JPS59115641U - Circuit board mold flow prevention structure - Google Patents
Circuit board mold flow prevention structureInfo
- Publication number
- JPS59115641U JPS59115641U JP1983009214U JP921483U JPS59115641U JP S59115641 U JPS59115641 U JP S59115641U JP 1983009214 U JP1983009214 U JP 1983009214U JP 921483 U JP921483 U JP 921483U JP S59115641 U JPS59115641 U JP S59115641U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- prevention structure
- flow prevention
- mold flow
- board mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の実施例を示す平面図、第2図は第1の
断面図である。
1・・・・・・ICチップ、2.3・・・・・・レジス
ト、4゜4′・・・・・・基板面゛、7・・・・・・モ
ールド、6・・・・・・回路基板。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a first sectional view. 1...IC chip, 2.3...Resist, 4゜4'...Substrate surface, 7...Mold, 6...・Circuit board.
Claims (1)
外周に、複数のレジスト壁を設けた事を特徴とする、回
路基板のモールド流れ防止構造。A mold flow prevention structure for a circuit board, characterized in that a plurality of resist walls are provided around the outer periphery of the IC chip in the circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983009214U JPS59115641U (en) | 1983-01-26 | 1983-01-26 | Circuit board mold flow prevention structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983009214U JPS59115641U (en) | 1983-01-26 | 1983-01-26 | Circuit board mold flow prevention structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59115641U true JPS59115641U (en) | 1984-08-04 |
Family
ID=30140682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983009214U Pending JPS59115641U (en) | 1983-01-26 | 1983-01-26 | Circuit board mold flow prevention structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59115641U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01114494A (en) * | 1987-10-29 | 1989-05-08 | Dainippon Printing Co Ltd | Ic card and ic module for ic card |
-
1983
- 1983-01-26 JP JP1983009214U patent/JPS59115641U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01114494A (en) * | 1987-10-29 | 1989-05-08 | Dainippon Printing Co Ltd | Ic card and ic module for ic card |
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