JPS587322A - Sealing method of resin and metallic mold therefor - Google Patents
Sealing method of resin and metallic mold thereforInfo
- Publication number
- JPS587322A JPS587322A JP10524681A JP10524681A JPS587322A JP S587322 A JPS587322 A JP S587322A JP 10524681 A JP10524681 A JP 10524681A JP 10524681 A JP10524681 A JP 10524681A JP S587322 A JPS587322 A JP S587322A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- lead frame
- heat sink
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
- B29C33/0044—Moulds or cores; Details thereof or accessories therefor with sealing means or the like for sealing off parts of inserts projecting into the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、樹脂封入成形方法とその金型装置の改良に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a resin encapsulation molding method and a mold device thereof.
ところで、電力用集積回路等の半導体チップを取り付け
た放熱板付リードフレームの樹脂封入酸、形を行なう場
合は、回路に発生する熱を外部へ有効に放熱させる目的
で、放熱板の表面部を成形品の外面に露出させる必要が
ある、）
本願発明者＋４！＋は、先に、上記樹脂封入成形時にお
いて、キャピテイ内に加圧注入される溶融樹脂が放熱板
の露出面側となる表面部に附着するのを可及的に防止し
て長幼な放熱効巣を奏し得るように、キャピテイの底面
に、放熱板の上記表面部の周縁形状に沿って、これより
も若干狭小となるような凹所を形成２し、上型及び下型
にょる型締時において、放熱板表面部の周縁がキャビテ
ィの上記凹所における周縁に圧接されるように構成し、
放熱板と凹所との側周縁間に加えられる圧接力を１用し
て、キャビティ内に加圧注入される溶融樹脂が上記凹所
内に侵入するのを阻止することにより、上記表面部側に
対する樹脂の耐着防止を図るようにした方法を提供した
（特公昭５６−２２３７２号）。By the way, when molding a lead frame with a heat sink attached to a semiconductor chip such as a power integrated circuit, the surface of the heat sink is molded in order to effectively dissipate the heat generated in the circuit to the outside. (need to be exposed on the outside of the product) Inventor +4! + means that during the above-mentioned resin encapsulation molding, the molten resin that is pressurized and injected into the cavity is prevented from adhering to the exposed surface of the heat sink as much as possible to achieve a long heat dissipation effect. In order to create a nest, a recess slightly narrower than the above-mentioned surface of the heat dissipation plate is formed on the bottom surface of the cavity 2, and the mold is clamped by the upper and lower molds. At times, the periphery of the heat sink surface portion is configured to be pressed against the periphery of the recess of the cavity,
By using the pressing force applied between the side periphery of the heat sink and the recess to prevent the molten resin that is pressurized and injected into the cavity from entering the recess, A method for preventing resin from adhering was provided (Japanese Patent Publication No. 56-22372).
然して、上記方法によると、放熱板と凹所との側周縁間
に加えられる圧接力のため、キャビティ底面における凹
所内への溶融樹脂の侵入阻止効果が認められるが、その
反面、上記側周縁間には局部的な圧接力が加えられるこ
とになるから、該両局縁部の損耗が激しいこと、並びに
、キャビティ内に加圧注入される溶融樹脂は、放熱板の
大小形状及び材質の強弱によって微差はあるが、通常、
ｌｄ、当たり３５〜１００Ｋｆの注入圧力か加えられる
こと等から、成形品が凹所側へ全体的に彎曲変形されて
、製品（半導体）の品質を著しく低下させるといった弊
害があるのみならず、金型装置におけるキャピテイ部を
損傷し易い等の欠点を有していた。However, according to the above method, because of the pressure applied between the side peripheries of the heat sink and the recess, an effect of preventing the molten resin from entering the recess at the bottom of the cavity is observed, but on the other hand, the pressure applied between the side peripheries of the heat sink and the recess is effective. Since a local pressure force is applied to the radiator plate, there is severe wear and tear on both edges, and the molten resin injected into the cavity under pressure may vary depending on the size and shape of the heat sink and the strength of the material. Although there are slight differences, usually
Since an injection pressure of 35 to 100 Kf is applied per ld, the entire molded product is deformed in a curved manner toward the recess, which not only has the disadvantage of significantly deteriorating the quality of the product (semiconductor), but also This method has disadvantages such as the tendency to damage the capacitance of the molding device.
