JPS5866388A - Both-side printed board - Google Patents
Both-side printed boardInfo
- Publication number
- JPS5866388A JPS5866388A JP16517881A JP16517881A JPS5866388A JP S5866388 A JPS5866388 A JP S5866388A JP 16517881 A JP16517881 A JP 16517881A JP 16517881 A JP16517881 A JP 16517881A JP S5866388 A JPS5866388 A JP S5866388A
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- copper foil
- solder
- hole
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は両面プリント基板に関するもので、表裏各面に
おける銅箔部の電電的接続が確実に行えるようにしたも
のである０
従来、両面プリント基板ＶＣ′ｓ？いて上面銅箔部と下
面鋼箔部を電気的に接続する場合、第１図ａ。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a double-sided printed circuit board, which enables reliable electrical connections between copper foil portions on each of the front and back surfaces. When electrically connecting the upper surface copper foil portion and the lower surface steel foil portion, the method shown in FIG. 1a.
ｂ［示すように絶縁基板１および上、下面銅箔部２．３
を貫通するように貫通孔を設け、前記絶縁基板１に上、
下面銅箔部２，３を加えた厚みより高さの高い第２図に
示す半田付は可能な金属性円筒体４を設け、この円筒体
４を前記貫通孔に、両端が銅箔部２．３より外側に突出
するように圧入し、この状態で上面銅箔部２と金属性円
筒体４、下面鋼箔部３と金属性円筒体４を２のおの半田
６にて接続固定して上面鋼箔部２と下面銅箔部３とを電
気的に接続していた。ここで、円筒体４は第１図すに示
すように円筒体４に弾性を付与するために軸方向にスリ
ット６を設け、このスリット６を利用して貫通孔に圧入
するようにしている。b [Insulating substrate 1 and upper and lower copper foil parts 2.3 as shown]
A through hole is provided so as to pass through the insulating substrate 1, and
A metal cylindrical body 4, which can be soldered, shown in FIG. .3, and in this state, connect and fix the top copper foil part 2 and the metallic cylindrical body 4, and the bottom steel foil part 3 and the metallic cylindrical body 4 with solder 6. The upper steel foil portion 2 and the lower copper foil portion 3 were electrically connected. Here, as shown in FIG. 1, the cylindrical body 4 is provided with a slit 6 in the axial direction in order to impart elasticity to the cylindrical body 4, and is press-fitted into the through hole using this slit 6.
しかるにこの手段は絶縁基板の上面および下面において
半田付は作業をしなければならず、作業性が悪いもので
あった。However, with this method, soldering must be performed on the upper and lower surfaces of the insulating substrate, resulting in poor workability.
本発明は上記従来の欠点を除去するもので、半田付は可
能な導電性円筒体を用い、この導電性円筒体を、両面に
銅箔部を有するプリント基板に設けた貫通孔に圧入した
状態において少なくとも−端を上面銅箔部より上方に突
出せしめ、かつこの突出した部分に少なくとも切欠き等
により窓を形成し、毛細管現象によシこの円筒体内を上
昇してきた半田を前記窓よりプリント基板の上面銅箔部
上に流出せしめて上面銅箔部上に拡がらせることにより
、この導電性円筒体および半田を通して上。The present invention eliminates the above-mentioned conventional drawbacks, and uses a conductive cylindrical body that can be soldered, and press-fits this conductive cylindrical body into a through hole provided in a printed circuit board having copper foil portions on both sides. At least one end of the cylindrical body is made to protrude upwardly from the upper surface copper foil portion, and a window is formed in this protruding portion by at least a cutout or the like, and the solder that has risen inside the cylindrical body due to capillarity is passed through the window into the printed circuit board. The conductive cylinder and the solder are passed through the conductive cylinder and the solder is allowed to flow out onto the top copper foil section and spread over the top copper foil section.
下面銅箔部の電気的接続が行えるようにしたものである
。This allows electrical connections to be made to the copper foil section on the bottom surface.
