JPS5839058U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5839058U
JPS5839058U JP13290381U JP13290381U JPS5839058U JP S5839058 U JPS5839058 U JP S5839058U JP 13290381 U JP13290381 U JP 13290381U JP 13290381 U JP13290381 U JP 13290381U JP S5839058 U JPS5839058 U JP S5839058U
Authority
JP
Japan
Prior art keywords
semiconductor element
heat sink
semiconductor equipment
bent portion
wide portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13290381U
Other languages
Japanese (ja)
Inventor
寛 山田
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP13290381U priority Critical patent/JPS5839058U/en
Publication of JPS5839058U publication Critical patent/JPS5839058U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の横断面図、第２図は第１図のＩ−Ｉ断
面図、第３図は第２図の■−■断面図、第４図はリード
の放熱板への固定方法を説明するための平面図、第５図
は本案の一実施例を示す横断面図、第６図は第５図の■
−■断面図、第７図は第６図のＩＶ−ＩＶ断面図、第８
図は分解斜視図である。 図中、１は放熱板、２は切欠き部、３はリード、３１〜
３３はリード片、３□ａは屈曲部、３□ｂは巾広部、４
は半導体素子、５は金属細線、６は樹脂材である。 （Ｑ） −Ｌ７　図Figure 1 is a cross-sectional view of the conventional example, Figure 2 is a cross-sectional view taken along line II in Figure 1, Figure 3 is a cross-sectional view taken along ■-■ in Figure 2, and Figure 4 shows how the leads are fixed to the heat sink. FIG. 5 is a plan view for explaining the method, FIG. 5 is a cross-sectional view showing an embodiment of the present invention, and FIG.
- ■ Cross-sectional view, Figure 7 is the IV-IV cross-sectional view of Figure 6,
The figure is an exploded perspective view. In the figure, 1 is a heat sink, 2 is a notch, 3 is a lead, 31~
33 is a lead piece, 3□a is a bent part, 3□b is a wide part, 4
5 is a semiconductor element, 5 is a thin metal wire, and 6 is a resin material. (Q) -L7 Figure

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板に半導体素子を固定すると共に、半導体素子の電
極とリードとを金属細線にて接続し、かつ半導体素子を
含む主要部分を樹脂材にてモールド被覆したものにおい
て、上記リードのうち、特定のリードの一端に巾広部を
有するＬ形の屈曲部を形成し、この屈曲部の巾広部を放
熱板に形成した切欠き部に弾性的に支持させたことを特
徴とする半導体装置。A semiconductor element is fixed to a heat sink, electrodes of the semiconductor element and leads are connected with thin metal wires, and the main part including the semiconductor element is molded and covered with a resin material. A semiconductor device characterized in that an L-shaped bent portion having a wide portion is formed at one end of a lead, and the wide portion of the bent portion is elastically supported by a notch formed in a heat sink.
JP13290381U 1981-09-07 1981-09-07 semiconductor equipment Pending JPS5839058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13290381U JPS5839058U (en) 1981-09-07 1981-09-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13290381U JPS5839058U (en) 1981-09-07 1981-09-07 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5839058U true JPS5839058U (en) 1983-03-14

Family

ID=29926401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13290381U Pending JPS5839058U (en) 1981-09-07 1981-09-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5839058U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002037562A1 (en) * 2000-11-01 2002-05-10 Mitsui High-Tec. Inc. Lead frame and semiconductor device using this

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002037562A1 (en) * 2000-11-01 2002-05-10 Mitsui High-Tec. Inc. Lead frame and semiconductor device using this
US6936915B2 (en) 2000-11-01 2005-08-30 Mitsui High-Tec, Inc. Lead frame having chip mounting part and leads of different thicknesses

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