JPS5879727A - Device for wire bonding and method therefor - Google Patents

Device for wire bonding and method therefor

Info

Publication number
JPS5879727A
JPS5879727A JP56177736A JP17773681A JPS5879727A JP S5879727 A JPS5879727 A JP S5879727A JP 56177736 A JP56177736 A JP 56177736A JP 17773681 A JP17773681 A JP 17773681A JP S5879727 A JPS5879727 A JP S5879727A
Authority
JP
Japan
Prior art keywords
wire
air
capillary
bonding
bond point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56177736A
Other languages
Japanese (ja)
Other versions
JPS6352778B2 (en
Inventor
Hiroshi Ushiki
博 丑木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56177736A priority Critical patent/JPS5879727A/en
Publication of JPS5879727A publication Critical patent/JPS5879727A/en
Publication of JPS6352778B2 publication Critical patent/JPS6352778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To form a normal wire loop by jetting air in a part of a time while a capillary is moving from a first bonding point to a second bonding point. CONSTITUTION:After a ball 1a is formed by a torch 4, air is jetted to wire 1 and the ball 1a is fastened to the tip of a capillary 3. The air jetting is stopped between (c) and (d). Subsequently, by the operations (d)-(g) wire is spread between a first bonding point 5 and a second bonding point 6 to form a wire loop, whereas the air jetting is started for (e)-(f). When the capillary 3 starts bonding for the point 6 at (g), the air jetting is stopped. Since the air jetting is carried out between (e)-(f), the wire loop can be prevented from becoming low even if the quantity of flowing air is large, and proper wire loop is formed.

Description

【発明の詳細な説明】 本発明はワイヤボンディング装置及びその方法に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding apparatus and method thereof.

周知の如く、ワイヤボンディングは第１図に示す順序に
従って行われる。図示しないスプールに巻回されたワイ
ヤ１は、ワイヤ切断用クランパー２を通ってキャピラリ
３の先端に延在している。As is well known, wire bonding is performed according to the sequence shown in FIG. A wire 1 wound around a spool (not shown) passes through a wire cutting clamper 2 and extends to the tip of a capillary 3.

まず同図（ａ）に示すようにトーチ４が動作してワイヤ
１の先端にボール１ａが形成される。その後、ワイヤ切
断用クランパー２は開状態になる。次５こ同図（ｂ）に
示すようにキャピラリ３が下降を始め、同図（Ｃ）に示
すように第１ボンド点５にボール１ａをキャピラリ３で
押圧してボンディングする。次に同図（ｄ）＄こ示すよ
うにキャピラリ３が上昇し、続いて同図（ｅ）に示すよ
うに上昇しながら第２ボンド点６の上方に移動する。次
に同図１ｆ）＃こ示すように下降を始め、同図（２口こ
示すように第２ボンド点６にワイヤｌをキャピラリ３で
押圧してボンディングする。ポンディング終了後、同図
（ｈ）に示すようにキャピラリ３がわずかに上昇し、続
いて同図Ｕ）に示すようにワイヤ切断用クランパー２が
閉じてワイヤ１をクランプし、ワイヤ切断用クランパー
２がキャピラリ３と共に上昇してワイヤｌをカットする
。欠番こ同図（１口こ示すよう番こキャピラリ３が上昇
する。これＩこよりワイヤポンディフグの一動作が終了
し、以後は上記（ａ）〜（ｊｌの動作を繰返して順次ワ
イヤボンディングを行う。First, as shown in FIG. 4A, the torch 4 is operated to form a ball 1a at the tip of the wire 1. Thereafter, the wire cutting clamper 2 becomes open. Next, as shown in FIG. 5(b), the capillary 3 begins to descend, and as shown in FIG. 5(c), the ball 1a is pressed against the first bonding point 5 by the capillary 3 for bonding. Next, the capillary 3 rises as shown in FIG. 3(d), and then moves above the second bonding point 6 while rising as shown in FIG. 4(e). Next, the wire 1 is pressed down to the second bonding point 6 with the capillary 3 and bonded as shown in the figure (1f) # in the same figure. The capillary 3 rises slightly as shown in h), then the wire cutting clamper 2 closes and clamps the wire 1 as shown in figure U), and the wire cutting clamper 2 rises together with the capillary 3. Cut wire l. This figure shows the missing number (the number capillary 3 rises to show one opening. From this point, one operation of wire bonding is completed, and from then on, the above operations (a) to (jl) are repeated to perform wire bonding in sequence. conduct.

