JPS5829868U - integrated circuit mounting structure - Google Patents
integrated circuit mounting structureInfo
- Publication number
- JPS5829868U JPS5829868U JP12242981U JP12242981U JPS5829868U JP S5829868 U JPS5829868 U JP S5829868U JP 12242981 U JP12242981 U JP 12242981U JP 12242981 U JP12242981 U JP 12242981U JP S5829868 U JPS5829868 U JP S5829868U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- mounting structure
- circuit mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来知られている集積回路の取り付は構造を
示す断面図、また、第2図は、この考案の実施例の取り
付は構造を示す断面図である。
1・・・・・・S、1.L、パッケージの集積回路、2
・・・・・・プリント配線基板、3・・・・・・開口、
4・・曲固定用接着板。FIG. 1 is a sectional view showing a conventional integrated circuit mounting structure, and FIG. 2 is a sectional view showing a mounting structure of an embodiment of the present invention. 1...S, 1. L, integrated circuit in package, 2
...Printed wiring board, 3...Opening,
4. Adhesive board for fixing the song.
Claims (1)
線基板に設けた開口内にプリント配線基板とほぼ平行に
配置し、集積回路の端子をプリント配線基板にはんだ付
けすると共に、固定用接着板を集積回路およびプリント
配線基板にまたがって接着することを特徴とする集積回
路取り付は構The integrated circuit of the single in-line package is placed in the opening provided in the printed wiring board, almost parallel to the printed wiring board, the terminals of the integrated circuit are soldered to the printed wiring board, and the fixing adhesive plate is attached to the integrated circuit and the printed wiring board. Integrated circuit mounting is characterized by adhesive bonding across the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242981U JPS5829868U (en) | 1981-08-20 | 1981-08-20 | integrated circuit mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242981U JPS5829868U (en) | 1981-08-20 | 1981-08-20 | integrated circuit mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5829868U true JPS5829868U (en) | 1983-02-26 |
Family
ID=29916352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12242981U Pending JPS5829868U (en) | 1981-08-20 | 1981-08-20 | integrated circuit mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5829868U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54104574A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Method of soldering components |
JPS5561088A (en) * | 1978-10-31 | 1980-05-08 | Matsushita Electric Works Ltd | Device for mounting electronic part to printed substrate |
-
1981
- 1981-08-20 JP JP12242981U patent/JPS5829868U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54104574A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Method of soldering components |
JPS5561088A (en) * | 1978-10-31 | 1980-05-08 | Matsushita Electric Works Ltd | Device for mounting electronic part to printed substrate |
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