この発明は、樹脂封入成形時において、キャビティ内に
加圧注入される溶融樹脂か放熱板の露出面側となる表面
部に附着するのを効率良く防止するのみならず、上述し
たような成形品の彎曲変形を防止して製品の品質向上を
図ると共に、キャピテイ部の耐久性向上を図るようにし
た樹脂封入成形方法とその金型装置の改良に関するもの
である。This invention not only efficiently prevents the molten resin pressurized and injected into the cavity from adhering to the exposed surface side of the heat sink during resin encapsulation molding, but also effectively prevents the molten resin from adhering to the exposed surface of the heat sink. The present invention relates to an improvement in a resin encapsulation molding method and a mold device thereof, which improve the quality of the product by preventing the curved deformation of the mold, and also improve the durability of the capacitance part.
以下、本発明金型装置を図に示す実施例に基づいて説明
する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The mold apparatus of the present invention will be described below based on embodiments shown in the drawings.
図において、１ｒｌｉ上型、２は下型で該上下両型の接
合面には通常複数対のキャピテイ３が対設されると共に
、下型２側にはポット側と連通ずるランナー４及び溶融
樹脂Ａの加圧注入用ゲート５が形成されており、６は上
下両型１・２間にセットされた放熱板７を有するリード
フレームである。In the figure, 1rli is an upper mold, 2 is a lower mold, and a plurality of pairs of cavities 3 are usually provided oppositely on the joining surface of both the upper and lower molds, and on the lower mold 2 side, a runner 4 communicating with the pot side and a molten resin A gate 5 for pressurized injection A is formed, and 6 is a lead frame having a heat sink 7 set between the upper and lower molds 1 and 2.
８は下型２のキャピテイ底面３ａＶＣｆＪけられた上記
放熱板７の支受体であり、該支受体の上面はキャビティ
底面３ａと面一となるように形成されている。 ９は上
記支受体８の外周囲に設けられた凹陥部であり、該凹陥
部の周縁９ａは、放熱板の露出面側となる表面部７ａの
周縁形状に沿って、これよりも若干狭小となるように形
成されている。ｌＯは上記凹陥部９の適当個所に数本配
設された成形品突出用のニジ−フタ−ビンである。Reference numeral 8 denotes a support for the heat dissipation plate 7 which is cut out from the cavity bottom surface 3aVCfJ of the lower mold 2, and the upper surface of the support is formed to be flush with the cavity bottom surface 3a. Reference numeral 9 denotes a concave portion provided around the outer periphery of the support body 8, and the circumferential edge 9a of the concave portion is slightly narrower than this along the circumferential edge shape of the surface portion 7a that is the exposed surface side of the heat sink. It is formed so that 1O are several rainbow-lid bins arranged at appropriate locations in the recessed portion 9 for ejecting the molded product.
、なお、上記支受体８Ｖｉ、第１図乃至第３図に示すよ
うに、適当な大きさ及び形状として一個配設されておれ
ばよいが、第４図に示すように、複数個配設しても差支
えなく、また、上記ニジ−フタ、−ビン１０′は、第３
図に示すように、支受体８内に連通開孔した上下方向の
貫通孔内に嵌装させるようにしてもよい。 更に、上記
支受体８の上面はキャピテイ底面と面一に設げられてお
ればよいから、従来のキャビティ底面部を、第１図乃至
第４図に示すように、支受体８に相当する部分を残して
切削加工することによって、夫々の凹陥部９を設けるよ
うにしてもよく、また、支受体８を別素材等によって別
体に形成すると共に、これを凹所内にボルト等にて止着
する構成を採用してもよい。As shown in FIGS. 1 to 3, one support body 8Vi of an appropriate size and shape may be disposed, but as shown in FIG. Also, the above-mentioned rainbow lid and bottle 10' may be
As shown in the figure, the support member 8 may be fitted into a vertical through-hole that is opened in communication with the support member 8 . Furthermore, since the upper surface of the support body 8 only needs to be provided flush with the bottom surface of the cavity, the bottom surface of the conventional cavity is equivalent to the support body 8, as shown in FIGS. 1 to 4. The recessed portions 9 may be provided by machining, leaving only the portions where the support 8 is formed.Alternatively, the support body 8 may be formed separately from a different material, and this may be inserted into the recess with a bolt or the like. It is also possible to adopt a structure in which it is fixed by holding it in place.