以下その一実施例を第２図を用いて説明する。An example of this will be described below with reference to FIG.
第２図において絶縁基板１１および上面銅箔１２下面銅
箔部１３を貫通するように貫通孔１４を設ける点は第１
図と同様である。そして第２図では同図ａに示すように
弾性を付与するためであり、かつ半田を外部に流出させ
るためのスリット１６を軸方向に設けた導電性の円筒体
１６を設ける。The first point in FIG.
It is similar to the figure. In FIG. 2, as shown in FIG. 2a, a conductive cylindrical body 16 is provided which has a slit 16 in the axial direction for imparting elasticity and for allowing solder to flow out.
この円筒体１６を前記貫通孔１４にその弾性を利用して
圧入するが、このとき第２図すに示すようにスリット１
６が依然として残るようにする。そして、ここでは円筒
体１６の中を毛細管現象を利用してディップ半田付は時
の半田を上面銅箔部１２にまで確実に導かなければなら
ないことより、円筒体１６の高さを、絶縁基板１１に上
、下面銅箔部１２ 、１３’（ｚ加えた厚みよりも高い
寸法としている。したがって円筒体１６がスリット１６
のない完全な円筒体であると、同図Ｃのように円筒体１
６０両端が銅箔部１２．１３より突出している状態では
、上面銅箔部１２に半田１７が確実に付着し々くなる。This cylindrical body 16 is press-fitted into the through hole 14 by utilizing its elasticity. At this time, as shown in FIG. 2, the slit 1
6 still remains. Here, the height of the cylindrical body 16 is determined by adjusting the height of the cylindrical body 16, since it is necessary to reliably guide the solder during dip soldering to the upper surface copper foil part 12 using capillary phenomenon inside the cylindrical body 16. 11, upper and lower copper foil parts 12, 13' (thickness is higher than the thickness added by z. Therefore, the cylindrical body 16 is
If it is a perfect cylinder without
In a state where both ends of the solder 60 protrude from the copper foil portion 12.13, the solder 17 will definitely adhere to the upper surface copper foil portion 12.
この点、第２図の構成によれば貫通孔１４に圧入された
円筒体１６に依然としてスリット１６を残しているため
、円筒体１６内を毛細管現象により上昇してまた半田１
７はスリット１６より溢れ出て上面銅箔部１２上に流出
し、さらに拡がり上面銅箔部１２のほぼ全面にわたって
円筒体１６と銅箔部１２とを電気的１機械的に接続する
。このようにして上面銅箔部１２と下面銅箔部１３とを
電気的に接碑することができる。In this regard, according to the configuration shown in FIG. 2, since the slit 16 is still left in the cylindrical body 16 press-fitted into the through hole 14, the solder 1 rises inside the cylindrical body 16 due to capillary action.
7 overflows from the slit 16 and flows onto the upper surface copper foil section 12, and further spreads to electrically and mechanically connect the cylindrical body 16 and the copper foil section 12 over almost the entire surface of the upper surface copper foil section 12. In this way, the upper surface copper foil portion 12 and the lower surface copper foil portion 13 can be electrically connected.
なお、プリント基板の厚さ、半田の粘度にもよるが円筒
体１６の内径は０．８〜１，６１１６程度がよく、スリ
ット１５の巾は０．５ｗＩ＆以上がよい。Although it depends on the thickness of the printed circuit board and the viscosity of the solder, the inner diameter of the cylindrical body 16 is preferably about 0.8 to 1,611 mm, and the width of the slit 15 is preferably 0.5 wI& or more.
第３図に本発明の他の実施例を示す。２の円筒体１６′
はプリント基板１１の上面銅箔部１２より上方に突出す
る部分の一部に半田を上面＃陥部１２に流出させるため
の切欠き１８を設けたものであり、第２図の円筒体１６
と同様の作用効果を果すものである。FIG. 3 shows another embodiment of the invention. 2 cylindrical body 16'
2, a notch 18 is provided in a part of the printed circuit board 11 that protrudes upward from the top surface copper foil portion 12 to allow solder to flow out into the top surface depression 12, and the cylindrical body 16 in FIG.
