JPS584193Y2 - Multilayer wiring device - Google Patents
Multilayer wiring deviceInfo
- Publication number
- JPS584193Y2 JPS584193Y2 JP12643579U JP12643579U JPS584193Y2 JP S584193 Y2 JPS584193 Y2 JP S584193Y2 JP 12643579 U JP12643579 U JP 12643579U JP 12643579 U JP12643579 U JP 12643579U JP S584193 Y2 JPS584193 Y2 JP S584193Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- multilayer wiring
- wiring device
- holes
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【考案の詳細な説明】 この考案は多層配線装置に関する。[Detailed explanation of the idea] This invention relates to a multilayer wiring device.
クロスオーバー配線或いはマトリックス配線などでは、
各絶縁板上の配線を、絶縁板にあけた孔をスルーホール
孔として互いに接続することが普通に行なわれている。In crossover wiring or matrix wiring, etc.
It is common practice to connect the wiring on each insulating plate to each other by using holes drilled in the insulating plate as through holes.
第1図は従来例を示し、1.2は各絶縁板、3は絶縁板
1上に形成された配線、4は絶縁板2上に形成された配
線(絶縁板1との重なり部分は点線で示しである。Figure 1 shows a conventional example, where 1 and 2 are the respective insulating plates, 3 is the wiring formed on the insulating plate 1, and 4 is the wiring formed on the insulating plate 2 (the overlapping part with the insulating plate 1 is indicated by dotted lines). It is shown by .
)である。そして両配線3,4の接続のために絶縁板1
に孔5をあけ、これをスルーホール孔として両配線3,
4の交差部分を互いに接続するようにしている。). And an insulating plate 1 for connecting both wirings 3 and 4.
Drill a hole 5 in and use this as a through hole hole to connect both wirings 3,
The intersections of 4 are connected to each other.
ところで従来では第1図に示すように配線3は互いに平
行し、又配線4も互いに平行するとともに、配線3,4
は互いに直交するようなパターンとするのを普通として
いた。By the way, conventionally, as shown in FIG. 1, the wires 3 are parallel to each other, the wires 4 are also parallel to each other, and the wires 3 and
It was common for the patterns to be orthogonal to each other.
しかしこのような構成によると、配線の密度が高くなる
と、孔5同志の間隔を狭まくせざるを得す、そのため両
配線3,4の接続の際、隣りの配線と接触しやすくなっ
て短絡してしまうなど、配線が不確実となる欠点がある
。However, with this configuration, as the wiring density increases, the distance between the holes 5 has to be narrowed, so when connecting the two wirings 3 and 4, they tend to come into contact with the adjacent wiring, resulting in a short circuit. This has the disadvantage that the wiring may be uncertain.
この考案は各層の配線について、その間隔を広くするこ
とを目的とし、配線をその長手方向に対して傾斜させ、
その傾斜部分で陽暦の配線同志を重ね合わせ、この重ね
合わせ部分をスルーホール孔で互いに接続することを特
徴とする。This idea aims to widen the spacing between the wiring in each layer, by tilting the wiring with respect to its longitudinal direction.
It is characterized in that the wirings of the solar calendar are overlapped on the inclined part, and the overlapping parts are connected to each other with through holes.
この考案の実施例を第2図以降によって説明する。An embodiment of this invention will be explained with reference to FIG. 2 and subsequent figures.
なお第1図と同じ符号を附した部分は同−又は対応する
部分を示す。Note that parts given the same reference numerals as in FIG. 1 indicate the same or corresponding parts.
絶縁板1上の配線3及び絶縁板2上の配線4は互いに直
交する方向に延長して形成されることは第1図の場合と
同じであるが、両配線3,4の接続のために、その接続
部分を各配線3,4の長手方向に対してI頃斜させ、そ
の傾斜部分3A、4Aが互いに重なり合うようにしであ
る。The wiring 3 on the insulating plate 1 and the wiring 4 on the insulating plate 2 are formed to extend in directions orthogonal to each other, as in the case of FIG. 1, but in order to connect both wirings 3 and 4, , the connecting portion is inclined about I with respect to the longitudinal direction of each wiring 3, 4, and the inclined portions 3A, 4A overlap each other.
そしてこの重なり部分に孔5をあけてこの孔をスルーホ
ール孔として両配線3,4を接続する。Then, a hole 5 is made in this overlapping portion, and this hole is used as a through hole to connect both wirings 3 and 4.
孔5は各配線の重なり部分のみを第1図のようにあけて
もよいが、図の実施例のように複数の重なり部分を連続
するひとつの孔5で連続するようにしてもよい。The holes 5 may be formed only in the overlapping portions of the wirings as shown in FIG. 1, but a plurality of overlapping portions may be made to be continuous with one continuous hole 5 as in the embodiment shown in the figure.
この場合孔5は各層の配線の長手方向に対して傾斜する
。In this case, the holes 5 are inclined with respect to the longitudinal direction of the wiring in each layer.