ところで、上記ワイヤポンディフグにおいては、同図（
ａ）のようにトーチ４１こよって形成されたボール１ａ
が第２図（ａハこ示すようにキャピラリ３の中心に対し
てセンターずれを起さないでキャピラリ３の先端に圧着
させる必要がある。もし、第２図（ｂ）に示すようにボ
ール１ａが−ってキャピラリ３に接すると、第１図に示
す第１ボンド点５＃こボンディングされたワイヤボンデ
ィング部の圧着はがれ、圧着形状不良等の圧着不良が生
じ、良好なボッディングが得られない。また第１図（ｄ
）〜Ｉｇ）の動作によって第１ポンド点５と第２ボンド
点６に接続されたワイヤルーズのたるみ及び曲り等があ
ると、タブショート等の不良が生じる。By the way, in the wire pond puffer fish mentioned above, the same figure (
Ball 1a formed by torch 41 as in a)
As shown in Figure 2 (a), it is necessary to press the ball 1a to the tip of the capillary 3 without causing any center deviation with respect to the center of the capillary 3. When the capillary 3 comes into contact with the capillary 3, the wire bonding portion bonded at the first bonding point 5# shown in FIG. Also, Figure 1 (d
) to Ig), if the wires connected to the first bond point 5 and the second bond point 6 become slack or bent, defects such as tab shorts will occur.

そこで従来、前記した問題を解消するために、第３図に
示すようにワイヤ１の巻回されたスプール（図示せず）
とワイヤ切断用クランパー２との間でワイヤ１にエアー
ノズル７よりエアー８を吹き付けてワイヤ１にバックテ
ンションを与えている。図示、９．１０はワイヤガイド
を示す。前記ワイヤｌへのエアー８の吹き付けは、第１
図＜ａ＞＋こ示すようにトーチ４によりボール１ａを形
成後、第１図（ｉ）に示すようにワイヤカットする間、
常時行っている。このエアー８の吹き付行によってボー
ルｌａはキャピラリ３の先端に接する。そこで、ボール
１ａがキャピラリ３の先端に第２図（ａ）に示すようζ
こ圧着するように、エアー８の流量を多くし、ワイヤ１
に吹き付ける圧力を高くしている。Conventionally, in order to solve the above-described problem, a spool (not shown) around which the wire 1 is wound is used as shown in FIG.
Air 8 is blown onto the wire 1 from an air nozzle 7 between the wire cutting clamper 2 and the wire cutting clamper 2 to give back tension to the wire 1. In the figure, 9.10 indicates a wire guide. The air 8 is blown onto the wire l in the first
Figure <a> + After forming the ball 1a with the torch 4 as shown, during wire cutting as shown in Figure 1(i),
I go all the time. This blown air 8 brings the ball la into contact with the tip of the capillary 3. Then, the ball 1a is placed at the tip of the capillary 3 as shown in FIG. 2(a).
Increase the flow rate of air 8 and press wire 1 so that the wire 1 is crimped.
The pressure applied to the air is increased.

例えばエアーノズル７のノズル径を１．２■φのものヲ
使用した場合、エアーノズル７に送られる前において、
圧力が４’Ｖ４の場合に流量を約１６−にしている。For example, when using the air nozzle 7 with a nozzle diameter of 1.2 mm, before being sent to the air nozzle 7,
When the pressure is 4'V4, the flow rate is about 16-.

ところが、エアー８の流量を多くしたままで第１図（ｄ
）〜（ｇ）の動作を行って第２ボンド点６のボンディン
グを行うと、ワイヤルーズの高さが低くなるという欠点
がある。そこで、ワイヤルーズの高さを高く形成するに
はエアー８の流量を例えば１０〜程度に少なくし、ワイ
ヤ１への圧力を下げればよいが、エアー８の流量を少な
くすると、ボールｌａが十分にキャピラリ３の先端に圧
着されなく、第２図（ｂ）に示すようにキャピラリ３の
中心に対してボール１ａのセンターずれが生じる。However, even though the flow rate of air 8 was kept high, the situation in Figure 1 (d
If the operations of ) to (g) are performed to bond the second bond point 6, there is a drawback that the height of the loose wire becomes low. Therefore, in order to form a high wire loose height, the flow rate of the air 8 can be reduced to, for example, about 10~ to lower the pressure on the wire 1, but if the flow rate of the air 8 is reduced, the ball la will not be The ball 1a is not pressed against the tip of the capillary 3, and the center of the ball 1a is shifted from the center of the capillary 3, as shown in FIG. 2(b).

