JPH06322239A - Phenol resin molding material and its molded article - Google Patents
Phenol resin molding material and its molded articleInfo
- Publication number
- JPH06322239A JPH06322239A JP13133793A JP13133793A JPH06322239A JP H06322239 A JPH06322239 A JP H06322239A JP 13133793 A JP13133793 A JP 13133793A JP 13133793 A JP13133793 A JP 13133793A JP H06322239 A JPH06322239 A JP H06322239A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- phenol resin
- copolymer
- resin molding
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アスベストフリー、ア
ンモニアフリーであり、また耐熱性、機械的・電気的特
性にも優れたフェノール樹脂成形材料およびそれを成形
したフェノール樹脂成形品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material which is asbestos-free and ammonia-free and has excellent heat resistance and mechanical / electrical characteristics, and a phenol resin molded product obtained by molding the same.
【０００２】[0002]
【従来の技術】従来から、フェノール樹脂は基材、可塑
剤、着色剤、離型剤等と混合・混練し、成形材料として
幅広く用いられている。こうして得られたフェノール樹
脂成形材料は、耐熱性、機械的特性および電気的特性に
バランスのとれた材料である。最近、その用途の拡大か
ら種々の電気部品、構造部品、自動車部品等に応用され
るようになり、耐熱性、機械的特性および電気的特性に
おいてさらにレベルアップが必要になってきている。ま
た部品組込みの構造上の理由からアンモニアフリーであ
ることが要求されている。2. Description of the Related Art Conventionally, a phenol resin has been widely used as a molding material by mixing and kneading it with a base material, a plasticizer, a coloring agent, a release agent and the like. The phenol resin molding material thus obtained is a material having well-balanced heat resistance, mechanical properties and electrical properties. Recently, due to the expansion of its applications, it has been applied to various electric parts, structural parts, automobile parts and the like, and it is necessary to further improve the heat resistance, mechanical characteristics and electric characteristics. Further, it is required to be ammonia-free for the structural reason of incorporating the parts.
【０００３】このような多くの特性を満足させるフェノ
ール樹脂成形材料には、これまでアスベストが配合使用
されてきた。アスベストは耐熱性、電気特性、機械的強
度が優れており、従来のレゾール型樹脂と組み合せるこ
とによってバランスのとれた特性が得られるため、好適
な充填剤として用いられた。しかし、最近ではアスベス
トが作業環境を悪化させ、かつ人体に有害であるという
理由からその使用が禁止されている。これらの理由から
アスベストフリー材料として種々の手段・方法が検討さ
れているが、木粉、パルプ、無機質充填剤を組み合せた
ものは耐熱性に劣り、また、ヘキサミン硬化をさせた場
合は、耐熱性、電気特性、機械的強度に優れており特性
バランスはよいものの、アンモニアフリーでないという
欠点があった。こうしたことから、アスベストフリー、
アンモニアフリーであって、特性上バランスのとれたフ
ェノール樹脂成形材料の開発が要望されていた。Asbestos has been compounded and used so far in phenol resin molding materials which satisfy such many characteristics. Asbestos has excellent heat resistance, electrical properties, and mechanical strength, and when used in combination with a conventional resole-type resin, it provides well-balanced properties, so it was used as a suitable filler. However, recently, the use of asbestos is prohibited because it deteriorates the working environment and is harmful to the human body. For these reasons, various means and methods have been studied as an asbestos-free material, but the combination of wood flour, pulp, and inorganic filler is inferior in heat resistance, and when cured with hexamine, Although it has excellent electrical characteristics and mechanical strength and a good balance of characteristics, it has a drawback that it is not ammonia-free. From these things, asbestos-free,
There has been a demand for the development of a phenol resin molding material that is ammonia-free and has a well-balanced property.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、アスベストフリー、アンモニ
アフリーであって、耐熱性、機械的・電気的特性に優
れ、それら特性のバランスの良いフェノール樹脂成形材
料およびその成形品を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances and is asbestos-free and ammonia-free, which is excellent in heat resistance and mechanical / electrical characteristics, and has a good balance of these characteristics. It is intended to provide a good phenol resin molding material and a molded product thereof.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記の目的を
達成しようと鋭意研究を重ねた結果、樹脂として特定の
コポリマーを用いることによって、上記目的が達成され
ることを見いだし、本発明を完成したものである。In the present invention, as a result of intensive studies to achieve the above object, it was found that the above object can be achieved by using a specific copolymer as a resin. It has been completed.
【０００６】即ち、本発明は、 （Ａ）次式で示される縮合型フェノールアラルキル樹脂
とレゾール樹脂のコポリマーおよびThat is, the present invention provides (A) a copolymer of a condensed phenol aralkyl resin and a resole resin represented by the following formula:
【０００７】[0007]
【化３】 （但し、式中、Ｙはメチレン基又は（−ＣＨ2 −Ｏ−Ｃ
Ｈ2 −）基を，n は1 以上の整数を、x は0 又は1 〜2
の整数を表す） （Ｂ）無機質充填剤を必須成分とし、成形材料全体に対
して前記（Ａ）のコポリマーを5 〜70重量％、また
（Ｂ）の無機質充填剤を95〜30重量％含有してなること
を特徴とするフェノール樹脂成形材料およびそれを成形
してなることを特徴とするフェノール樹脂成形品であ
る。[Chemical 3] (However, in the formula, Y is a methylene group or (—CH 2 —O—C)
H 2 −) group, n is an integer of 1 or more, and x is 0 or 1 to 2
(B) with an inorganic filler as an essential component, containing 5 to 70% by weight of the copolymer (A) and 95 to 30% by weight of the inorganic filler (B) with respect to the entire molding material. And a phenol resin molded article characterized by molding the same.
【０００８】以下、本発明を詳細に説明する。The present invention will be described in detail below.
【０００９】本発明に用いる（Ａ）コポリマーは、化３
の一般式で示したような縮合型フェノールアラルキル樹
脂とレゾール型フェノール樹脂とが共重合した構造のも
ので、フェノールアラルキル樹脂と、フェノールモノマ
ーと、ホルマリン又はパラホルムアルデヒドとを、適宜
のモル比に配合し、触媒下で縮合反応して得ることがで
きる。このコポリマーの配合割合は、フェノール樹脂成
形材料全体に対して5〜70重量％含有するように配合す
る。配合割合がこの範囲を外れると流動特性に劣り好ま
しくない。The (A) copolymer used in the present invention is
Of a structure in which a condensation type phenol aralkyl resin and a resol type phenol resin as shown by the general formula of (1) are copolymerized, and a phenol aralkyl resin, a phenol monomer, and formalin or paraformaldehyde are mixed at an appropriate molar ratio. It can be obtained by a condensation reaction under a catalyst. The blending ratio of this copolymer is 5 to 70% by weight based on the whole phenol resin molding material. If the blending ratio is out of this range, the flow characteristics are poor and it is not preferable.
【００１０】本発明に用いる（Ｂ）無機質充填剤として
は、アスベスト以外であれば特に制限はなく広く使用す
ることができる。例えば、炭酸カルシウム、クレー、タ
ルク、シリカ、ガラス繊維等を挙げることができる。こ
れらは単独または2 種以上混合して使用することがで
き、またこれらがバランスよく配合されていればよい。
無機質充填剤の配合割合は、フェノール樹脂成形材料全
体に対して30〜95重量％含有するように配合する。この
配合割合が30重量％未満では機械的強度が低下し、また
95重量％を超えるとフェノール樹脂成形材料中に均一に
分散できず好ましくない。The inorganic filler (B) used in the present invention is not particularly limited as long as it is other than asbestos and can be widely used. For example, calcium carbonate, clay, talc, silica, glass fiber and the like can be mentioned. These may be used alone or in combination of two or more, and they may be blended in a well-balanced manner.
The blending ratio of the inorganic filler is 30 to 95% by weight based on the whole phenol resin molding material. If this blending ratio is less than 30% by weight, the mechanical strength will decrease,
If it exceeds 95% by weight, it cannot be uniformly dispersed in the phenol resin molding material, which is not preferable.
【００１１】本発明のフェノール樹脂成形材料は、前述
した特定のコポリマー、無機質充填剤を必須成分とする
が、本発明の目的に反しない限度において、また必要に
応じて、硬化剤、着色剤、硬化促進剤、離型剤、難燃
剤、滑剤、カップリング剤等を適宜添加配合することが
できる。The phenolic resin molding material of the present invention contains the above-mentioned specific copolymer and inorganic filler as essential components, but the curing agent, the colorant, and the A curing accelerator, a mold release agent, a flame retardant, a lubricant, a coupling agent and the like can be appropriately added and blended.
【００１２】本発明のフェノール樹脂成形材料は通常次
のようにして製造される。前述した特定のコポリマー、
無機質充填剤および必要に応じてその他の添加剤を加え
て混合して、均一に分散させた後、混練機で加熱混練
し、次いで冷却固化させ適当な大きさに粉砕して成形材
料とする。またこのフェノール樹脂成形材料を成形して
成形品とすることができる。The phenol resin molding material of the present invention is usually produced as follows. The specific copolymers mentioned above,
An inorganic filler and, if necessary, other additives are added and mixed, and after being uniformly dispersed, kneaded by heating with a kneader, then cooled and solidified, and crushed to an appropriate size to obtain a molding material. Further, this phenol resin molding material can be molded into a molded product.
【００１３】[0013]
【作用】本発明のフェノール樹脂成形材料は、特定のコ
ポリマーを用いたことによって、耐熱性、機械的特性を
向上させ、かつ電気特性を保持させるとともに、アスベ
ストフリー、アンモニアフリーであってバランスのとれ
た特性を有するフェノール樹脂成形材料およびその成形
品を得ることができる。The phenol resin molding material of the present invention improves heat resistance and mechanical properties and maintains electrical properties by using a specific copolymer, and at the same time, is asbestos-free and ammonia-free and is well balanced. It is possible to obtain a phenol resin molding material having the above characteristics and a molded product thereof.
【００１４】[0014]
【実施例】次に、本発明を実施例によって説明するが、
本発明はこれらの実施例によって限定されるものではな
い。以下の実施例および比較例において、「％」とは
「重量％」を意味する。The present invention will be described below with reference to examples.
The invention is not limited by these examples. In the following Examples and Comparative Examples, “%” means “% by weight”.
【００１５】実施例１ 前記のコポリマー30％、ガラス繊維60％、その他添加剤
10％を常温で混合し、さらに90〜110 ℃で混練冷却した
後、粉砕してフェノール樹脂成形材料を製造した。Example 1 30% of the above copolymer, 60% of glass fiber, other additives
10% was mixed at room temperature, further kneaded and cooled at 90 to 110 ° C., and then pulverized to produce a phenol resin molding material.
【００１６】実施例２ 前記のコポリマー30％、カオリンクレー25％、ガラス繊
維35％、その他添加剤10％を常温で混合し、さらに90〜
110 ℃で混練冷却した後、粉砕してフェノール樹脂成形
材料を製造した。Example 2 The above copolymer (30%), kaolin clay (25%), glass fiber (35%), and other additives (10%) were mixed at room temperature, and further 90-
After kneading and cooling at 110 ° C., it was pulverized to produce a phenol resin molding material.
【００１７】比較例１ レゾール型フェノール樹脂30％、ガラス繊維60％、その
他添加剤10％を常温で混合し、さらに90〜110 ℃で混練
冷却した後、粉砕してフェノール樹脂成形材料を製造し
た。Comparative Example 1 Resol type phenolic resin 30%, glass fiber 60%, and other additives 10% were mixed at room temperature, further kneaded and cooled at 90 to 110 ° C., and then pulverized to produce a phenolic resin molding material. .
【００１８】比較例２ レゾール型フェノール樹脂30％、パルプフロック10％、
カオリンクレー25％、ガラス繊維25％、その他添加剤10
％を常温で混合し、さらに90〜110 ℃で混練冷却した
後、粉砕してフェノール樹脂成形材料を製造した。Comparative Example 2 Resol type phenolic resin 30%, pulp floc 10%,
Kaolin clay 25%, glass fiber 25%, other additives 10
% At room temperature, further kneaded and cooled at 90 to 110 ° C., and then pulverized to produce a phenol resin molding material.
【００１９】比較例３ レゾール型フェノール樹脂30％、アスベスト25％、ガラ
ス繊維35％、その他添加剤10％を常温で混合し、さらに
90〜110 ℃で混練冷却した後、粉砕してフェノール樹脂
成形材料を製造した。Comparative Example 3 Resol type phenolic resin 30%, asbestos 25%, glass fiber 35% and other additives 10% were mixed at room temperature, and further mixed.
After kneading and cooling at 90 to 110 ° C., it was pulverized to produce a phenol resin molding material.
【００２０】実施例１〜２及び比較例１〜３で製造した
フェノール樹脂成形材料を用いて、圧縮成形及び射出成
形で170 ℃に加熱した金型中に成形硬化させて成形品と
した。得られた成形品について機械的特性、電気的特
性、加熱分解温度、加熱後の外観を試験したのでその結
果を表１に示したが、本発明は諸特性に優れ、かつバラ
ンスのとれた特性を示しており、本発明の効果を確認す
ることができた。Using the phenolic resin molding materials produced in Examples 1 and 2 and Comparative Examples 1 to 3, molding and curing were carried out in a mold heated to 170 ° C. by compression molding and injection molding to obtain molded products. The obtained molded product was tested for mechanical properties, electrical properties, thermal decomposition temperature, and appearance after heating. The results are shown in Table 1. The present invention is excellent in various properties and has well-balanced properties. And the effect of the present invention could be confirmed.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【発明の効果】以上の説明及び表１から明らかなよう
に、本発明のフェノール樹脂成形材料およびその成形品
は、アスベストフリー、アンモニアフリーであり、耐熱
性、機械的・電気的特性および外観に優れて特性バラン
スがよく、電子・電気部品、自動車部品として好適なも
のである。As is clear from the above description and Table 1, the phenolic resin molding material of the present invention and its molded product are asbestos-free and ammonia-free, and have excellent heat resistance, mechanical and electrical characteristics and appearance. It has an excellent property balance and is suitable for electronic / electrical parts and automobile parts.
Claims (2)
アラルキル樹脂とレゾール樹脂とのコポリマーおよび 【化１】 （但し、式中、Ｙはメチレン基又は（−ＣＨ2 −Ｏ−Ｃ
Ｈ2 −）基を，n は1 以上の整数を、x は0 又は1 〜2
の整数を表す） （Ｂ）無機質充填剤を必須成分とし、成形材料全体に対
して前記（Ａ）のコポリマーを5 〜70重量％、また
（Ｂ）の無機質充填剤を95〜30重量％含有してなること
を特徴とするフェノール樹脂成形材料。(A) A copolymer of a condensed phenol aralkyl resin represented by the following formula and a resole resin, and: (However, in the formula, Y is a methylene group or (—CH 2 —O—C)
H 2 −) group, n is an integer of 1 or more, and x is 0 or 1 to 2
(B) with an inorganic filler as an essential component, containing 5 to 70% by weight of the copolymer (A) and 95 to 30% by weight of the inorganic filler (B) with respect to the entire molding material. A phenol resin molding material characterized by being formed.
アラルキル樹脂とレゾール樹脂とのコポリマー 【化２】 （但し、式中、Ｙはメチレン基又は（−ＣＨ2 −Ｏ−Ｃ
Ｈ2 −）基を，n は1 以上の整数を、x は0 又は1 〜2
の整数を表す） （Ｂ）無機質充填剤を必須成分とし、成形材料全体に対
して前記（Ａ）のコポリマーを5 〜70重量％、また
（Ｂ）の無機質充填剤を95〜30重量％含有するフェノー
ル樹脂成形材料を成形してなることを特徴とするフェノ
ール樹脂成形品。2. A copolymer of (A) a condensed phenol aralkyl resin represented by the following formula and a resole resin: (However, in the formula, Y is a methylene group or (—CH 2 —O—C)
H 2 −) group, n is an integer of 1 or more, and x is 0 or 1 to 2
(B) with an inorganic filler as an essential component, containing 5 to 70% by weight of the copolymer (A) and 95 to 30% by weight of the inorganic filler (B) with respect to the entire molding material. A phenol resin molded article, which is obtained by molding a phenol resin molding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13133793A JP3263180B2 (en) | 1993-05-07 | 1993-05-07 | Phenolic resin molding material and molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13133793A JP3263180B2 (en) | 1993-05-07 | 1993-05-07 | Phenolic resin molding material and molded article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06322239A true JPH06322239A (en) | 1994-11-22 |
| JP3263180B2 JP3263180B2 (en) | 2002-03-04 |
Family
ID=15055586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13133793A Expired - Lifetime JP3263180B2 (en) | 1993-05-07 | 1993-05-07 | Phenolic resin molding material and molded article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3263180B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001089634A (en) * | 1999-09-22 | 2001-04-03 | Mitsui Chemicals Inc | Phenolic resin molding material |
-
1993
- 1993-05-07 JP JP13133793A patent/JP3263180B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001089634A (en) * | 1999-09-22 | 2001-04-03 | Mitsui Chemicals Inc | Phenolic resin molding material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3263180B2 (en) | 2002-03-04 |
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