JPS6141240Y2 - - Google Patents
Info
- Publication number
- JPS6141240Y2 JPS6141240Y2 JP17181681U JP17181681U JPS6141240Y2 JP S6141240 Y2 JPS6141240 Y2 JP S6141240Y2 JP 17181681 U JP17181681 U JP 17181681U JP 17181681 U JP17181681 U JP 17181681U JP S6141240 Y2 JPS6141240 Y2 JP S6141240Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- integrated circuit
- heat sink
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案は印刷配線板に取付けられた集積回路部
品への放熱板取付装置に係り、簡単な構成で大き
な放熱効果が得られ、しかもその取付けが容易で
印刷配線板と集積回路部品やシヤーシとの間に若
干の寸法的誤差があつても集積回路部品に余分な
荷重をかけることなく正確に取付けられる優れた
放熱板取付装置を提供することを目的とするもの
である。[Detailed description of the invention] The present invention relates to a heat sink mounting device for integrated circuit components mounted on a printed wiring board.It has a simple structure, provides a large heat radiation effect, and is easy to install. The object of the present invention is to provide an excellent heat sink mounting device that can accurately mount integrated circuit components without placing an extra load on them even if there is a slight dimensional error between the integrated circuit components and the chassis. .
一般に印刷配線板に集積回路部品を取付け、こ
の集積回路部品に放熱板を結合する場合第１図に
示すように印刷配線板１に形成した取付孔２に集
積回路部品３のリード線４を挿入して上記集積回
路部品３を上記印刷配線板１に取付け、上記印刷
配線板１と別に設けた放熱板５とをそれぞれシヤ
ーシ６の所定位置に取付け、その後上記集積回路
部品３を上記印刷配線板１を貫通するビス７によ
り上記放熱板５に締付固定するようにしている。
しかしながら、この種のものでは放熱板５が集積
回路部品３の片面に接しているだけであり、その
放熱効果が必ずしも充分でないことがあり、また
集積回路部品３の放熱板５への取付けに際しても
印刷配線板１を貫通するビス７により直接放熱板
５に締付固定しているため印刷配線板１と放熱板
５の取付位置に若干の寸法的誤差が生じると、こ
れによつてビス７がうまく放熱板５に螺合しない
ことがあり、仮に螺合したとしてもこの場合には
印刷配線板１あるいは集積回路部品３に大きな負
荷がかかることになり、集積回路部品３が破損さ
れる可能性があるなど余り好ましいものではなか
つた。 Generally, when an integrated circuit component is mounted on a printed wiring board and a heat sink is connected to this integrated circuit component, the lead wire 4 of the integrated circuit component 3 is inserted into the mounting hole 2 formed in the printed wiring board 1 as shown in FIG. Then, the integrated circuit component 3 is attached to the printed wiring board 1, the printed wiring board 1 and a separately provided heat sink 5 are respectively attached to predetermined positions of the chassis 6, and then the integrated circuit component 3 is attached to the printed wiring board 1. 1 is tightened and fixed to the heat dissipation plate 5 by means of screws 7 passing through the heat dissipation plate 5.
However, in this type of device, the heat sink 5 is in contact with only one side of the integrated circuit component 3, and its heat dissipation effect may not always be sufficient. Because the screws 7 that pass through the printed wiring board 1 are directly tightened and fixed to the heat sink 5, if there is a slight dimensional error in the mounting position of the printed wiring board 1 and the heat sink 5, this will cause the screws 7 to There are cases where the heat dissipation plate 5 is not screwed properly, and even if it is screwed together, in this case, a large load will be applied to the printed wiring board 1 or the integrated circuit component 3, and there is a possibility that the integrated circuit component 3 will be damaged. It was not very desirable.
本考案は以上のような従来の欠点を除去するも
のであり、簡単な構成で優れた放熱板取付装置を
提供するものである。 The present invention eliminates the above-mentioned conventional drawbacks and provides an excellent heat sink mounting device with a simple structure.
以下、本考案の放熱板取付装置について一実施
例の図面とともに説明する。第２図〜第４図にお
いて、１０はシヤーシ、１１はシヤーシ１０にビ
ス１２によつて締付固定された印刷配線板、１３
はリード線１４が印刷配線板１１に形成した取付
孔１４に挿入され半田付けされた集積回路部品、
１６は集積回路部品１３と印刷配線板１１とを囲
むように断面コ字状に形成され、上面に複数のフ
イン１６ａを有する放熱板、１７は印刷配線板１
１に形成された透孔１８を通して上記放熱板１５
の上面板に締付固定されたビス、１９はシヤーシ
１０に形成した透孔２０を通して放熱板１５の下
面板に締付固定されたビスである。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The heat sink mounting device of the present invention will be described below with reference to drawings of an embodiment. 2 to 4, 10 is a chassis, 11 is a printed wiring board fastened to the chassis 10 with screws 12, and 13
is an integrated circuit component in which lead wires 14 are inserted into mounting holes 14 formed in printed wiring board 11 and soldered;
Reference numeral 16 denotes a heat dissipation plate formed to have a U-shaped cross section so as to surround the integrated circuit component 13 and the printed wiring board 11, and has a plurality of fins 16a on the upper surface; 17, the printed wiring board 1;
1 through the through hole 18 formed in the heat sink 15.
