JPS5874352U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS5874352U JPS5874352U JP1981170172U JP17017281U JPS5874352U JP S5874352 U JPS5874352 U JP S5874352U JP 1981170172 U JP1981170172 U JP 1981170172U JP 17017281 U JP17017281 U JP 17017281U JP S5874352 U JPS5874352 U JP S5874352U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- view
- accommodated
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のテープキャリヤー用回路基板の一例を示
す要部平面図、第2図はその断面図、第3図は本考案の
一実施例を示す要部平面図、第4図はその要部断面図、
第5図は本考案の他の実施例を示す要部平面図、第6図
は本考案のさらに他め実施例を示す要部平面図。、
11・・・・・・回路基板、12・・・・・・デバイス
、13・・・ −・・・フィンガー、14・・・・
・・IC,15・・・・・・バンブ、18・・・・・・
切り欠き。Fig. 1 is a plan view of a main part showing an example of a conventional circuit board for a tape carrier, Fig. 2 is a sectional view thereof, Fig. 3 is a plan view of a main part showing an embodiment of the present invention, and Fig. 4 is a plan view of the main part. Main part sectional view,
FIG. 5 is a plan view of main parts showing another embodiment of the present invention, and FIG. 6 is a plan view of main parts showing still another embodiment of the invention. , 11... Circuit board, 12... Device, 13... -... Finger, 14...
・・IC, 15・・・・・・Banbu, 18・・・・・・
Notch.
Claims (1)
たチーブキャリヤー用回路基板に於いてiCチップの収
まるデバイス孔周辺に複数の切り欠きを設けたことを特
徴とする回路基板。1. A circuit board for a chip carrier having metal wiring selectively formed on a flexible film, the circuit board having a plurality of cutouts around a device hole in which an iC chip is accommodated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981170172U JPS5874352U (en) | 1981-11-13 | 1981-11-13 | circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981170172U JPS5874352U (en) | 1981-11-13 | 1981-11-13 | circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5874352U true JPS5874352U (en) | 1983-05-19 |
Family
ID=29962136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981170172U Pending JPS5874352U (en) | 1981-11-13 | 1981-11-13 | circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5874352U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55125637A (en) * | 1979-03-20 | 1980-09-27 | Fujitsu Ltd | Production of semiconductor device |
-
1981
- 1981-11-13 JP JP1981170172U patent/JPS5874352U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55125637A (en) * | 1979-03-20 | 1980-09-27 | Fujitsu Ltd | Production of semiconductor device |
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