It achieves the same effect as.
以上実施例より明らかなように本発明によればプリント
基板に設けた貫通孔に圧入された導電性の円筒体の窓よ
り半田が上面銅箔部上に流出するようにしているため、
上面銅箔部と円筒体、ひいては上面銅箔部と下面銅箔部
とを確実に半田付は接続することができる。また、−変
のディップ半田付により上、下面銅箔部を電気的に接続
することが可能であるため作礁性もよいものである。As is clear from the above embodiments, according to the present invention, the solder flows out onto the top copper foil portion from the window of the conductive cylindrical body press-fitted into the through hole provided in the printed circuit board.
The upper surface copper foil portion and the cylindrical body, and furthermore, the upper surface copper foil portion and the lower surface copper foil portion can be reliably connected by soldering. Furthermore, since the upper and lower copper foil parts can be electrically connected by negative dip soldering, reefing properties are also good.
４、図面（Ｄｌｔｔｆｘ説明
第１図ａ、ｂは従来の両面プリント基板およびこれに使
用する円筒体の断面図、斜視図、第２図ａは本発明の一
実施例における両面プリント基板に用いる円筒体の斜視
図、第一２図すは基板に円筒体を圧入したところの平面
図、第２図Ｃは半田付けしたところの断面図、第３図は
本発明の他の実施例における円筒体の斜視図である。4. Drawings (Description of Dlttfx Figures 1a and b are cross-sectional views and perspective views of a conventional double-sided printed circuit board and a cylinder used therein. Figure 2a is a cylinder used in a double-sided printed circuit board according to an embodiment of the present invention. Figure 12 is a plan view of the cylindrical body press-fitted into the board, Figure 2C is a sectional view of the soldered body, and Figure 3 is a cylindrical body in another embodiment of the present invention. FIG.
１１・・・・・・絶縁基板、１２．１３・・・・・・銅
箔部、１４・・・・・・貫通孔、１５・・・・・・スリ
ブ）、１６．１６’・・・・・・円筒体、１７・・・・
・・半田、１日・・・・・・切欠き。11...Insulating substrate, 12.13...Copper foil part, 14...Through hole, 15...Slab), 16.16'... ... Cylindrical body, 17...
...Solder, 1 day...Notch.
Claims (1)
を設け、この絶縁基板に上面、下面銅箔部を加えた厚さ
より高さの高い導電性の円筒体を設け、この円筒体を少
なくとも一端が上記上面銅箔部より上方に突出するよう
に上記貫通孔に圧入し、かつ上記円筒体の少なくとも上
記上面鋼箔部より上方に突出した部分の一部を切欠いて
、この円筒体の中を毛細管現象により上昇してきた半田
を上記上面銅箔部に流出させる窓を形成した両面プリン
ト基板。A through hole is provided in an insulating substrate with copper foil portions formed on the top and bottom surfaces, a conductive cylindrical body with a height higher than the thickness of the top and bottom copper foil portions is provided on the insulating substrate, and this cylindrical body is The cylindrical body is press-fitted into the through hole so that at least one end thereof protrudes upwardly from the upper surface copper foil portion, and a portion of the cylindrical body that protrudes upwardly from at least the upper surface steel foil portion is cut out. A double-sided printed circuit board in which a window is formed to allow the solder that has risen inside due to capillary action to flow out to the upper copper foil section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16517881A JPS5866388A (en) | 1981-10-15 | 1981-10-15 | Both-side printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16517881A JPS5866388A (en) | 1981-10-15 | 1981-10-15 | Both-side printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5866388A true JPS5866388A (en) | 1983-04-20 |
Family
ID=15807328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16517881A Pending JPS5866388A (en) | 1981-10-15 | 1981-10-15 | Both-side printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5866388A (en) |
-
1981
- 1981-10-15 JP JP16517881A patent/JPS5866388A/en active Pending
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