又傾斜部分はこの孔5の一辺に対して直交するようにす
ると傾斜部分間の間隔を最大とすることができる。Further, by making the inclined portions perpendicular to one side of the hole 5, the distance between the inclined portions can be maximized.
以上のようにして各傾斜部分を重なり合うようにすると
この重なり部分間の間隔りを充分広くとることができる
ようになる。By making the inclined portions overlap each other in the manner described above, it becomes possible to provide a sufficiently wide interval between the overlapping portions.
図の実施例は、この傾斜部分3A、4Aの、各配線に対
する傾斜角を45゜とした構成としてあり、この傾斜角
が最も大きい間隔をとることができる。In the illustrated embodiment, the inclined portions 3A and 4A have an inclination angle of 45° with respect to each wiring, and the interval can be set such that the inclination angle is the largest.
以上のように構成されるこの考案によれば、単に配線を
傾斜させて重なり合うようにするだけで各配線の間隔に
対して、重なり部分の間隔を充分広くとることができ、
これによって配線の密度が高い場合でも、接続部分間で
短絡事故を起こすことなく接続することができるように
なるといった効果を奏する。According to this invention constructed as described above, by simply tilting the wires so that they overlap, it is possible to make the interval between the overlapping portions sufficiently wide compared to the interval between each wire.
This has the effect that even if the wiring density is high, connections can be made without causing short circuits between connecting parts.
なお図の実施例は2層構造の例を示しているが3層以上
の構成でもこの考案は適用される。Although the illustrated embodiment shows an example of a two-layer structure, this invention can also be applied to a structure of three or more layers.
第1図は従来例の平面図、第2図はこの考案の実施例を
示す平面図、第3図は分解斜視図である。
1.2・・・・・・絶縁板、3,4・・・・・・配線、
3A、4A・・・・・・傾斜部分。FIG. 1 is a plan view of a conventional example, FIG. 2 is a plan view showing an embodiment of this invention, and FIG. 3 is an exploded perspective view. 1.2...Insulating board, 3,4...Wiring,
3A, 4A... Slope section.
Claims (4)
の傾斜部分で陽暦の配線同志を重ね合わせてなり、この
重ね合わせ部分をスルーホール孔で互いに接続してなる
多層配線装置(1) A multilayer wiring device in which the wiring in each layer is inclined with respect to its longitudinal direction, the solar calendar wiring is overlapped at the inclined part, and the overlapped parts are connected to each other with through holes.
る実用新案登録請求の範囲第1項記載の多層配線装置(2) The multilayer wiring device according to claim 1 of the utility model registration claim, in which the through-hole is continuous to a plurality of overlapping parts.
傾斜してのびる実用新案登録請求の範囲第2項記載の多
層配線装置(3) The multilayer wiring device according to claim 2 of the utility model registration claim, in which the through holes extend obliquely with respect to the longitudinal direction of the wiring in each layer.
に形成されている実用新案登録請求の範囲第1項又は第
2項記載の多層配線装置。(4) The multilayer wiring device according to claim 1 or 2, wherein the through holes are formed in a direction perpendicular to the inclined portion of the wiring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12643579U JPS584193Y2 (en) | 1979-09-12 | 1979-09-12 | Multilayer wiring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12643579U JPS584193Y2 (en) | 1979-09-12 | 1979-09-12 | Multilayer wiring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5643184U JPS5643184U (en) | 1981-04-20 |
JPS584193Y2 true JPS584193Y2 (en) | 1983-01-24 |
Family
ID=29358329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12643579U Expired JPS584193Y2 (en) | 1979-09-12 | 1979-09-12 | Multilayer wiring device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS584193Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6969284B2 (en) * | 2017-10-26 | 2021-11-24 | 沖電気工業株式会社 | Exposure equipment and image forming equipment |
-
1979
- 1979-09-12 JP JP12643579U patent/JPS584193Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5643184U (en) | 1981-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH023631Y2 (en) | ||
JPS584193Y2 (en) | Multilayer wiring device | |
JPH01154669U (en) | ||
JPS63136694A (en) | Multilayer interconnection board | |
JPH0143876Y2 (en) | ||
JP2712491B2 (en) | Multilayer printed wiring board | |
JPS5974758U (en) | Wiring board structure | |
JPS62103317U (en) | ||
JPS5999478U (en) | Wiring structure of multilayer circuit board | |
JPS60127797A (en) | Multilayer printed circuit board | |
JPS58122473U (en) | printed wiring board | |
JPH03109369U (en) | ||
JPH0587159B2 (en) | ||
JPS61137394A (en) | Multilayer printed board | |
JPH01110462U (en) | ||
JPH02122479U (en) | ||
JPS6395274U (en) | ||
JPS60106361U (en) | wiring base | |
JPH01162281U (en) | ||
JPS58164263U (en) | Multilayer printed wiring board structure | |
JPS593565U (en) | Wiring structure of multilayer printed board | |
JPS619873U (en) | Thick film printed multilayer substrate | |
JPS5815376U (en) | Printed board double-sided wiring conduction structure | |
JPH0413878B2 (en) | ||
JPS63119265U (en) |