JP2679365B2 - Front and back foil connection parts - Google Patents
Front and back foil connection partsInfo
- Publication number
- JP2679365B2 JP2679365B2 JP2195384A JP19538490A JP2679365B2 JP 2679365 B2 JP2679365 B2 JP 2679365B2 JP 2195384 A JP2195384 A JP 2195384A JP 19538490 A JP19538490 A JP 19538490A JP 2679365 B2 JP2679365 B2 JP 2679365B2
- Authority
- JP
- Japan
- Prior art keywords
- back foil
- double
- insulator
- solder
- sided board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電気回路の両面基板に実装する表裏箔接続部
品に係り、特に絶縁体が半田付けに有効な形をしている
表裏箔接続部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a front / back foil connecting component mounted on a double-sided board of an electric circuit, and more particularly to a front / back foil connecting component in which an insulator is effective for soldering. Is.
従来の技術 両面基板の部品実装方法は、先ず表裏箔接続部品をイ
ンサート機械にて挿入し、半田槽にて表面を半田付けす
る。2. Description of the Related Art In the method of mounting components on a double-sided board, first, front and back foil connection components are inserted by an insert machine and the surfaces are soldered in a solder bath.
以下、その構成について第２図を参照して説明する。
すなわち表裏箔接続部品１は絶縁体部２、導体部3,4か
らなっている。これを図に示すように両面基板５に挿入
する。ここで6a,6bは表面箔、7a,7bは裏面箔である。こ
のように表裏箔接続部品１を挿入した両面基板５の表面
をまず半田槽に浸け、半田付けを行う。この時に表裏箔
接続部品１と両面基板の表面箔6a,6bとが接続される。
次に他電気部品がインサートされた後に両面基板１の裏
面が半田槽にて半田付けされて、電気部品が両面基板に
半田付けされると同時に表裏箔接続部品１と裏面箔7a,7
bが接続される。このようにして表面箔6a,6bと裏面箔7
a,7bとがそれぞれ接続されていた。The configuration will be described below with reference to FIG.
That is, the front and back foil connection component 1 is made up of an insulator portion 2 and conductor portions 3 and 4. This is inserted into the double-sided board 5 as shown in the figure. Here, 6a and 6b are front surface foils, and 7a and 7b are back surface foils. Thus, the surface of the double-sided board 5 in which the front and back foil connection component 1 is inserted is first dipped in a solder bath and soldered. At this time, the front and back foil connection component 1 and the front surface foils 6a, 6b of the double-sided board are connected.
Next, after the other electrical components are inserted, the back surface of the double-sided board 1 is soldered in a solder bath, and the electrical components are soldered to the double-sided board, and at the same time, the front and back foil connecting components 1 and the back surface foils 7a, 7
b is connected. In this way the front foils 6a, 6b and the back foil 7
a and 7b were connected respectively.
発明が解決しようとする課題 このような従来の表裏箔接続部品では、初めに両面基
板５の表面を半田槽にて半田付けする場合、両面基板５
は半田槽内で加熱され、一定の方向に流れる半田と表面
が接する時、表裏箔接続部品１が半田槽内で、両面基板
５の進行方向に並行にインサートされている時は問題な
いが、両面基板５の進行方向に垂直にインサートされて
いる場合、表裏箔接続部品１の絶縁体部２両端の導体部
３と導体部４が半田の流れる性質により絶縁体部２を覆
いながら流れて接続され、本来接続すべきでない箔が接
続されてしまうという課題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In such a conventional front and back foil connecting component, when the surface of the double-sided substrate 5 is first soldered in a solder bath, the double-sided substrate 5
Is heated in the solder bath, and when the front surface and the back foil connecting component 1 are inserted in parallel in the advancing direction of the double-sided board 5 in the solder bath when the surface comes into contact with the solder flowing in a certain direction, When the double-sided board 5 is vertically inserted in the advancing direction, the conductor portions 3 and 4 at both ends of the insulator portion 2 of the front and back foil connection component 1 flow and connect while covering the insulator portion 2 due to the flowing property of solder. However, there is a problem in that foils that should not be originally connected are connected.
本発明はこのような課題を解決するもので、半田が絶
縁体部上をブリッジしてショートすることのない表裏箔
接続部品を提供することを目的とするものである。The present invention solves such a problem, and an object of the present invention is to provide a front and back foil connecting component in which the solder does not bridge over the insulator to cause a short circuit.
課題を解決するための手段 本発明は上記目的を達成するために、表裏箔接続部品
の絶縁体部の太さをその両側にある導体部より太くした
構成による。Means for Solving the Problems In order to achieve the above object, the present invention has a structure in which the thickness of an insulator portion of a front and back foil connecting component is larger than that of conductor portions on both sides thereof.
