JPS5842266B2 - How to coat copper on one side of an aluminum plate - Google Patents
How to coat copper on one side of an aluminum plateInfo
- Publication number
- JPS5842266B2 JPS5842266B2 JP17188881A JP17188881A JPS5842266B2 JP S5842266 B2 JPS5842266 B2 JP S5842266B2 JP 17188881 A JP17188881 A JP 17188881A JP 17188881 A JP17188881 A JP 17188881A JP S5842266 B2 JPS5842266 B2 JP S5842266B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- copper
- plate
- aluminum plate
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は、アルミニウム板の片面に銅を被覆する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for coating copper on one side of an aluminum plate.
電子業界では、軽量化のため、片面に半田付は可能な銅
の表面処理が施され、他面は、市販、の清浄なアルミニ
ウム面が残っている部品、例えば、パッド、放熱板等の
需要が高まっている。In the electronics industry, in order to reduce weight, there is a demand for parts that have a copper surface treatment that can be soldered on one side and a commercially available clean aluminum surface on the other side, such as pads and heat sinks. is increasing.
しかしこの種のアルミニウム板の製造は、従来、アルミ
ニウム板の片面全体にマスキングテープを貼り、他面に
塩化銅を塗布し、４００〜５００℃で数１０分間加熱し
て、拡散浸透させ、表面に銅層を析出させて、片面を銅
板面とする方法で行っている。However, in the production of this type of aluminum plate, conventionally, masking tape was pasted on one side of the aluminum plate, copper chloride was applied on the other side, and the coating was heated at 400 to 500°C for several tens of minutes to diffuse and infiltrate the surface. This is done by depositing a copper layer and using one side as a copper plate.
更に前記析出銅上に、銅、ニッケル等のめつきしたもの
を得るため、耐熱マスキング剤がないことにより、各め
っき前にめっきマスキングを施す工程を取り入れている
。Furthermore, in order to obtain plated copper, nickel, etc. on the deposited copper, a step of plating masking is introduced before each plating due to the lack of a heat-resistant masking agent.
このような工程によると、塩化銅が溶融状態となったと
き、清浄に残されるべきアルミニウム板面に、回り込み
、銅の拡散浸透及び、析出が行なわれたり、炉内反応ガ
スがアルミニウム板面に斑点状に反応して変色又は、酸
化されたり、向い合った他のアルミニウム板のアルミニ
ウム板面に塩化銅が飛散して銅を析出してしまって市販
アルミニウム板購入時のような清浄なアルミニウム板面
を確保することができない。According to such a process, when copper chloride becomes molten, it wraps around the aluminum plate surface, which should be left clean, and copper diffuses and permeates and precipitates. A clean aluminum plate like when you purchase a commercially available aluminum plate may be discolored or oxidized due to a spotty reaction, or copper chloride may scatter and deposit copper on the aluminum plate surface of another aluminum plate facing it. Unable to secure surface area.
そこで、アルミニウム板面全体をアルミニウムテープで
マスキングする方法又は、両面接着テープで２枚のアル
ミニウム板を張り合わせる方法等を採用しても、反応前
に接着剤が加熱で破壊されて溶融塩化鋼がアルミニウム
板面に回り込んで析出した銅又は、焦げ付いた接着剤炭
化物をブラッシング除去した研摩跡が残って、信頼性の
高い接合性のあるアルミニウム板面となっていない。Therefore, even if methods such as masking the entire aluminum plate surface with aluminum tape or pasting two aluminum plates together with double-sided adhesive tape are used, the adhesive will be destroyed by heating before the reaction occurs and the molten chlorinated steel will Polishing marks from brushing away copper that has wrapped around and precipitated on the aluminum plate surface or burnt-on adhesive carbide remain, resulting in an aluminum plate surface that does not have highly reliable bonding properties.
又、析出銅上への銅、ニッケル等のめっきを施す場合の
めつきマスキングを除去すると、アルミニウム板面は表
面が粗くなり、接合性が低下する。Furthermore, if the plating masking used when plating copper, nickel, etc. on the deposited copper is removed, the surface of the aluminum plate will become rough and the bondability will deteriorate.
又、従来法の１つとして、金属テープを折り曲げ又は２
枚の金属テープを重ね合わせて、溶接又は、ロー付けで
密封した後、電気めっきを施し、その後縁部を切断して
２枚に分けることを特徴とするものがある（特公昭４９
−２３９７５号「金属テープの連続的電気鍍金方法」参
照）。In addition, as one of the conventional methods, the metal tape is bent or
There is a tape that is characterized by stacking two pieces of metal tape, sealing them by welding or brazing, then applying electroplating, and cutting the trailing edge to separate it into two pieces.
