JPS5833754Y2 - Mounting structure of heat sink - Google Patents
Mounting structure of heat sinkInfo
- Publication number
- JPS5833754Y2 JPS5833754Y2 JP1791578U JP1791578U JPS5833754Y2 JP S5833754 Y2 JPS5833754 Y2 JP S5833754Y2 JP 1791578 U JP1791578 U JP 1791578U JP 1791578 U JP1791578 U JP 1791578U JP S5833754 Y2 JPS5833754 Y2 JP S5833754Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案はプリント配線基板に装着するパワートランジス
タ等の放熱板の取付構造に関するものである。[Detailed Description of the Invention] The present invention relates to a mounting structure for a heat sink for a power transistor or the like mounted on a printed wiring board.
従来この種の放熱板は熱伝導の良好な金属板を折曲げて
作り、プリンＩ・配線基板に接する端縁を折曲げて取付
脚を形威し、ねじ止めなどによって固定していたが組立
が面倒で部品点数が多くなりコスト高となるなどの欠点
を有していた。Conventionally, this type of heat dissipation plate was made by bending a metal plate with good thermal conductivity, and the edge that contacted the printer I/wiring board was bent to form a mounting leg, and it was fixed with screws, etc., but it was difficult to assemble it. This method has drawbacks such as being troublesome and requiring a large number of parts, resulting in high costs.
本考案はこれを改良するもので、以下図に示す一実施例
について本考案を説明すると、１は放熱板で、同放熱板
１は二個所を略直角に折曲げて平面コ字形断面に形成し
、同放熱板１の板面をプリント配線板２の上面に垂直に
立てると共に、同プリント配線基板２に接する端縁部に
同プリント配線基板２に係合させるための下方にＬ字形
に張出した引掛爪３を形成し、同引掛爪３と対向する板
面にはパワートランジスタ等の半導体素子Ａを取付ける
ための所要の取付穴４を開口して間部にパワートランジ
スタ等の半導体素子Ａを取付け、その取付ねじ部にはア
ース端子を兼わた接続板５を・プリンＩ・基板の下方に
挿通導出する。The present invention is an improvement on this, and the present invention will be explained with reference to an embodiment shown in the figure below. 1 is a heat sink, and the heat sink 1 is formed into a planar U-shaped cross section by bending two parts at approximately right angles. The surface of the heat sink 1 is erected perpendicularly to the top surface of the printed wiring board 2, and the edge in contact with the printed wiring board 2 is extended downward in an L-shape for engagement with the printed wiring board 2. A hooking claw 3 is formed, and a required mounting hole 4 for mounting a semiconductor device A such as a power transistor is formed in the plate surface facing the hooking claw 3, and the semiconductor device A such as a power transistor is inserted between the holes. Attachment: A connection plate 5, which also serves as a ground terminal, is inserted into the mounting screw portion and led out from below the printed circuit board.
一方プリント配線基板２には所要個所に上記引掛爪３を
嵌入し得る大きさの穴６を明け、これを引掛けた状態で
上記接続板５を挿設する穴７をあける。On the other hand, holes 6 large enough to fit the hooking claws 3 are formed in the printed wiring board 2 at required locations, and holes 7 are drilled into which the connecting plates 5 are inserted while the hooks are hooked.
以上の横取においてプリン１〜配線基板２の穴６に引掛
爪３を差込み、これを横にすらせて同大２の側縁に引掛
け、一方の穴７に接続板５を差込む、この状態で同接続
板５をプリント配線基板２の銅箔にはんだ付けによって
接続する。In the above-mentioned takeover, insert the hook 3 into the hole 6 of the pudding 1 to the wiring board 2, slide it sideways and hook it to the side edge of the same size 2, and insert the connection plate 5 into one hole 7. In this state, the connection board 5 is connected to the copper foil of the printed wiring board 2 by soldering.
以上説明したように放熱板１はプリン１〜配線基板２に
対して引掛爪３と接続板５によって固定することができ
る。As explained above, the heat dissipation plate 1 can be fixed to the print board 1 to the wiring board 2 by the hooking claws 3 and the connection plate 5.