The screws 19 that are tightened and fixed to the upper surface plate are screws that are tightened and fixed to the lower surface plate of the heat sink 15 through the through holes 20 formed in the chassis 10.
尚、透孔１８，２０はビス１７，１９の径より
充分大きく形成されており、多少の位置ずれを吸
収できるように形成されている。 Note that the through holes 18 and 20 are formed to be sufficiently larger than the diameters of the screws 17 and 19, and are formed so as to absorb some positional deviation.
本考案は上記実施例より明らかなように放熱板
を断面コ字状に形成し、印刷配線板とここに取付
けられた集積回路部品とを囲むように上記放熱板
を取付けるように構成したものであり、放熱板と
集積回路部品との接触面が従来に比して著しく多
くなり、したがつて、全体としてその放熱効果が
著しく大きくなるという利点を有する。そして、
本考案によれば印刷配線板、シヤーシにそれぞれ
透孔を形成し、これらの透孔を通してビスをそれ
ぞれ放熱板の上面板、下面板に締付固定するよう
に構成しているため、ビスは共に同一方向から締
付固定することができその締付作業が著しく容易
になるという利点を有する。また、本考案によれ
ば印刷配線板、シヤーシに形成するそれぞれのビ
ス挿入用透孔をビスの径より若干大きく形成する
ことが可能であり、シヤーシに対する印刷配線板
の取付位置、印刷配線板に対する集積回路部品の
取付位置に若干の寸法的誤差が生じたとしてもこ
れらを容易に吸収することができ、集積回路部品
に余分な荷重が加わらず、その破損が著しく少な
くなるという利点を有する。 As is clear from the above-mentioned embodiment, the present invention is constructed such that the heat sink is formed into a U-shaped cross section, and the heat sink is attached so as to surround the printed wiring board and the integrated circuit components attached thereto. This has the advantage that the contact surface between the heat sink and the integrated circuit component is significantly larger than in the past, and the overall heat dissipation effect is significantly increased. and,
According to the present invention, through-holes are formed in the printed wiring board and the chassis, respectively, and the screws are tightened and fixed to the top and bottom plates of the heat sink, respectively, through these through-holes. It has the advantage that it can be tightened and fixed from the same direction, making the tightening work considerably easier. In addition, according to the present invention, it is possible to form the screw insertion holes formed in the printed wiring board and the chassis to be slightly larger than the diameter of the screws, and the mounting position of the printed wiring board relative to the chassis and the printed wiring board relative to the chassis can be made slightly larger than the screw diameter. Even if slight dimensional errors occur in the mounting position of the integrated circuit component, these can be easily absorbed, and there is an advantage that no extra load is applied to the integrated circuit component, and damage to the integrated circuit component is significantly reduced.
第１図は従来の放熱板取付装置の斜視図、第２
図は本考案の放熱板取付装置における一実施例の
斜視図、第３図、第４図は同要部の断側面図であ
る。
１０……シヤーシ、１１……印刷配線板、１
２，１７，１９……ビス、１３……集積回路部
品、１４……リード線、１５……取付孔、１６…
…放熱板、１８，２０……透孔。
Figure 1 is a perspective view of a conventional heat sink mounting device;
The figure is a perspective view of one embodiment of the heat sink mounting device of the present invention, and FIGS. 3 and 4 are cross-sectional side views of the same essential parts. 10... Chassis, 11... Printed wiring board, 1
2, 17, 19... Screw, 13... Integrated circuit component, 14... Lead wire, 15... Mounting hole, 16...
...Radiation plate, 18, 20...Through hole.
Claims (1)
け、この集積回路部品と上記印刷配線板の端部と
を囲むように断面コ字状に形成した放熱板を上記
集積回路と上記印刷配線板の端部に嵌合し、シヤ
ーシに形成した透孔を貫通するビス及び上記印刷
配線板に形成した透孔を貫通するビスをそれぞれ
上記放熱板の上面板、下面板に締付固定すること
により上記放熱板を上記シヤーシ及び印刷配線板
に取付けて成る放熱板取付装置。 An integrated circuit component is attached to the upper surface of the end of the printed wiring board, and a heat dissipation plate having a U-shaped cross section is attached between the integrated circuit and the printed wiring board so as to surround the integrated circuit component and the end of the printed wiring board. By tightening and fixing screws that fit into the ends and pass through holes formed in the chassis and screws that pass through holes formed in the printed wiring board to the top and bottom plates of the heat sink, respectively, A heat sink mounting device for attaching a heat sink to the chassis and printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17181681U JPS5877054U (en) | 1981-11-17 | 1981-11-17 | Heat sink mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17181681U JPS5877054U (en) | 1981-11-17 | 1981-11-17 | Heat sink mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5877054U JPS5877054U (en) | 1983-05-24 |
| JPS6141240Y2 true JPS6141240Y2 (en) | 1986-11-25 |
Family
ID=29963725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17181681U Granted JPS5877054U (en) | 1981-11-17 | 1981-11-17 | Heat sink mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877054U (en) |
-
1981
- 1981-11-17 JP JP17181681U patent/JPS5877054U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5877054U (en) | 1983-05-24 |
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