また、第１図乃至第４図に示す各実施例は、支受体８を
その上面がキャビティ底面と面一となる状態で固定的に
設けたものであるが、このような専用の支受体８に換え
て、例えば、第５図乃至オ８図に示すように、キャピテ
イ底面３ａに、放熱板の前記表面部７ａの周縁形状に沿
って、これよりも若干狭小となるような単なる凹陥部９
Ｉを形成すると共に、該凹陥部の略中央位置に稍大径と
されたニジ−フタ−ビン１０’を嵌装配設し、且つ、該
ピンの上端面を、型締時若しくは溶融樹脂Ａの加圧注入
時に先立ってキャピテイ底面３ａと面一となる位置へ突
設可能に配設することにより、前記支受体８を兼用し得
る構成を採用してもよい。Furthermore, in each of the embodiments shown in FIGS. 1 to 4, the support body 8 is fixedly provided so that its upper surface is flush with the bottom surface of the cavity. Instead of the body 8, for example, as shown in Figs. Part 9
A rainbow-lid pin 10' having a slightly larger diameter is fitted and arranged approximately in the center of the concave portion, and the upper end surface of the pin is held at the time of mold clamping or when exposed to molten resin A. A configuration may be adopted in which the support body 8 can also be used by disposing it so as to protrude to a position flush with the cavity bottom surface 3a prior to pressurized injection.
なお、上記ニジ−フタ−ビン１０’は、第５図乃至２６
図に示すように、稍大径に形成されたものが一本設けら
れておればよいが、オフ図に示すように、これを複数本
として配設するようにしてもよい。 また、支受体８を
兼ねるニジ−フタ−ビン１０「の上端部に、第８図に示
すように、上端部側が小、径とされた段部１１を形成し
てお叶ば、仮りに、上記凹陥部９°内に溶融樹脂Ａが侵
入した場合においても、該段部によって侵入樹脂の積極
的な以下、本発明金型装置による樹脂封入成形作用を説
明する。In addition, the above-mentioned Niji-lid bin 10' is shown in FIGS. 5 to 26.
As shown in the figure, it suffices to have one piece formed with a slightly larger diameter, but as shown in the off-line view, a plurality of pieces may be provided. In addition, if a step 11 is formed at the upper end of the rainbow-lid bin 10, which also serves as the support 8, as shown in FIG. Even when the molten resin A invades into the recessed portion 9°, the resin encapsulation molding action by the mold apparatus of the present invention will be described below.
キャピテイ３内への溶融樹脂Ａの加圧注入は、リードフ
レーム６を上下両型１・２間にセットすると共に、該両
型による型締後に行なわれるのであるか、との型締時に
おいて、リードフレーム６の放熱板における前記表面部
７ａの周縁と凹陥部９・９°の周縁９ａとは圧接される
から、該周縁間より凹陥部９・９曾内への溶融樹脂Ａの
侵入が阻止されることになる。Pressurized injection of molten resin A into the cavity 3 is carried out after the lead frame 6 is set between the upper and lower molds 1 and 2 and after the molds are clamped by the molds. Since the periphery of the surface portion 7a of the heat sink of the lead frame 6 and the periphery 9a of the recessed portions 9 and 9° are pressed together, the molten resin A is prevented from entering between the peripheries and into the recessed portions 9 and 9. will be done.
然して、このとき放熱板の前記表面部７ａは支受体８の
上面（又は、エジェクタービン１０’の上端面）によっ
て、恰も、従来のキャピテイ底面部が存在するかのよう
に支受されることとなるため、両局縁間の上記圧接力が
若干弱められるが、溶融樹脂Ａの上記表面部７ａ側への
侵入阻止作用を損なうようなことはない。However, at this time, the surface portion 7a of the heat sink is supported by the upper surface of the support body 8 (or the upper end surface of the ejector turbine 10') as if a conventional cavity bottom surface portion existed. Therefore, although the pressing force between the two edges is slightly weakened, the effect of preventing the molten resin A from entering the surface portion 7a side is not impaired.