(See No. 23975 ``Continuous electroplating method for metal tape'').
これは、アルミニウムに直接鋼の電気めっきを施す場合
とか、アルミニウムの厚板を折り曲げて溶接で密封する
ことに適用できない。This does not apply to electroplating steel directly on aluminum or to bending and welding aluminum slabs to seal them.
そこで、電気めっきの代りに、銅の拡散浸透と銅の析出
層を得る方法（例：特公昭５５−２３９１０号「アルミ
ニウム又はアルミニウム合金の表面に金属層を被覆する
方法」参照）を使用して、２枚の重ね合わせ縁部を溶接
されたアルミニウム表面に塩化銅を塗布して加熱した後
、冷却し残渣を除去して、溶接部を切断して２枚とした
とき、銅層にクラックが発生してしまう欠点があった。Therefore, instead of electroplating, a method of copper diffusion and penetration to obtain a copper deposit layer (for example, see Japanese Patent Publication No. 55-23910 ``Method of Coating a Metal Layer on the Surface of Aluminum or Aluminum Alloy'') was used. After applying copper chloride to the aluminum surface where the overlapping edges of the two sheets were welded and heating it, cooling it and removing the residue, and cutting the welded part to make two sheets, there were no cracks in the copper layer. There were some drawbacks that could occur.
本発明は、上記欠点を解消するため、発明者が種々研究
した結果なされたもので、その要旨とするところは、２
枚のアルミニウム又はアルミニウム合金（以下、単に「
アルミニウム」という）の板を密着して、その縁部を連
続的に溶接又は圧接する第１工程と、該重合板の表面に
塩化銅を付着させ、該重合板を加熱後、冷却して、残渣
処理をする第２工程と、該重合板の縁部を切断して２枚
の板とする第３工程とからなることを特徴とするもので
ある。The present invention was made as a result of various researches by the inventor in order to eliminate the above-mentioned drawbacks, and the gist thereof is as follows:
aluminum or aluminum alloy (hereinafter simply "
A first step of closely adhering plates of aluminum (referred to as "aluminum") and continuously welding or pressing the edges thereof, adhering copper chloride to the surface of the polymer plate, heating the polymer plate, and then cooling it. This method is characterized by comprising a second step of treating the residue, and a third step of cutting the edges of the polymerized board into two boards.
次に、本発明方法によってアルミニウム板の片面に銅を
被覆する工程を詳しく説明する。Next, the process of coating one side of an aluminum plate with copper using the method of the present invention will be explained in detail.
第１工程は、市販されている相互に面が密着可能なアル
ミニウム板１の２枚をその間隙に空気が残存しないよう
に、該アルミニウム重合板１．１より小さい２枚のアル
ミニウム板で挟圧して密着させ、その縁部（例：板縁よ
り５ｍ１ｒＬ位の所）を連続的に溶接又は圧接等の方法
で接合２を行ない、該接合によって、該間隙に表面処理
液が入らないように完全に密封する（第１図参照）。In the first step, two commercially available aluminum plates 1 whose surfaces can be brought into close contact with each other are sandwiched between two aluminum plates smaller than the aluminum polymer plate 1.1 so that no air remains in the gap between them. Then, the edges (for example, about 5 m1 rL from the edge of the plate) are continuously joined by welding or pressure welding, etc., to completely prevent surface treatment liquid from entering the gap. (See Figure 1).
２枚のアルミニウム板を密着させる方法は、上記の方法
に限らず、その間隙に空気が残存しないように密着され
ればよく、完全に真空にする程の必要性は実用上はない
。The method of bringing the two aluminum plates into close contact is not limited to the above method, and it is sufficient that the two aluminum plates are brought into close contact so that no air remains in the gap, and there is no practical need to create a complete vacuum.
しかし空気が残存していると、第２工程における加熱時
に熱膨張し、析出銅層にクラックが発生するので、出来
るだけ残らないようにした方がよい。However, if air remains, it will thermally expand during heating in the second step and cracks will occur in the deposited copper layer, so it is better to prevent it from remaining as much as possible.
又、該重合板１．１の縁部な連続的に溶接又は圧接する
必要がある。Furthermore, it is necessary to continuously weld or press the edges of the overlapping plate 1.1.
連続的に完全に密封し、第２工程での塩化銅の処理液３
が該重合板の間隙に入らないようにする必要がある。Continuously and completely sealed, copper chloride treatment solution 3 in the second step
It is necessary to prevent the material from entering the gaps between the polymer plates.
