JPS58155849U - semiconductor equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例の横断面図、第２図は第１図の正面図、
第３図は本案の一実施例を示す横断面図、第４図は第３
図の正面図である。 図中、１は放熱板、１ａは固定領域、１ｂは取付領域、
２はスリット、４は半導体素子、５はリード、６は金属
細線、７は樹脂材である。Figure 1 is a cross-sectional view of the conventional example, Figure 2 is a front view of Figure 1,
Figure 3 is a cross-sectional view showing one embodiment of the present invention, and Figure 4 is a cross-sectional view showing an example of the present invention.
FIG. In the figure, 1 is a heat sink, 1a is a fixed area, 1b is a mounting area,
2 is a slit, 4 is a semiconductor element, 5 is a lead, 6 is a thin metal wire, and 7 is a resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板に半導体素子を固定すると共に、半導体素子の電
極とそれの近傍に位置するリードとを金属細線にて接続
し、かつ半導体素子を含む主要部分を樹脂材にてモール
ド被覆したものにおいて、上記放熱板の樹脂材より露呈
する取付領域にスリットを形成したことを特徴とする半
導体装置。The semiconductor element is fixed to a heat sink, the electrodes of the semiconductor element and the leads located in the vicinity thereof are connected by thin metal wires, and the main part including the semiconductor element is molded and covered with a resin material. A semiconductor device characterized in that a slit is formed in a mounting area exposed from a resin material of a heat sink.