また、仮りに、リードフレーム６側が彎曲変形し、上記
側周縁に生じた間隙から樹脂Ａが凹陥部１９・９Ｉ内に
侵入したとしても、その侵入樹脂は該凹陥部の下方に順
次流れ込むことになり、また、上記侵入樹脂量は実際に
は極めて僅少であること等から、結局、該侵入樹脂が上
記表面部７ａ側の全面にわたって附着するのを効率良く
防止し得るのである。Furthermore, even if the lead frame 6 side is deformed in a curved manner and the resin A enters into the recesses 19 and 9I through the gap created at the side periphery, the intruding resin will sequentially flow below the recesses. Furthermore, since the amount of the intruding resin is actually extremely small, it is possible to effectively prevent the intruding resin from adhering to the entire surface of the surface portion 7a.
また、キャピテイ底面３ａＫ設けた支受体８（１０’）
によって、放熱板７が、前述した先の出願のもの □の
ように、該支受体側へ彎曲変形されるのを確実に防止し
得るから、製品（半導体）の品質低下を防止し得ると共
に、前記両局縁間に間隙が生ずることがなく、従って、
このことが凹陥部９・９曾内への樹脂侵入を確実に阻止
するよう一作用することとなるのである。In addition, the support body 8 (10') provided with the bottom surface 3aK of the capity
As a result, it is possible to reliably prevent the heat dissipation plate 7 from being curved and deformed toward the support body as shown in the above-mentioned earlier patent application, thereby preventing the quality of the product (semiconductor) from deteriorating. , there is no gap between the two edges, and therefore,
This serves to reliably prevent resin from entering into the recesses 9, 9.
以上、要するに、本発明は、放熱板付リードフレームを
上型と下型との間に設けられるキャビティに対してセッ
トするに際して、リードフレームの放熱板における露出
面側となる表面部の周縁を、上記キャビティ底面におい
て、上記表面部の周縁よりも若干狭小となる状態として
形成した凹陥部の周縁に一層させると共に、上記表面部
をキャビティ底面と面一となるような支受体の上面部に
て支受させるようにして樹脂封入成形する方法と、この
方法を実施するため、上型と下型との間に設けられるキ
ャビティの底面に、リードフレームの放熱板における露
出面側となる表面部の周縁形状に沿って、これよりも若
干狭小となるような周縁を有する凹陥部を形成すると共
に、該凹陥部内には放熱板の上記表面部をキャビティ底
面と面一となる位置にて支受可能な支受体を配設した樹
脂封入成形用金型装置に係るものであり、このような本
発明によれば、リードフレームの放熱板における露出面
側となる表面部の全面に溶融樹脂が附着するのをより一
層確実に防止することができるのであり、特に、上記し
た溶融樹脂の耐着防止を目的として形成したキャピテイ
底面の凹陥部内に支受体（又は、廃用エジークタービン
）を配設したことによって、リードフレーム側がその材
質の強弱にかかわらず上記凹陥部側へ彎曲変形すること
がないため、前述した先の出塵に有した弊害を完全に除
去し得るのみならず、製品の品質向上と金型装置におけ
るキャビティ部の耐久性を向上することができるといっ
た優れた効果を奏するものである。In summary, the present invention, when setting a lead frame with a heat dissipation plate in a cavity provided between an upper die and a lower die, sets the periphery of the surface portion of the heat dissipation plate of the lead frame on the exposed surface side as described above. At the bottom of the cavity, the periphery of the concave portion is formed to be slightly narrower than the periphery of the surface portion, and the surface portion is supported by the upper surface portion of the support body flush with the bottom surface of the cavity. In order to carry out this method, the periphery of the exposed surface side of the heat sink of the lead frame is placed on the bottom of the cavity provided between the upper mold and the lower mold. A recessed portion having a peripheral edge slightly narrower than this is formed along the shape, and the surface portion of the heat sink can be supported within the recessed portion at a position flush with the bottom surface of the cavity. This invention relates to a mold device for resin-filled molding in which a support is provided, and according to the present invention, molten resin adheres to the entire surface of the exposed surface side of the heat sink of the lead frame. This can be prevented even more reliably, and in particular, by arranging the support (or waste eject turbine) in the concave part of the bottom of the cavity formed for the purpose of preventing the above-mentioned molten resin from adhering. As a result, the lead frame side will not be bent toward the recessed portion regardless of the strength of the material, which not only completely eliminates the problem caused by the above-mentioned dust generation, but also improves the quality of the product. This has the excellent effect of improving the durability of the cavity portion of the mold device.