本発明は上記従来技術の欠点に鑑みなされたもので、ボ
ールのセンターずれを防止すると共に、正常なワイヤル
ープを形成することができるワイヤボンディング装置及
びその方法を提供することを目的とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a wire bonding device and method that can prevent the center of the ball from shifting and form a normal wire loop.

以下１本発明の一実施例を第４図、第５図により説明す
る。な右、第１図〜第３図と同じ部材には同一符号を付
し、その説明を省略する。１１はＸＹ方向に駆動される
図示しないＸＹテーブル上に固定された枠体、１２は枠
体１１に回転自在に支承されたカム軸で、このカム軸１
２には従動プーリ１３、ボンディングカム１４、クラン
パー上下動カム１５及びバルブ開閉カム１６が固定され
ている。１７は枠体１０の後部下方上面にアングル１８
を介して固定されたモータで、このモータ１７の出力軸
１７ａには駆動プーリ１９が固定されており、この駆動
プーリ１９と前記従動プーリ１３とにはベルト２０が掛
は渡されている。２１はバルブ開閉カム１６によって開
閉するエアー／（ルブで、枠体１１ｉＣＥ定されている
。An embodiment of the present invention will be described below with reference to FIGS. 4 and 5. On the right, the same members as in FIGS. 1 to 3 are designated by the same reference numerals, and their explanations will be omitted. 11 is a frame fixed on an XY table (not shown) driven in the XY directions; 12 is a camshaft rotatably supported by the frame 11;
A driven pulley 13, a bonding cam 14, a clamper vertical movement cam 15, and a valve opening/closing cam 16 are fixed to 2. 17 is an angle 18 on the rear lower upper surface of the frame 10.
A drive pulley 19 is fixed to the output shaft 17a of the motor 17, and a belt 20 is passed between the drive pulley 19 and the driven pulley 13. Reference numeral 21 denotes an air valve that is opened and closed by a valve opening/closing cam 16, and is fixed to the frame 11iCE.

２２は枠体１１に回転自在に支承された支軸２３に固定
されたボンディングアームで、一端にはキャピラリ３が
固定され、他端にはカムフォロア２４が取付けられてお
り、このカムフォロア２４がボノデイノグカム１４に圧
接するようにスプリング２５で付勢されている。２６は
枠体１１に回転自在に支承された支軸２７に固定された
クラッパ−上下動アームで、一端にはワイヤ切断用クラ
ッパ−２が取付けられ、他端にはカムフォロア２８が取
付けられており、このカムフォロア２８がクランパー上
下動カム１５に圧接するようにスプリング２９で付勢さ
れている。３０は一端にワイヤガイド１０が取付けられ
たワイヤガイドホルダーで、他端は枠体１１の上部に固
定されている。３１はエアーノズル７を堆付けたエアー
吹付部で、ワイヤガイドホルダー３０上に固定されてお
り、エアーノズル７には一端がエアーバルブ２１に接続
されたパイプ３２の他端が接続されている。３３はワイ
ヤｌを巻回したスプールで、中心部にはワイヤ１をガイ
ドするための筒状ワイヤガイド３４が設けられている。22 is a bonding arm fixed to a support shaft 23 that is rotatably supported on the frame 11. A capillary 3 is fixed to one end, and a cam follower 24 is attached to the other end. It is urged by a spring 25 so as to come into pressure contact with. Reference numeral 26 denotes a clapper-vertical moving arm fixed to a support shaft 27 rotatably supported on the frame 11. A wire cutting clapper 2 is attached to one end, and a cam follower 28 is attached to the other end. The cam follower 28 is urged by a spring 29 so as to come into pressure contact with the clamper vertical movement cam 15. A wire guide holder 30 has the wire guide 10 attached to one end thereof, and the other end is fixed to the upper part of the frame 11. Reference numeral 31 denotes an air blowing section having an air nozzle 7 mounted thereon, which is fixed on the wire guide holder 30. One end of the pipe 32 is connected to the air valve 21, and the other end of the pipe 32 is connected to the air nozzle 7. 33 is a spool around which the wire 1 is wound, and a cylindrical wire guide 34 for guiding the wire 1 is provided in the center.

