JPS5853181U - automatic soldering equipment - Google Patents
automatic soldering equipmentInfo
- Publication number
- JPS5853181U JPS5853181U JP14775481U JP14775481U JPS5853181U JP S5853181 U JPS5853181 U JP S5853181U JP 14775481 U JP14775481 U JP 14775481U JP 14775481 U JP14775481 U JP 14775481U JP S5853181 U JPS5853181 U JP S5853181U
- Authority
- JP
- Japan
- Prior art keywords
- automatic soldering
- guide rail
- soldering
- rotating
- soldering equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Control Of Conveyors (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、本考案の一実施例を示す斜視図、第 ′2図
は、この実施例におけるプリント配線板の動作図、第3
図は、この実施例に使用されるガイドレール回転装置を
示す斜視図である。
1ニブリント配線板のキャリア、2ニブリント配線板、
3ニガイドレール、4:はんだ槽、5ニブリント配線板
のバタン、6:ガイドレールの回転装置。Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is an operational diagram of the printed wiring board in this embodiment, and Fig.
The figure is a perspective view showing a guide rail rotating device used in this embodiment. 1 Niblint wiring board carrier, 2 Niblint wiring board,
3. Guide rail, 4: Solder bath, 5. Niblint wiring board slam, 6. Guide rail rotation device.
Claims (2)
んだ面に接触させながら、回転させる手段を設けたこと
を特徴とする自動はんだ付は装置。(1) An automatic soldering device characterized by being provided with means for rotating the printed wiring board while bringing the soldering surface into contact with the soldering surface in the soldering bath.
リント配線板のキャリアが、前記はんだ槽において該ガ
イドレールに載置された時に、上記ガイドレールを回転
させる装置から成ることを特徴とする実用新案登録請求
の範囲第1項記載の自動はんだ付は装置。(2) Practical use characterized in that the rotating means comprises a rotatable guide rail and a device for rotating the guide rail when a printed wiring board carrier is placed on the guide rail in the solder bath. The automatic soldering device according to claim 1 of the patent registration claim.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14775481U JPS5853181U (en) | 1981-10-06 | 1981-10-06 | automatic soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14775481U JPS5853181U (en) | 1981-10-06 | 1981-10-06 | automatic soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5853181U true JPS5853181U (en) | 1983-04-11 |
JPS6239888Y2 JPS6239888Y2 (en) | 1987-10-12 |
Family
ID=29940599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14775481U Granted JPS5853181U (en) | 1981-10-06 | 1981-10-06 | automatic soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5853181U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5127845A (en) * | 1974-09-03 | 1976-03-09 | Koki Kk | HANDAZUKE SOCHI |
-
1981
- 1981-10-06 JP JP14775481U patent/JPS5853181U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5127845A (en) * | 1974-09-03 | 1976-03-09 | Koki Kk | HANDAZUKE SOCHI |
Also Published As
Publication number | Publication date |
---|---|
JPS6239888Y2 (en) | 1987-10-12 |
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