又は、溶接は、ＴＩＧ溶接、ＭＩＧ溶接、シーム溶接等
を含み、間に圧力を加えて新生面を出させて接合するも
ので、クラッド圧延、低周波振動圧接、裁断圧接等でも
よい。Alternatively, welding includes TIG welding, MIG welding, seam welding, etc., and joins by applying pressure in between to expose a new surface, and may also be clad rolling, low frequency vibration welding, cutting pressure welding, etc.
圧接は、清浄面が、もし、完全に密封されていないと、
該重合板の内面（アルミニウム板面）に銅が析出し、こ
れを除去すると、表面粗さが低下し、接合性の信頼性が
低下してしまうからである。In pressure welding, if the clean surface is not completely sealed,
This is because copper is deposited on the inner surface of the polymer plate (aluminum plate surface), and if this is removed, the surface roughness decreases and the reliability of bonding performance decreases.
第２工程は、第１工程で得られた重合板１．１にマスキ
ングをしないで、該表面に塩化銅３を塗布浸漬、又は散
布等付着させ（例えば、塩化銅３をペイント状にした槽
４内に浸漬した後、これを取り出す（第２図参照））該
重合板１．１をノ・シャー６により４００〜５００℃の
加熱炉５内に装入し、数１０分後に、該重合板１．１を
取り出して冷却し、更に該表面をブラッシング等で残渣
を取り除いて該アルミニウム重合板表面に銅の被覆７を
得る（第３図参照）。In the second step, without masking the polymeric board 1.1 obtained in the first step, copper chloride 3 is applied to the surface by coating, dipping, or spraying (for example, in a bath containing copper chloride 3 in the form of paint). 4 and then taken out (see Figure 2)) The polymer plate 1.1 is placed into a heating furnace 5 at 400 to 500°C using a shear 6, and after several tens of minutes, the polymer plate 1.1 is taken out. The plywood 1.1 is taken out and cooled, and the surface is brushed to remove any residue, thereby obtaining a copper coating 7 on the surface of the aluminum polymer board (see FIG. 3).
塩化銅の付着方法は、塗布、浸漬、又は散布等特に限定
されない。The method of depositing copper chloride is not particularly limited, such as coating, dipping, or spraying.
銅被覆の上に、更に必要に応じて銅、ニッケル、又は錫
のめつき８等を施すことも可能である（第４図参照）。It is also possible to further provide copper, nickel, or tin plating 8 or the like on the copper coating, if necessary (see FIG. 4).
この場合、電気めっき、無電解めっき等特にめっき方法
については、限定されない。In this case, the plating method, such as electroplating or electroless plating, is not particularly limited.
第１工程で空気が残存しないように完全に密封されてい
るため、重合板１．１間隙に塩化銅３が回り込むことは
な（、従って、アルミニウム板面１を汚すことはないし
、又、加熱炉５の雰囲気に直接曝されないので斑点状に
反応して変色又は酸化されることがなく、又、向い合っ
た他のアルミニウム重合板１．１のアルミニウム板面１
に塩化銅３が飛散して銅を析出７することがない。Since it is completely sealed so that no air remains in the first step, the copper chloride 3 will not enter the gap between the stacked plates 1 and 1 (therefore, it will not stain the aluminum plate surface 1, and the heating Since it is not directly exposed to the atmosphere of the furnace 5, it will not react in spots and be discolored or oxidized, and the aluminum plate surface 1 of the other facing aluminum polymer plate 1.1
The copper chloride 3 does not scatter and deposit 7 copper.
従って、該汚れ等を後工程で研摩する必要がなく、従っ
て又、研摩跡も残ることがない。Therefore, there is no need to polish the dirt etc. in a subsequent process, and therefore no polishing marks remain.
又、銅被覆７の上に、更に、銅、ニッケル等をめっきす
るときも、マスキングの要がなく従って、マスキング剤
を使用しないので、接着剤が破壊されたり、焦げ付いた
りすることはなく、表面粗さが低下することがなく、更
に、アルミニウム板面が高温加熱処理を施こされても、
全く酸化の形跡もなく美麗な表面状態を維持し、接合性
の信頼性も低下しない。Also, when plating copper, nickel, etc. on the copper coating 7, there is no need for masking, and therefore no masking agent is used, so the adhesive will not be destroyed or scorched, and the surface will remain intact. The roughness does not decrease, and even when the aluminum plate surface is subjected to high temperature heat treatment,
It maintains a beautiful surface condition with no evidence of oxidation, and the reliability of bonding does not deteriorate.
