JPS5874344U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5874344U JPS5874344U JP17038181U JP17038181U JPS5874344U JP S5874344 U JPS5874344 U JP S5874344U JP 17038181 U JP17038181 U JP 17038181U JP 17038181 U JP17038181 U JP 17038181U JP S5874344 U JPS5874344 U JP S5874344U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- wiring board
- semiconductor device
- printed wiring
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置を印刷配線基板に実装した側
面図、第２図乃至第７図は本考案の実施例による半導体
装置を示し、特に第２図ｂ１第４図ａおよび警６図ａは
各実施例における半導体装置を印刷配線基板に実装した
側面図、第２図ｂ１第３図、第４図ｂ１第５図、第６図
すおよび第７図は各実施例の裏面図を示す。
１・・・・・・半導体装置、２・・・・・・接続端子、
３・・・・・・半田、４・・・・・・印刷配線基板、５
・・・・・・接着剤、６・・・・・パ 印刷配線基板の
印刷配線面、７・・・・・・接着剤を吸収するための溝
、訃・・・・・接着剤を吸収するための段差、９・・・
・・・接着剤が流れ出ないようにする段差。Fig. 1 is a side view of a conventional semiconductor device mounted on a printed wiring board, and Figs. 2 to 7 show semiconductor devices according to embodiments of the present invention, particularly Fig. 2b, Fig. 4a, and Fig. 6. a is a side view of the semiconductor device in each embodiment mounted on a printed wiring board; FIG. 2 b1 FIG. 3, FIG. 4 b1 FIG. show. 1... Semiconductor device, 2... Connection terminal,
3...Solder, 4...Printed wiring board, 5
...Adhesive, 6...P Printed wiring surface of printed wiring board, 7...Groove for absorbing adhesive, butt...Absorbing adhesive 9 steps to...
...A step that prevents adhesive from flowing out.
Claims (1)
徴とする半導体装置。A semiconductor device characterized in that a groove or a step is provided on a surface that is in close contact with a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17038181U JPS5874344U (en) | 1981-11-16 | 1981-11-16 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17038181U JPS5874344U (en) | 1981-11-16 | 1981-11-16 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5874344U true JPS5874344U (en) | 1983-05-19 |
Family
ID=29962341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17038181U Pending JPS5874344U (en) | 1981-11-16 | 1981-11-16 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874344U (en) |
-
1981
- 1981-11-16 JP JP17038181U patent/JPS5874344U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5874344U (en) | semiconductor equipment | |
| JPS5844871U (en) | wiring board | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS5939971U (en) | Printed board | |
| JPS6094861U (en) | printed circuit device | |
| JPS5858327U (en) | chip parts | |
| JPS5918495U (en) | circuit board equipment | |
| JPS59192870U (en) | printed circuit board equipment | |
| JPS5931266U (en) | Connection terminal of printed wiring board | |
| JPS58175668U (en) | printed wiring board | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS5840866U (en) | Mounting structure of circuit components | |
| JPS5840868U (en) | printed wiring board | |
| JPS5972706U (en) | Positioning structure of chip parts and board | |
| JPS5872845U (en) | semiconductor equipment | |
| JPS5958947U (en) | Semiconductor element mounting equipment | |
| JPS5936257U (en) | heat dissipation device | |
| JPS5874329U (en) | chip electronic components | |
| JPS5939930U (en) | Semiconductor device assembly board | |
| JPS58191637U (en) | Internal connection terminals for semiconductor devices | |
| JPS6011467U (en) | Printed board | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS5812953U (en) | semiconductor equipment | |
| JPS5936232U (en) | Electrical component | |
| JPS6094862U (en) | printed circuit device |