かかる取付にあたってはねし止めなどの面倒な締付加工
は必要なく、簡単な差込みとはんだ付加上により容易に
取付けができる。Such installation does not require troublesome tightening processes such as snap-locking, and can be easily installed by simply inserting and adding solder.
なお上記引掛爪３と対向する位置に設ける接続板５は素
子の取付ねじを利用して固定しているので接続板５を放
熱板に特定のねじを用いることなく取付けでき、はんだ
付けの不可能な放熱効果の良い放熱板とはんだ付は可能
な接続板とを簡易に組合せでき、また放熱板によってプ
リン１〜配線基板を補強でき、また囲われるプリント基
板上には各種電気部品（抵抗、コンテ゛ンサ、ダイオー
ド、コイル等）を配置してプリント基板を効率よく利用
することができる。Note that the connection plate 5 provided at a position facing the hook 3 is fixed using the mounting screws of the element, so the connection plate 5 can be attached to the heat sink without using specific screws, making it impossible to solder. It is possible to easily combine a heat sink with good heat dissipation effect and a connection board that can be soldered. Also, the heat sink can reinforce the printed circuit board 1 to the wiring board, and various electrical components (resistors, capacitors, etc.) can be mounted on the enclosed printed circuit board. , diodes, coils, etc.), the printed circuit board can be used efficiently.
図は本考案の一実施例を示し、第１図は放熱板の斜視図
、第２図はプリント配線基板に対する放熱板の取付状態
を示す側面図である。
同図中、１は放熱板、２はプリント配線基板、３は引掛
爪、４は取付穴、５は接続板、６，７は穴。The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of a heat sink, and FIG. 2 is a side view showing how the heat sink is attached to a printed wiring board. In the figure, 1 is a heat sink, 2 is a printed wiring board, 3 is a hook, 4 is a mounting hole, 5 is a connection plate, and 6 and 7 are holes.
Claims (1)
をプリン１〜配線基板に固定するにあたり、同放熱板は
二個所を略直角に折曲げて平面コ字形断面部を形成し、
同放熱板の板面をプリント配線基板上に平面３学形に直
立させてそのプリント配線基板に接する放熱板の両端縁
部にプリント配線基板に設けた穴等に係合させるための
Ｌ字形の引掛爪を下方にそれぞれ張出し、同画引掛取と
対向する放熱板の他側縁には前記パワートランジスタ等
の半導体素子を取付けるための所要の取付穴を開口して
同所に同半導体素子をねじにより取付け、同ねじ部には
アース端子を兼ねた接続板を取付けて下方に突出せしめ
、同引掛爪を基板に引掛けた状態で接続板の端部を基板
の裏面銅箔部に挿通、ハンダ付して固定したことを特徴
とする放熱板の取付構造。When fixing a heat sink holding a semiconductor element such as a power 1 transistor to a wiring board 1, the heat sink is bent at two points at approximately right angles to form a planar U-shaped cross section.
The plate surface of the heat sink is placed upright on the printed wiring board in a planar three-dimensional shape, and the edges of the heat sink in contact with the printed wiring board are L-shaped to engage holes etc. provided in the printed wiring board. The hooks are extended downward, and the required mounting holes for mounting the semiconductor elements such as the power transistors are opened on the other side edge of the heat sink facing the hooks, and the semiconductor elements are screwed into the same places. Attach a connecting plate that also serves as a ground terminal to the same threaded part and make it protrude downward. With the hook hook hooked on the board, insert the end of the connecting plate into the copper foil part on the back of the board, and solder. A mounting structure for a heat sink, characterized in that it is attached and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1791578U JPS5833754Y2 (en) | 1978-02-15 | 1978-02-15 | Mounting structure of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1791578U JPS5833754Y2 (en) | 1978-02-15 | 1978-02-15 | Mounting structure of heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54121247U JPS54121247U (en) | 1979-08-24 |
| JPS5833754Y2 true JPS5833754Y2 (en) | 1983-07-28 |
Family
ID=28844182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1791578U Expired JPS5833754Y2 (en) | 1978-02-15 | 1978-02-15 | Mounting structure of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5833754Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58175645U (en) * | 1982-05-18 | 1983-11-24 | ソニー株式会社 | heat sink device |
-
1978
- 1978-02-15 JP JP1791578U patent/JPS5833754Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54121247U (en) | 1979-08-24 |
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