Ｂ＼（Ｑｌ（至）は本発明に
係る駆動コイルの装着工程の説明図である０図において
２は基板、７はＹ方向コイル、８はＸ方向コイル０
代理人］−理士 松 岡 宏四鰐】
ｔＡ）
ｔ
（Ｃ）
第２区
ＣＤ）FIG. 1 is a front view of the magnetic puzzle memory board, FIG. 2 is a perspective view thereof, and FIG. 3 is an explanatory diagram of the drive coil mounting process according to the present invention. In the figure, 2 is the board, 7 is the Y-direction coil, and 8 is the X-direction coil.
Claims (1)
に磁気バブルメモリチップを接着し配線接続後、該チッ
プを中心として前記基板に装着されるＸ方向コイルおよ
びＹ方向コイルからなる駆動コイルにおいて、該コイル
が当初寸法精度に余裕をもって形成されておシ、基板に
装着後成形固着させることを１！Ｉｌ像とする磁気バブ
ルメモリ用駆動コイルの装着方法。After gluing a magnetic bubble memory chip to the central recess of a square printed wiring board made of an inorganic or organic material and connecting wiring, a drive coil consisting of an X-direction coil and a Y-direction coil is attached to the board with the chip as the center. 1! The coil is initially formed with a margin of dimensional accuracy, and then molded and fixed after being mounted on the board. A method of mounting a drive coil for a magnetic bubble memory to produce an Il image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190344A JPS5891587A (en) | 1981-11-27 | 1981-11-27 | Installing method of driving coil for magnetic bubble memory |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190344A JPS5891587A (en) | 1981-11-27 | 1981-11-27 | Installing method of driving coil for magnetic bubble memory |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5891587A true JPS5891587A (en) | 1983-05-31 |
Family
ID=16256629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56190344A Pending JPS5891587A (en) | 1981-11-27 | 1981-11-27 | Installing method of driving coil for magnetic bubble memory |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5891587A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61255581A (en) * | 1985-05-08 | 1986-11-13 | Hitachi Ltd | Magnetic bubble memory device and its manufacture |
-
1981
- 1981-11-27 JP JP56190344A patent/JPS5891587A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61255581A (en) * | 1985-05-08 | 1986-11-13 | Hitachi Ltd | Magnetic bubble memory device and its manufacture |
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