′“３５はワイヤガイド９及びスプール３３を保持する
ホルダーで、ワイヤガイドホルダー３０の上に固定され
ている。３６はワイヤｌの繰出しが必要以上奢こ行われ
ないようにワイヤｌを常時軽く押え付ける押えクランパ
ーで、ホルダー３５に取付けられている。``35 is a holder that holds the wire guide 9 and the spool 33, and is fixed on the wire guide holder 30. 36 is a holder that holds the wire l lightly at all times so that the wire l is not drawn out more than necessary. The presser clamp is attached to the holder 35.

次にかから構成される装置の作動について説明する。モ
ータ１７が回転すると、駆動プーリ１９、ベルト２０、
従動プーリ１３を介してカム軸１２が回転する。カム軸
１２が回転すると、ボンディングカム１４、クランパー
上下動カム１５が回転し、カム１４．１５のプロフィル
に従ってポンディングアーム２２、クラ／パー上下動ア
ーム２６がそれぞれ支軸２３．２７を中心として揺動し
、キャピラリ３、ワイヤ切断用クランパー２が上下動す
る。また図示しないＸＹテーブルがＸＹ方向に駆動され
ると、枠体１１がＸＹ方向に移動し、キャピラリ３、ワ
イヤ切断用クランパー２がＸＹ方向に移動させられる。Next, the operation of the device constructed as above will be explained. When the motor 17 rotates, the drive pulley 19, belt 20,
The camshaft 12 rotates via the driven pulley 13. When the camshaft 12 rotates, the bonding cam 14 and the clamper vertical movement cam 15 rotate, and the bonding arm 22 and clamper vertical movement arm 26 swing around the support shafts 23.27, respectively, according to the profile of the cam 14.15. The capillary 3 and wire cutting clamper 2 move up and down. Further, when the XY table (not shown) is driven in the XY directions, the frame 11 is moved in the XY directions, and the capillary 3 and the wire cutting clamper 2 are moved in the XY directions.

このキャピラリ３、ワイヤ切断用クランパー２の上下動
及びＸＹ方向の移動は第１図（ａ）〜（ｊ）に示すタイ
ミングに従って行われる。The capillary 3 and wire cutting clamper 2 are moved up and down and moved in the X and Y directions according to the timings shown in FIGS. 1(a) to 1(j).

さて、本発明においては、第１図（ＩＩ）〜（ｊ）の動
作中に第６図に示すタイミングでワイヤ１にエアー８の
吹き付けが行われる。なお、第６図におけるａ、ｂ・・
・ｊはそれぞれ第１図の（ａ）、（ｂ）・・・（ｊ）に
対応したタイミングを示す。前記の如くカム軸１２が回
転すると、バルブ開閉カム１６が回転し、このバルブ開
閉カム１６のプロフィルに従ってエアーバルブ２１が開
閉し、パイプ３２を介してエアーノズル７よりエアーの
吹き出し及び吹き出し停止が行われる。Now, in the present invention, air 8 is blown onto the wire 1 at the timing shown in FIG. 6 during the operations shown in FIGS. 1 (II) to (j). In addition, a, b... in Fig. 6
・J indicates the timing corresponding to (a), (b), . . . (j) in FIG. 1, respectively. When the camshaft 12 rotates as described above, the valve opening/closing cam 16 rotates, and the air valve 21 opens and closes according to the profile of the valve opening/closing cam 16, and air is blown out and stopped from the air nozzle 7 via the pipe 32. be exposed.

このエアー吹き出しのタイミングを第１図、第６図を参
照して説明すると、第１図（ａ）に示すようにトーチ４
によりボールｌａが形成された後、第６図に示すように
エアーの吹き出しがＯＮとなり、ワイヤ１にエアー８の
吹き付けが行われる。これによりワイヤ１は上方に引き
−Ｆげられ、ボール１ａは第２図に示すようにキャピラ
リ３の先端に密着する。この場合、ボール１ａが第２図
（ａ）ζこ示すようにキャピラリ３の中心に一致してキ
ャピラリ３に密着するように、エアー８の流量はある程
度多く、例えば１６〜２０を−にしである。そして、エ
アー８の吹き出しは、第６図ｃ、ｄ間、即ち第１図ｆｅ
）、１ｄ１間で停止する。The timing of this air blowing will be explained with reference to FIGS. 1 and 6. As shown in FIG. 1(a), the torch 4
After the ball la is formed, as shown in FIG. 6, air blowing is turned on and air 8 is blown onto the wire 1. As a result, the wire 1 is pulled upward and the ball 1a is brought into close contact with the tip of the capillary 3 as shown in FIG. In this case, the flow rate of the air 8 is increased to a certain extent, for example, from 16 to 20, so that the ball 1a aligns with the center of the capillary 3 and comes into close contact with the capillary 3 as shown in FIG. . The air 8 is blown out between c and d in Fig. 6, that is, fe in Fig. 1.
), it stops between 1d1.