第３工程は、第２工程を終えたアルミニウム重合板１．
１の縁部から７．５ ｍｍ位の所９（接合部分）をシャ
ーリング等で切断する（第５図参照）。The third step consists of the aluminum polymer plate 1 after the second step.
Cut 9 (joint part) about 7.5 mm from the edge of 1 using shirring or the like (see Figure 5).
このようにして得られた片面が表面処理７，８され、他
面がアルミニウム板面１０であるアルミニウム板１を母
材として需要サイズに切断或いはプレス等で形状化し放
熱板、パッド１１等に使用される。The aluminum plate 1 thus obtained, one side of which has been subjected to surface treatments 7 and 8 and the other side of which is an aluminum plate surface 10, is used as a base material, cut into a desired size or shaped by pressing, etc., and used as a heat sink, a pad 11, etc. be done.
（第６図参照）。上記のように本発明方法によれば、前
記従来法の欠点が解消され、汚れ又は研摩跡のない市販
アルミニウム板と同等の表面状態を持つ、アルミニウム
板面を確保して、品質の向上を果すと共に、従来アルミ
ニウム板面を得るために各工程で必要とされた、マスキ
ング作業及び汚れを除去するための研摩作業を省略する
ことが可能となって大幅な原価低減となると共に、加熱
炉内に、アルミニウム重合板の板面を向い合わせて複数
列装入することが品質上可能となって、大幅な生産性を
向上できることとなった。(See Figure 6). As described above, according to the method of the present invention, the drawbacks of the conventional method are eliminated, and the quality of the aluminum plate is improved by ensuring an aluminum plate surface with a surface condition equivalent to that of a commercially available aluminum plate without stains or polishing marks. At the same time, it has become possible to omit the masking work and polishing work to remove dirt, which were conventionally required in each process to obtain an aluminum plate surface, resulting in a significant cost reduction. In terms of quality, it has become possible to charge aluminum polymer plates in multiple rows with their surfaces facing each other, which has made it possible to significantly improve productivity.
又、更に、特記すべきことは、得られたアルミニウム板
面が全く汚れ又は研摩跡がない表面状態となり、２００
μ程度のアルミニウム線との超音波ボンディングでの接
合の信頼性が高いものとなっている。Furthermore, it should be noted that the surface of the obtained aluminum plate had no stains or polishing marks, and
The reliability of ultrasonic bonding with aluminum wire of about μ is high.
実施例
第１工程、材質Ｊ Ｉ ５−Ａｌ １００１板厚０．８
朋×幅３１５朋×長さ７２０７７１町板厚１．５間の前
記と幅、長さの同一なアルミニウム板１を２枚重ね合わ
せて該アルミニウム板１より小さい別のアルミニウム板
２枚で挟圧しながら、該アルミニウム重合板１．１の縁
部全周をＴＩＧ溶接で完全に密封状態に接合２する。Example 1st step, material J I 5-Al 1001 plate thickness 0.8
Two aluminum plates 1 of the same width and length as the above, with a width of 315 mm x width of 720,771 mm and a board thickness of 1.5 mm, are stacked and sandwiched between two other aluminum plates smaller than the aluminum plate 1. At the same time, the entire circumference of the edge of the aluminum polymer plate 1.1 is joined 2 in a completely sealed state by TIG welding.
その上、長さ方向の片側上辺の２箇所に炉内吊り具用の
引掛は穴の明いた板厚１．５朋×幅２０７ＷｆｆｌＸ長
さ３０ｍｍのアルミニウム板２′を溶接で取り付ける。In addition, aluminum plates 2' with holes 1.5 mm thick x 207 mm wide x 30 mm long are attached by welding to two locations on the upper side of one side in the length direction for hooks for the furnace hanger.
このようにして得られた、重合板１．１は、その間隙に
空気が残存しないしかつ後の塩化銅等の表面処理液３が
浸入することがない。In the thus obtained polymerized board 1.1, no air remains in the gaps, and the subsequent surface treatment liquid 3 such as copper chloride does not enter.
第２工程、塩化銅を液状に練り上げた反応浴５中に第１
工程で重合されたアルミニウム板１．１を全面浸漬後引
上げて、塩化銅３が付着される。In the second step, the first
After the entire surface of the aluminum plate 1.1 polymerized in the process is immersed, it is pulled up and copper chloride 3 is deposited thereon.