作 用 本発明は上記の構成により、導体部より太い絶縁体部
により半田の流れが妨げられ、半田はそのまゝ直進せ
ず、下方あるいは絶縁体部側方に押し流されて、絶縁体
部を介したもう一方の導体部に直接到達し難くなる。Operation According to the present invention having the above-described configuration, the flow of the solder is obstructed by the insulator portion thicker than the conductor portion, and the solder does not proceed straight, but is swept downward or laterally of the insulator portion to remove the insulator portion. It becomes difficult to directly reach the other conductor portion via the conductor.
実施例 以下、本発明の一実施例を第１図に基づいて説明す
る。第１図において第２図と同一部分には同一番号を付
し、説明を省略する。すなわち本発明の特徴は表裏箔接
続部品１の絶縁体部11の外径寸法がその両側に延出した
導体部3,4の線径寸法より太くなっていることである。
このように、絶縁体部11の外径寸法を太くすると、初め
の両面基板５の表面の半田付け時に、絶縁体部11が半田
が流れる方向の妨げになるため、半田はそのまま直進で
きずに下方へ流れるか、あるいは絶縁体部11の側方へ押
し流されることになる。このため、導体部３からすぐに
導体部４へ到達できない。この現象により、半田槽の半
田部を通過する際、半田のきれが良化し、導体部３と導
体部４のショートは防止できる。Embodiment An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same parts as those in FIG. 2 are designated by the same reference numerals and the description thereof will be omitted. That is, the feature of the present invention is that the outer diameter dimension of the insulator portion 11 of the front and back foil connecting component 1 is thicker than the wire diameter dimension of the conductor portions 3 and 4 extending on both sides thereof.
As described above, if the outer diameter of the insulator portion 11 is increased, the insulator portion 11 interferes with the flow direction of the solder at the time of soldering the surface of the double-sided substrate 5 for the first time. It will flow downward or be pushed to the side of the insulator part 11. For this reason, the conductor portion 4 cannot be immediately reached from the conductor portion 3. Due to this phenomenon, when passing through the solder portion of the solder bath, the solder breakage is improved, and a short circuit between the conductor portion 3 and the conductor portion 4 can be prevented.
発明の効果 以上の実施例から明らかなように本発明によれば、表
裏箔接続部品の絶縁体部をその両側の導体部より太くし
た構成により、従来使用していた実装機械を用いて実装
でき、半田が絶縁体部上をブリッジしてショートするこ
とのない表裏箔接続部品を提供できる。EFFECTS OF THE INVENTION As is clear from the above embodiments, according to the present invention, the insulator part of the front and back foil connection parts is made thicker than the conductor parts on both sides of the insulator part, so that it can be mounted using a mounting machine that has been conventionally used. It is possible to provide a front / back foil connecting component in which the solder does not bridge over the insulator to cause a short circuit.
第１図は本発明の一実施例の表裏箔接続部品を両面基板
に挿入したときの断面図、第２図は従来の表裏箔接続部
品を両面基板に挿入したときの断面図である。 １……表裏箔接続部品、3,4……導体部、５……両面基
板、6a,6b……表面箔、7a,7b……裏面箔、11……絶縁体
部。FIG. 1 is a cross-sectional view of a front / back foil connecting component according to an embodiment of the present invention inserted into a double-sided board, and FIG. 2 is a cross-sectional view of a conventional front / back foil connecting component inserted into a double-sided board. 1 …… Front and back foil connecting parts, 3,4 …… conductor part, 5 …… double-sided board, 6a, 6b …… front foil, 7a, 7b …… back foil, 11 …… insulator part.
Claims (1)
裏面箔とを接続する部材であって、絶縁物部材の両側に
延出した半田付け可能な導体の線径寸法が前記絶縁物部
材の外径寸法より小さいことを特徴とする表裏箔接続部
品。1. A member for connecting a front surface foil and a rear surface foil of a double-sided board used for an electric circuit, wherein a wire diameter dimension of a solderable conductor extending on both sides of the insulator member is the insulator member. Front and back foil connection parts characterized by being smaller than the outer diameter dimension of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195384A JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195384A JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0479173A JPH0479173A (en) | 1992-03-12 |
| JP2679365B2 true JP2679365B2 (en) | 1997-11-19 |
Family
ID=16340269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2195384A Expired - Fee Related JP2679365B2 (en) | 1990-07-23 | 1990-07-23 | Front and back foil connection parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2679365B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129811A (en) * | 1995-10-30 | 1997-05-16 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255367U (en) * | 1985-09-27 | 1987-04-06 |
-
1990
- 1990-07-23 JP JP2195384A patent/JP2679365B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479173A (en) | 1992-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |