JPS5823853A - Molding material of thermosetting resin - Google Patents

Abstract

PURPOSE:The titled material capable of reducing extremely a shrinkage factor during molding, a shrinkage factor and water absorption of a molded article, obtained by adding an inorganic hollow material to a thermosetting resin. CONSTITUTION:A thermosetting resin preferably a phenol resin or an amino resin is blended with an inorganic hollow material such as glass ballon, silas ballon, fly ash balloon, etc. The amount of the hollow material added is 10- 60wt%, preferably 20-50wt% based on the total amount of the molding material.

Description

【発明の詳細な説明】 本発明は配線−異、電気器具、工業用品、家庭用品等番
【用いる熱−化性樹脂成形材料ＩＣ関するもので、その
■的とするところは成形時及び成形品の収縮を低下させ
且つ成形品の吸水を低下させることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermosetting resin molding material IC used for wiring, electrical appliances, industrial goods, household goods, etc. The objective is to reduce the shrinkage of the molded product and the water absorption of the molded product.

従来の熱硬化性樹脂成形材料は主充填剤として木粉、パ
ルプ、炭酸カルＶウム等を用いている九め成形時数縮率
、１．成形品収縮率、成形品吸水率が大きく配線器具、
電気器臭、工業用品、家麿用品等に使用して、精密用途
、高級用途等で使用し得ない欠点があった。Conventional thermosetting resin molding materials use wood flour, pulp, calcium carbonate, etc. as the main filler. Wiring equipment with high molded product shrinkage rate and molded product water absorption rate,
It has the disadvantage that it cannot be used for precision applications, high-end applications, etc., because it is used for electrical appliance odor, industrial supplies, household goods, etc.

本発明は上記欠点を解決するもので、無機中空体を添加
することによって成形時数縮率、成形品収縮率、成形品
吸水率を大巾に低下させることかで１１九ものである。The present invention solves the above-mentioned drawbacks by significantly reducing the molding time contraction rate, molded product shrinkage rate, and molded product water absorption rate by adding an inorganic hollow body.

次に本発明の詳細な説明する。本発明に用いる熱硬化性
樹脂はフェノール樹脂、エリア樹脂、メラミン樹脂、フ
ェノ−＃ｆ性メツミンＩｔ　８１、−工４キＶ樹脂、不
飽和ポリエステル樹脂、キＶＶン樹脂、〆・ｊイミド樹
脂等の熱硬化性樹脂全般でＴｏ番が、好ましくはフェノ
−ｕｓｔｇｉｔ及びユリア樹脂中メツ電ン樹脂ヤフェノ
ール変性メラミン樹脂中ダアナミン樹脂等のアミノ樹脂
が望ましい。無機中空体としてはガラスバルーン、ｖ′
プラスルーン、パーライトバルーン、フツイアフＶエバ
〜−ン、Ｖ　ｌカバ〜−ン等の無機中空体全般で、無機
中空体の量は＊　ｉｃ　ｉａ　＊すゐものではないが好
ましくは成形材料金体量のＩｏ〜６０重量優Ｃ以下単に
優と記す）であることが望ｔＬ＜夏に好壕しくは笥〜団
傷添加することがＮましい、即ち１０優未満で社収縮率
盈び吸水率低減効果が小さくなる傾向番ζあり、軸優を
ζえると成形品強度が低下する　煩肉にあるからである
。樹脂、無機中空体以外の添加剤としては熱硬化性樹脂
成形材料に一般的ＫＪ＠いられる硬化剤中木粉、炭酸カ
ルシウム等の充填剤やステア９ン酸、ワックス等の一■
剤や、カーポンプフック、酸化鉄等の着色剤がそのｔ★
用いられ、これら熱硬化性樹脂、無機中空体、硬化剤、
充填剤、離濶剤、着色剤を混合、混練、粉砕、必要に応
じて造粒して熱硬化性樹脂成形材料を得るものである。Next, the present invention will be explained in detail. Thermosetting resins used in the present invention include phenolic resin, area resin, melamine resin, phenol-#f-based metsumin It 81, -4KV resin, unsaturated polyester resin, KVVN resin, and imide resin. Among thermosetting resins in general, To number is preferably used, preferably amino resins such as phenol-ustgit and urea resins, metsuden resins, phenol-modified melamine resins, and daanamine resins. As an inorganic hollow body, a glass balloon, v′
In general, the amount of inorganic hollow bodies such as plus runes, pearlite balloons, normal V-evers, Vl-covers, etc. is not limited to *icia*, but preferably the amount of molding material metal. It is desirable that the Io~60 weight or less (simply written as 'excellent') tL < If it is preferable in the summer, it is preferable to add a blanket to the weight, that is, the shrinkage rate and water absorption rate should be less than 10. This is because there is a tendency for the reduction effect to become smaller, and as the shaft thickness increases, the strength of the molded product decreases. Additives other than resins and inorganic hollow bodies include hardeners commonly used in thermosetting resin molding materials, fillers such as wood flour and calcium carbonate, stearic acid, and wax.
Colorants, car pump hooks, iron oxide, etc.
These thermosetting resins, inorganic hollow bodies, curing agents,
A thermosetting resin molding material is obtained by mixing, kneading, pulverizing, and, if necessary, granulating a filler, a release agent, and a coloring agent.

なおこの際、無機中空体を破壊させないことが大切で参
る。At this time, it is important not to destroy the inorganic hollow body.

以下本発明を実施例に４とすいて説明する。The present invention will be explained below using Example 4.

実施例１乃至ｌ フェノール１モルに対シホ〜ムアルデとドｏ１６ｓｔｙ
ｔ１％ホルマリンで加えてから撫酸触縄で酸性下で反応
させ次いで脱水煮詰し°【融点９ｏ℃のノｌツック型フ
エ／−ｐｖ樹Ｉｌｌを得た。このフェノール樹脂を用い
第１表の配合表に従って混合し、ロール凰練後粉砕し・
Ｃフェノ−〜樹脂成形材料を得大。Examples 1 to 1 1 mole of phenol to 16sty
After addition of 1% formalin, the mixture was reacted under acidic conditions using a diluted acid rope, and then dehydrated and boiled down to obtain a Noltsuk-type Hue/-pv tree with a melting point of 9°C. Using this phenolic resin, mix it according to the recipe in Table 1, knead it with a roll, and then crush it.
C phenol ~ Obtain resin molding material.

ｌ／Ｉｉ１　　　表 倦 ！ｌ！施例礁及び６ 残留水分Ｗ優のユリ１ｔＩＩ１１及びメラミン樹脂を用
い第２表の配合表８（従って温合、滉練後、粉砕してア
這）樹脂成形材料を得た。l/Ii1 table! l! Example Reef and 6 Resin molding materials were obtained using Lily 1tII11 with a residual water content W excellent and melamine resin in Formulation Table 8 of Table 2 (thus, after heating, kneading, and pulverizing).

第２表 秦 従来例１乃至８ 実施例冨のＶラスパル−ンを木粉に置換しえものを従来
例１とし、実施例４のシラスバルーンをパルプに置換し
たものを従来例８とし、実施例６のｖ′９スパルーンを
パルプに置換したものを従来例畠としえ。Table 2 Hata Conventional Examples 1 to 8 Conventional Example 1 is the one in which the V-rasp balloons in Example 4 are replaced with wood flour, and Conventional Example 8 is the one in which the shirasu balloons in Example 4 are replaced with pulp. A conventional example Hatake was prepared by replacing the v'9 sprunes of Example 6 with pulp.

実施例１乃至墨と従来例１ＰＪ至８の熱硬化性樹脂成形
材料を試噴し九緒果は第８表で明らかなように本発明の
熱硬化性樹脂成形材料は成形特収縮率、成形品収縮率、
成形品吸水率が各れも小さく本発明による熱硬化性樹脂
成形材料の優れていることを確認した。The thermosetting resin molding materials of Examples 1 to 8 and Conventional Examples 1 to 8 were test-sprayed, and as is clear from Table 8, the thermosetting resin molding materials of the present invention had a higher molding shrinkage rate and molding properties. Product shrinkage rate,
It was confirmed that the water absorption rate of the molded products was small in each case, and that the thermosetting resin molding material according to the present invention was excellent.

第　　　８　　　表 特許出願人 松下電工株式会社 代珊人弁珊士　　竹　元　敏　丸 （ほか２名）Table 8 patent applicant Matsushita Electric Works Co., Ltd. Daisanjin Bensanshi Toshimaru Take Moto (2 others)

Claims (1)

【特許請求の範囲】 ｔｉ）　　無機中空体を添加してなることを特徴とする
熱硬化性樹脂成形材料。 （雪）−無機中空体の量が全体量の１０〜６０重量％で
あることを特徴とする特許請求の範囲第１項記載の熱硬
化性樹脂酸ｙ＃材料、　　・　　　Ｃ匍　熱硬化性樹脂
が７エノール樹脂であるととを特徴とする特許請求の＊
Ｓ第１項及び第２項の熱硬化性樹脂成形材料、゛ （荀　熱硬化性樹脂がアミノ樹脂であることを特徴とす
る特許請求の範ｉｍｊｇｔ項及び第意項の熱硬化性樹脂
成形材料。[Claims] ti) A thermosetting resin molding material characterized by adding an inorganic hollow body. (Snow) - Thermosetting resin acid y# material according to claim 1, characterized in that the amount of inorganic hollow bodies is 10 to 60% by weight of the total amount, -C Thermosetting resin is a 7-enol resin.
S The thermosetting resin molding material of the first and second claims, the thermosetting resin molding material of the claims imjgt and the second claim, characterized in that the thermosetting resin is an amino resin. .