次に第１図（ｄ）〜（ｇ）の動作によって第１ボンド点
５と第２ボンド点６間にワイヤ１が張られてワイヤルー
プが形成されるが、本発明においてはこの間、即ち第６
図Ｃと１間、いい換えれば第１図（６１〜・（ｆ）間憂
こエアー８の吹き出しが始まる。そして、第１図（ｇ）
に示すようにキャピラリ３が第２ボンド点６に接地又は
ポンディングを開始すると、第６図ｇに示すようにエア
ーの吹き出しはＯＦＦとなる。前記の如くボール１ａが
キャピラリ３に対してセンターずれを生じないようにエ
アー８の流量はある程度多くしであるが、本発明におい
ては第１ボンド点５ボッディング後から第２ボンド点６
ボンデイング間の一部においてエアー８の吹き出しを行
うので、エアー８の流量が多くてもワイヤループが低く
なることがなく、適切なワイヤループが形成される。こ
こで、エアー８の吹き出しのタイミングはエアー流量と
の関係で第１図（ｄ）から（ｆ）間において適切なタイ
ミングに設定する必要がある。Next, by the operations shown in FIGS. 1(d) to (g), the wire 1 is stretched between the first bond point 5 and the second bond point 6 to form a wire loop. 6
Between Figure C and 1, in other words, between Figure 1 (61~.(f)), Yuko Air 8's balloon begins.Then, Figure 1 (g)
When the capillary 3 starts grounding or bonding to the second bond point 6 as shown in FIG. 6, the air blowout is turned off as shown in FIG. 6g. As mentioned above, the flow rate of the air 8 should be increased to a certain extent so that the ball 1a does not shift its center relative to the capillary 3, but in the present invention, the flow rate of the air 8 is increased to a certain extent from the first bond point 5 to the second bond point 6.
Since the air 8 is blown out in a part between bonding, even if the flow rate of the air 8 is large, the wire loop does not become low, and an appropriate wire loop is formed. Here, the timing of blowing out the air 8 needs to be set at an appropriate timing between FIG. 1(d) and FIG. 1(f) in relation to the air flow rate.

以上の説明から明らかな如く、エアーの吹き出し流量が
ある程度多くしてキャピラリより延出したワイヤ部分を
引き戻すので、ポールがキャピラリの中心に引き付けら
れてキャピラリに密着する。As is clear from the above explanation, the wire portion extending from the capillary is pulled back by increasing the flow rate of air to some extent, so that the pole is attracted to the center of the capillary and comes into close contact with the capillary.

このため、第１ボンド点におけるワイヤの圧着不良は防
止され、良好なボンディングが得られる。Therefore, poor crimping of the wire at the first bonding point is prevented, and good bonding can be achieved.

また第１ボンド点から第２ボンド点にキャピラリが移動
する間の一部においてエアーを吹き出すので、エアー流
量がある＠度多くても適切なワイヤループが形成される
。Furthermore, since air is blown out during a portion of the movement of the capillary from the first bond point to the second bond point, an appropriate wire loop can be formed even if the air flow rate is large.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）〜（ｊ）はワイヤボンディング動作説明図
、第２図はポールの状態を示し、（ａ）はポールがキヤ
、　ピラリの中心に位置している状態図、（ｂ）はポー
ルがキャピラリに対して中心ずれしている状態図、第３
図は従来のワイヤボンディング方法を示す説明図、第４
図は本発明にな名ワイヤボンディング装置の一実施例を
示す正量図、第５図は第４図のカム部分の平面図、第６
図は本発明に”なるエアー吹き付はタイミングの一実施
例を示すタイミング図である。 １・・・ワイヤ、　　　　　　　１ａ・・・ポール、３
・・・キャピラリ、　　　　５・・・＠１ボンド点、６
・・・第２ボンド点、　　　　７・・・エアーノズル、
８・・・エアー、　　　　　　１２・・・カム軸、１４
・・・ボンディングカム、　１６・・・バルブ開閉カム
、２１・・・エアーバルブ、３２・・・パイプ、３３・
・・スプール。 第１図 、第２図 （０）Figures 1 (a) to (j) are explanatory diagrams of wire bonding operations, Figure 2 shows the state of the pole, (a) is a state diagram where the pole is located at the center of the carrier and pillar, and (b) is a diagram showing the state of the pole. State diagram where the pole is off center with respect to the capillary, 3rd
The figure is an explanatory diagram showing the conventional wire bonding method.
The figure is a weight diagram showing one embodiment of the wire bonding apparatus according to the present invention, FIG. 5 is a plan view of the cam portion of FIG. 4, and FIG.
The figure is a timing diagram showing an example of the air blowing timing according to the present invention. 1...Wire, 1a...Pole, 3
...Capillary, 5...@1 bond point, 6
...Second bond point, 7...Air nozzle,
8...Air, 12...Camshaft, 14
...Bonding cam, 16...Valve opening/closing cam, 21...Air valve, 32...Pipe, 33...
··spool. Figure 1, Figure 2 (0)

