JPS5857956A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS5857956A JPS5857956A JP56157060A JP15706081A JPS5857956A JP S5857956 A JPS5857956 A JP S5857956A JP 56157060 A JP56157060 A JP 56157060A JP 15706081 A JP15706081 A JP 15706081A JP S5857956 A JPS5857956 A JP S5857956A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- adhesive
- manufacture
- laminated board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はアディティブ用積層板の製造方法に関するもの
で、積層板１０面部に接着剤塗布層ｆｌｊｙイルム２の
接着剤側８を対向させて載置した積層体をクツＶＷン材
４を介してｆｊＲＷＪ板６に挾んで積層成形することを
特徴とする積層板の製造方法に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a laminate for additive use, in which the laminate is placed on the 10th surface of the laminate with the adhesive side 8 of the adhesive coating layer fljy film 2 facing the shoe VW. The present invention relates to a method for manufacturing a laminate, which is characterized in that the fjRWJ board 6 is sandwiched between the fjRWJ boards 6 and the fjRWJ board 6 is interposed therebetween.
アディティブ法で積層板の表面に電路を形成してプリン
ト配線板を得るにあたっ・Ｃ，アディデイプ用の積層板
として表面に接着剤層を形成したものが用いられること
がある。かかる接着剤層を有する積層板を製造するにあ
九って、従来は積層成形で得られた積層板の表面に直接
接着剤を塗布、焼付けし九り、フィルム１て予め接着剤
を塗布してシい°にれをプリプレグに重ね、積層成形す
る際に積層板後接着剤層を転写した９、積層成形で得ら
れた積層板に接着剤付きのフィルムを熱ロールで圧着さ
せ・Ｃ接着剤層を積層板ＩＣ転写し念すする方法が採用
されている。しかしながらこれらの方法では接着剤層の
厚みパフツキが大であったり、鍍金銅回路の引剥し強変
の低ドヤ半田耐熱性の低下を発生させてい念。When forming electrical circuits on the surface of a laminate using an additive method to obtain a printed wiring board, a laminate with an adhesive layer formed on the surface is sometimes used as an additive laminate. In order to manufacture a laminate having such an adhesive layer, conventionally, the adhesive was applied directly to the surface of the laminate obtained by lamination molding and baked, and the adhesive was applied to the film 1 in advance. The adhesive layer was transferred after laminating the laminate by overlaying it on the prepreg and laminating it. A method has been adopted in which the agent layer is transferred to a laminate IC. However, with these methods, the thickness of the adhesive layer may vary greatly, and the soldering heat resistance may deteriorate due to severe peeling of the plated copper circuit.
本発明は上記欠点を解決するもので、積層板製造設備以
外の特別な設備を必要とすることなく接着剤層を形成す
ることができる積層板の製造方法を機供することを目的
とするものである。The present invention solves the above-mentioned drawbacks, and aims to provide a method for manufacturing a laminate that can form an adhesive layer without requiring any special equipment other than the laminate manufacturing equipment. be.
以下本発明を実施例によ秒詳述する。積層板１は紙、布
１．Ｐ／′！ス、合成繊維等の基材にフェノ−〜樹脂、
メラミン樹脂、不飽和ポリエステル樹脂、ジアリルフタ
レート１ＩＩｌｉｉ１１ エポキシ樹脂、ｌリアミド樹
脂等Ｏ熱硬化性樹脂中メリプｊＩジエン、弗化樹脂、ポ
リエλデル等の熱可塑性樹脂のツニスを含浸させ熱圧成
形によりて得られるものである。The present invention will be explained in detail below using examples. Laminated board 1 is paper, cloth 1. P/'! Phenol to resin for base materials such as base materials, synthetic fibers, etc.
Melamine resin, unsaturated polyester resin, diallyl phthalate 1IIlii11 epoxy resin, laryamide resin, etc. O thermosetting resin is impregnated with thermoplastic resin tunis such as Melipj diene, fluoride resin, polyester λdel, etc., and by hot pressure molding. That's what you get.
該積層板１０片面又は両面に接着剤層をｍ −ｇｏ。Apply an adhesive layer to one or both sides of the laminate 10.