図はいずれも本発明金型装置の実施例を示すもので、第
１図は上下両型による型締時におけるキャピテイ部の断
面図、第２図はその下型キャピテイ底面の要部平面図、
第３図及び第４図は第１図の下型キャピテイの他の実施
例を示す要部平面図、第５図は第１図の支受体の他の実
施例を示すキャピテイ部の断面図、第６図はその下型キ
ャピテイ底面の要部平面図、オフ図は第５図の下型キャ
ピテイの他の実施例を示す要部平面図、第８図は第５図
の支受体兼用ニジ−フタ−ビンの他の実施例を示すキャ
ピテイ韻断面図である。
１・・・上型、 ２・・・下型、 ３・曽・キャビテ
ィ、 ３ａ・・・キャビティ底面、６・譬・リード
フレーム、 ７・、・放熱板、７ａ・・・表面部、
８・・・支受体、９・９Ｌ ・拳・凹陥部、９ａ・・
・凹埴部の周縁、１０′・・争支受体兼用エジークター
ビン。
特許出願人 坂 東 −雄The drawings all show an embodiment of the mold apparatus of the present invention, in which Fig. 1 is a sectional view of the cavity part when the upper and lower molds are clamping, Fig. 2 is a plan view of the main part of the bottom of the lower mold cavity,
3 and 4 are plan views of essential parts showing other embodiments of the lower die capitivity shown in FIG. 1, and FIG. 5 is a sectional view of the capitivity part showing another embodiment of the support body shown in FIG. 1. , Fig. 6 is a plan view of the main part of the bottom of the lower mold cavity, the off view is a plan view of the main part showing another embodiment of the lower mold capitium shown in Fig. 5, and Fig. 8 is also used as the support of Fig. 5. FIG. 6 is a cross-sectional view showing another embodiment of the nitrogen lid turbine. DESCRIPTION OF SYMBOLS 1... Upper die, 2... Lower die, 3... Cavity, 3a... Cavity bottom, 6... Lead frame, 7... Heat sink, 7a... Surface part,
8...Support body, 9.9L, fist/recessed part, 9a...
・Periphery of the concave part, 10'... Ejiku turbine that also serves as a support and receiver. Patent applicant: Higashi Ban
Claims (4)
９けられるキャビティに対してセットするに際して、リ
ードフレームの放熱板における露出面側となる表面部の
周縁を、上記キャピテイ底面において、上記表面部の周
縁よりも若干狭小となる状態として形成した凹陥部の周
縁に接当させると共に、上記表面部をキャピテイ底面と
面一となるような支受体の上面部にて支受させるように
セラ“）して成形することを特徴とする樹脂封入成形方
法。(1) Place the lead frame with a heat sink between the upper mold and the lower mold.
9. When setting the lead frame into a cavity, the periphery of the exposed surface of the heat sink of the lead frame is slightly narrower than the periphery of the surface on the bottom of the cavity. A method of resin encapsulation molding, characterized in that the above-mentioned surface portion is supported by the upper surface portion of the support body flush with the bottom surface of the cavity. .
に、リードフレームの放熱板における露出面側となる表
面部の周縁形状に沿って、これよりも若干狭小となるよ
うな周縁を有する凹陥部を形成すると共に、該凹陥部内
には放熱板の上記表面部をキャピテイ底面と面一となる
位置にて支受可能な支受体を配設したことを特徴とする
樹脂封入成形用金型装置。(2) On the bottom of the cavity provided between the upper mold and the lower mold, form a peripheral edge that is slightly narrower than the peripheral edge shape of the exposed surface side of the heat sink of the lead frame. A method for resin encapsulation molding, characterized in that a recessed portion is formed, and a support body capable of supporting the surface portion of the heat dissipation plate flush with the bottom surface of the cavity is disposed within the recessed portion. Mold equipment.
したことを特徴とする特許請求の範囲オ（２）項記載の
樹脂封入成形用金型装置。(3) A mold device for resin-filled molding according to claim (2), characterized in that a support for the surface portion of the heat sink is fixedly disposed within the recessed portion.
クタービンを放熱板表面部の支受体として兼用したこと
を特徴とする特許請求の範囲オ（２）項記載の樹脂封入
成形用金型装置。(4) For resin encapsulation molding according to claim (2), characterized in that the ejector turbine for ejecting the resin molded product disposed in the recess also serves as a support for the surface portion of the heat sink. Mold equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10524681A JPS587322A (en) | 1981-07-06 | 1981-07-06 | Sealing method of resin and metallic mold therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10524681A JPS587322A (en) | 1981-07-06 | 1981-07-06 | Sealing method of resin and metallic mold therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS587322A true JPS587322A (en) | 1983-01-17 |
| JPS622456B2 JPS622456B2 (en) | 1987-01-20 |
Family
ID=14402284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10524681A Granted JPS587322A (en) | 1981-07-06 | 1981-07-06 | Sealing method of resin and metallic mold therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587322A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038001A (en) * | 1983-08-09 | 1985-02-27 | Nippon Zeon Co Ltd | Controlling method of distillation tower |
| US4641418A (en) * | 1982-08-30 | 1987-02-10 | International Rectifier Corporation | Molding process for semiconductor devices and lead frame structure therefor |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
| US5035594A (en) * | 1989-08-11 | 1991-07-30 | Toyo Seikan Kaisha, Ltd. | Compression molding apparatus |
| US5091341A (en) * | 1989-05-22 | 1992-02-25 | Kabushiki Kaisha Toshiba | Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member |
| US5441684A (en) * | 1993-09-24 | 1995-08-15 | Vlsi Technology, Inc. | Method of forming molded plastic packages with integrated heat sinks |
| JP2009140951A (en) * | 2007-12-03 | 2009-06-25 | Denso Corp | Method of manufacturing electronic apparatus |
| JP2014143240A (en) * | 2013-01-22 | 2014-08-07 | Shindengen Electric Mfg Co Ltd | Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device |
| JP2015173170A (en) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | Resin encapsulation mold and semiconductor device manufacturing method using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5791246U (en) * | 1980-11-26 | 1982-06-04 |
-
1981
- 1981-07-06 JP JP10524681A patent/JPS587322A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5791246U (en) * | 1980-11-26 | 1982-06-04 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4641418A (en) * | 1982-08-30 | 1987-02-10 | International Rectifier Corporation | Molding process for semiconductor devices and lead frame structure therefor |
| JPS6038001A (en) * | 1983-08-09 | 1985-02-27 | Nippon Zeon Co Ltd | Controlling method of distillation tower |
| JPH0567321B2 (en) * | 1983-08-09 | 1993-09-24 | Nippon Zeon Co | |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
| US5091341A (en) * | 1989-05-22 | 1992-02-25 | Kabushiki Kaisha Toshiba | Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member |
| US5035594A (en) * | 1989-08-11 | 1991-07-30 | Toyo Seikan Kaisha, Ltd. | Compression molding apparatus |
| US5441684A (en) * | 1993-09-24 | 1995-08-15 | Vlsi Technology, Inc. | Method of forming molded plastic packages with integrated heat sinks |
| JP2009140951A (en) * | 2007-12-03 | 2009-06-25 | Denso Corp | Method of manufacturing electronic apparatus |
| JP2014143240A (en) * | 2013-01-22 | 2014-08-07 | Shindengen Electric Mfg Co Ltd | Mold, method of manufacturing resin sealed type semiconductor device using the same, and resin sealed type semiconductor device |
| JP2015173170A (en) * | 2014-03-11 | 2015-10-01 | セイコーインスツル株式会社 | Resin encapsulation mold and semiconductor device manufacturing method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS622456B2 (en) | 1987-01-20 |
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