Claims (2)

【特許請求の範囲】[Claims] （１）　　ワイヤの巻回されたスプールとこのスプール
より繰り出されたワイヤの挿通されたキャピラリ間に設
けられたエアーノズルでワイヤにエアーを吹き付けてバ
ックテンションを与え、第１ボンド点と第２ボンド点間
をキャピラリに挿通したワイヤで接続するワイヤボンデ
ィング装置において、前記キャピラリを上下動させるボ
ンディングカムが堆付けられたカム軸にバルブ開閉カム
を固定し、このバルブ開閉カムに対応してエアーバルブ
ｔ［け、このエアーバルブを前記エアーノズルに接続し
たことを特徴とするワイヤボンディング装置。(1) An air nozzle installed between a spool on which the wire is wound and a capillary through which the wire fed out from the spool is inserted blows air onto the wire to give back tension, thereby bonding the first bond point and the second bond point. In a wire bonding device that connects points with a wire inserted through a capillary, a valve opening/closing cam is fixed to a camshaft on which a bonding cam for moving the capillary up and down is mounted, and an air valve t is connected in correspondence with this valve opening/closing cam. [a wire bonding device characterized in that this air valve is connected to the air nozzle. （２）ワイヤの巻回されたスプールとこのスプールより
繰り出されたワイヤの挿通されたキャピラリ間に設けら
れたエアーノズルでワイヤにエアーを吹き付けてバック
テンションを与え、第１ボンド点と第２ボンド点間をキ
ャピラリに挿通したワイヤで接続するワイヤボンディン
グ方法において、ワイヤにボール形成後、キャピラリが
第１ボンド点に下降する間にワイヤにエアーを吹き付け
ると共ｌこ、第１ボンド点にワイヤボンディングし、第
１ボンド点かられずかにキャピラリが上昇してからキャ
ピラリが第２ボンド点に接地する動作量の一部において
ワイヤにエアーを吹き付けることを特徴とするワイヤボ
ンディング方法。(2) Air is blown onto the wire using an air nozzle installed between the spool around which the wire is wound and the capillary through which the wire fed out from the spool is inserted, giving back tension to the first bond point and the second bond point. In the wire bonding method in which points are connected by a wire inserted into a capillary, after forming a ball on the wire, air is blown onto the wire while the capillary is lowered to the first bond point, and wire bonding is performed at the first bond point. A wire bonding method characterized in that the capillary rises slowly from the first bond point and then air is blown onto the wire during a portion of the movement in which the capillary touches the second bond point.
JP56177736A 1981-11-05 1981-11-05 Device for wire bonding and method therefor Granted JPS5879727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56177736A JPS5879727A (en) 1981-11-05 1981-11-05 Device for wire bonding and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56177736A JPS5879727A (en) 1981-11-05 1981-11-05 Device for wire bonding and method therefor

Publications (2)

Publication Number Publication Date
JPS5879727A true JPS5879727A (en) 1983-05-13
JPS6352778B2 JPS6352778B2 (en) 1988-10-20

Family

ID=16036219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177736A Granted JPS5879727A (en) 1981-11-05 1981-11-05 Device for wire bonding and method therefor

Country Status (1)

Country Link
JP (1) JPS5879727A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02213146A (en) * 1989-02-13 1990-08-24 Hitachi Ltd Wire-bonding method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02213146A (en) * 1989-02-13 1990-08-24 Hitachi Ltd Wire-bonding method and device

Also Published As

Publication number Publication date
JPS6352778B2 (en) 1988-10-20

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