次いで、該重合板１．１が数枚、加熱炉５内のノ・ンガ
ー６に引掛けられ４００〜５００℃に数１０分間加熱し
、該重合板１．１を取り出し、水冷してブラッシングで
残渣を除去した。Next, several sheets of the polymeric board 1.1 are hung on a nozzle 6 in the heating furnace 5 and heated to 400 to 500°C for several tens of minutes, and then the polymerized board 1.1 is taken out, cooled with water, and brushed. The residue was removed.
更に、前記析出した銅層７上に、ピロリン酸銅めっきを
１５μ施し、その上に無電解ニッケルめっき（３μ）８
を全面に施した。Further, on the deposited copper layer 7, 15μ of copper pyrophosphate plating was applied, and on top of that, electroless nickel plating (3μ) was applied.
was applied to the entire surface.
第３工程、前記めっき後の重合板１．１の端部７．５間
の所９かもシャーリングで切断を行なって幅３００ｍ７
ＷＸ長さ７０５ｍ１ｌＬの片面に前記表面処理が施され
た板面８と、他面は、全く手を加えられていない清浄な
アルミニウム表面１０を有する板面を有する２枚の板が
得られた。In the third step, the portion 9 between the ends 7.5 of the plated polymer plate 1.1 is also cut using shirring to obtain a width of 300 m7.
Two plates were obtained, each having a WX length of 705 ml and a plate surface 8 having the surface treatment described above on one side, and a plate surface having a clean aluminum surface 10 that had not been modified at all on the other side.
このようにして得られたアルミニウム板１．１は更に板
状に切断されて放熱板のプレス母材とされたり、電子部
品のパッド１１等にプレス加工されて使用される。The aluminum plate 1.1 thus obtained is further cut into plate shapes to be used as a pressed base material for heat sinks, or pressed into pads 11 of electronic components and the like.
図面は本発明の１実施例にして、第１図はアルミニウム
板を接合した斜視図、第２図は塩化銅浴の説明図、第３
図は、加熱炉の説明図、第４図はめつき後のアルミニウ
ム重合板の斜視図、第５図＆東切断部位を示す説明図、
第６図は、パッド用片の斜視図である。
１ニアルミニウム板、１．１ニアルミニウム重合板、２
：接合部、３：塩化銅浴、５：加熱炉、７゜８：めっき
、９：切断部位、１０ニアルミニウム板面、１１：パッ
ド。The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view of aluminum plates joined together, FIG. 2 is an explanatory diagram of a copper chloride bath, and FIG.
The figures are an explanatory diagram of the heating furnace, Figure 4 is a perspective view of the aluminum polymer plate after plating, Figure 5 is an explanatory diagram showing the east cutting part,
FIG. 6 is a perspective view of the pad piece. 1 Ni aluminum plate, 1.1 Ni aluminum polymer plate, 2
: Joint part, 3: Copper chloride bath, 5: Heating furnace, 7°8: Plating, 9: Cutting part, 10 aluminum plate surface, 11: Pad.
Claims (1)
して、その縁部を連続的に溶接又は圧接する第１工程と
、該重合板の表面に塩化銅を付着させ該重合板を加熱後
、冷却して、残渣処理をする第２工程と、該重合板の縁
部を切断して２枚の板とする第３工程とからなることを
特徴とするアルミニウム板の片面に銅を被覆する方法。The first step is to closely adhere 12 aluminum or aluminum alloy plates and continuously weld or pressure bond their edges. Copper chloride is attached to the surface of the composite plate, the composite plate is heated, and then cooled. A method for coating one side of an aluminum plate with copper, the method comprising: a second step of treating the residue, and a third step of cutting the edges of the polymerized plate into two plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17188881A JPS5842266B2 (en) | 1981-10-26 | 1981-10-26 | How to coat copper on one side of an aluminum plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17188881A JPS5842266B2 (en) | 1981-10-26 | 1981-10-26 | How to coat copper on one side of an aluminum plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5873758A JPS5873758A (en) | 1983-05-04 |
| JPS5842266B2 true JPS5842266B2 (en) | 1983-09-19 |
Family
ID=15931654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17188881A Expired JPS5842266B2 (en) | 1981-10-26 | 1981-10-26 | How to coat copper on one side of an aluminum plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5842266B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10154316A1 (en) * | 2001-11-07 | 2003-05-15 | Juergen Schulz-Harder | Process for the selective surface treatment of plate-shaped workpieces |
| CN113774441A (en) * | 2021-08-23 | 2021-12-10 | 左利芸 | Aluminum alloy coating composite material |
-
1981
- 1981-10-26 JP JP17188881A patent/JPS5842266B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5873758A (en) | 1983-05-04 |
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