ミクロンノ厚ミで形成したアルミニウム、鋼等ノ金属フ
ィルムや〆リエステル、ポリプロピレン、弗化樹脂、ポ
リイミド等のグラスチックフィルム等中層層紙等の接着
１ｉ４１！１布盾型フィルム２０ｍ着剤側８を対向させ
て載置した積層体を紙、布、アスベストＳ／−）、ゴム
＄／−）、グラスチックＶ −ト等ノタッＶ璽ン材４を
介してステンレス鋼板、クロム鍍金鋼板、真鍮板等Ｃ）
＠面板６に挾んで積層成形する仁とによって積層板を得
るものである。Adhesion of metal films such as aluminum and steel formed with micron thickness, glass films such as polyester, polypropylene, fluorinated resin, polyimide, and intermediate layer paper 1i41!1 Cloth shield type film 20m Adhesive side 8 facing The laminated body is then placed on paper, cloth, asbestos (S/-), rubber ($/-), glass V-g, etc. via a V-seal material 4, such as stainless steel plate, chromium-plated steel plate, brass plate, etc. )
A laminate is obtained by sandwiching the face plate 6 and forming the laminate.
この積層板はｗｉｍアイ〜ムを剥すととによってアデイ
ディプ用積層板として使用される。この際、離型フィル
ム社平滑面でもよいが好ましくは１１面であることの方
が一着剤と積層板との接着性及び後工ＩｉＯ鍍金付着性
がよ＜ａ★しい。又、積層成形条件は特に限定する％０
でなく使用する積層板、接着剤、離型フィルムの種ｌｌ
・（よ−自由に選択されるものであるが、成形圧力ＯＮ
１ｊＳＯａｔ／（ｊ、成型温度１００〜２００℃、成層
時間１０〜Ｚｏｏ分が好ましい。更に接着剤―有能型フ
ィルムの載置は積層板の片面又は両面の各れでもよく自
由に選択できるものである。This laminate is used as an adi dip laminate by peeling off the wet eye. At this time, a smooth surface may be used, but it is preferable that the surface be 11-sided because the adhesion between the first adhesive and the laminate and the adhesion of the subsequent IiO plating are better. In addition, the lamination molding conditions are particularly limited to %0.
Types of laminates, adhesives, and release films to be used
・(It is freely selected, but the molding pressure is ON.)
1jSOat/(j, the molding temperature is preferably 100 to 200°C, and the lamination time is preferably 10 to Zoo minutes. Furthermore, the adhesive-capable film can be placed on either one or both sides of the laminate, and can be freely selected. be.
上述のように本発明は積層板の面部に、接着剤―有能型
フィルムの接着剤側を対向させて載置し九積編体をクツ
シロン材を介して鏡面板に挾んで積層成形するもので積
層板製造設備以外の特別な設備を必要とせずに接着剤層
を有する積層板を得ることができるものであ炒、従来の
ように接着剤層の厚みパフツキがなく、鍍金銅回路の引
剥し強度の低下中半田耐熱性の低下を発生することがな
いものである。As described above, the present invention is a method in which an adhesive-capable film is placed on the surface of a laminate with the adhesive side facing oppositely, and the nine-layer knitted body is sandwiched between the mirror-surfaced plates via the cutsilon material to form a laminate. It is possible to obtain a laminate with an adhesive layer without the need for special equipment other than laminate manufacturing equipment.It is possible to obtain a laminate with an adhesive layer without the need for special equipment other than laminate manufacturing equipment. The soldering heat resistance does not deteriorate while the peel strength decreases.
図面は本発明の一５ｊ！施例を示す分解断面図である。
ｌは積層板、２は接着剤塗布離型フィルム、３は接着剤
側、４はクツシロン材、６はｆＩＲ面板である。The drawings are part of the invention! It is an exploded sectional view showing an example. 1 is a laminated plate, 2 is an adhesive-coated release film, 3 is an adhesive side, 4 is a cutsilon material, and 6 is an fIR face plate.
Claims (1)
接着剤側を対向させて載置した積層体をクフＶ−ン材を
介してｌＩｒｌ１板に挾んで積層成形することを特徴と
する積層板の製造方法。 檀） １１１１１１１フイルムが粗面であることを特
徴とする特許請求の範囲１１１１項記載の積層板の製造
方法。(1) A laminate is formed by placing the laminate with the adhesive side of the adhesive-coated release film facing the surface of the laminate and sandwiching the laminate between the lIrl1 plates via the Kuffin material. Method of manufacturing laminates. 1111111 The method for manufacturing a laminate according to claim 1111, wherein the film has a rough surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56157060A JPS5857956A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56157060A JPS5857956A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5857956A true JPS5857956A (en) | 1983-04-06 |
Family
ID=15641328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56157060A Pending JPS5857956A (en) | 1981-10-01 | 1981-10-01 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857956A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631298A (en) * | 1979-08-22 | 1981-03-30 | Pioneer Electronic Corp | Vibration system unit for acoustic device |
-
1981
- 1981-10-01 JP JP56157060A patent/JPS5857956A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631298A (en) * | 1979-08-22 | 1981-03-30 | Pioneer Electronic Corp | Vibration system unit for acoustic device |
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