JPS582080A - Lamp - Google Patents
LampInfo
- Publication number
- JPS582080A JPS582080A JP56099722A JP9972281A JPS582080A JP S582080 A JPS582080 A JP S582080A JP 56099722 A JP56099722 A JP 56099722A JP 9972281 A JP9972281 A JP 9972281A JP S582080 A JPS582080 A JP S582080A
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- outer shell
- lead wire
- contact
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【発明の詳細な説明】
本発明は、ブラケットに抜挿自在として取り付けられる
ランプに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lamp that is removably attached to a bracket.
この種のランプは、ブラケットの接点と接触されるラン
プ側接点を有しており、この接点として従沫においては
、ランプの発光体と接続されるリード線を外部に導出し
、その−１ま折り返して接点とするタイプのものと、外
部に導出されたリード線に別途用意された接点金具を半
田づけしたタイプのものとがあった。前者はコスト的に
有利であるが機械的な強度に問題があり接点不良金招き
易く、信頼性が低いという問題点があり、一方後者は機
械的な強度に問題はないが、接点金具を別途用意する必
要があるためと、半田づけする作業が必要であることか
らコスト的に不利であると共に、小さなランプにあって
は製造作業が非常に煩雑となる問題点があった。This type of lamp has a lamp-side contact that comes into contact with a contact on the bracket, and as this contact, a lead wire connected to the light emitting body of the lamp is led outside, and the -1 or There were two types: one type that was folded back to form a contact, and another type that had separately prepared contact fittings soldered to the lead wire led outside. The former is advantageous in terms of cost, but has problems with mechanical strength, is prone to contact failure, and has low reliability.On the other hand, the latter has no problems with mechanical strength, but requires separate contact fittings. This is disadvantageous in terms of cost because it requires preparation and soldering work, and also has the problem that manufacturing work is extremely complicated for small lamps.
本発明は以上のような点に鑑みて成されたものであり、
ランプの発光体と接続される一対のＩＪ−ド線の夫々に
、予じめリード線の長さ方向と直交する方向に突出する
突出部を形成し、この突出部をリード線が内包される外
殻の外側面より突出させ、この突出部を直接ランプ側接
点とすることにより、上述した従来の各問題点を克服し
、機械的に十分な強度を有する信頼性の高いランプであ
ゆながら低コストで提供できるようにすることを目的と
するものである。The present invention has been made in view of the above points,
A protrusion that protrudes in a direction perpendicular to the length direction of the lead wire is formed in advance on each of the pair of IJ-do wires connected to the light emitting body of the lamp, and the lead wire is enclosed in the protrusion. By protruding from the outer surface of the outer shell and using this protrusion as a direct contact point on the lamp side, each of the above-mentioned conventional problems can be overcome, and a highly reliable lamp with sufficient mechanical strength can be achieved while remaining low. The purpose is to make it possible to provide it at a low cost.
次に、本発明を図示の一実施例について説明する。この
実施例は発光体としてＬＥＤ ？用いた例を示しており
、第１図は本発明に係るランプの斜視図、第２図は同正
面図、第３図は同背面図である。Next, the present invention will be described with reference to an illustrated embodiment. Does this example use LED as the light emitter? 1 is a perspective view of a lamp according to the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a rear view thereof.
図中ｌがＬＥＤランプで、該ＬＥＤランプ１は、その先
端に設けられる反射器２と、この反射器２より導出され
るリード線を内包する外殻３とで構成されている。上記
反射器２は第４図の断面図に示すように円板状の底部２
−ａ−と輪状の外周壁部２ｂとが一体に形成された略回
転体形状とされており、その外周壁部２ｂの内側壁２Ｃ
は内底面２ｄより外方に向けて広けられてなるチー、Ｓ
を有し、内側壁２Ｃと回転体の回転軸とのなす角θは３
０ｃとされている。さらに、上記反射器２内には、リー
ド線４．５が埋設されていると共に、該リード線４゜５
の一部であ−るリード端子面４ａ、５ａが内底面２ｄに
表出されており、これによりリード端子面４ａ、５ａと
内底面２ｄとは同一平面上に位置されている。また、上
記リード端子面４ａ、５ａと同様にして該リード端子面
４ａ、５ａの両側にはマウント端子面６，７が表出され
ており、このマウント端子面６．７上と」二記リード端
子面５ａ上には発光体としての第１乃至第４の発光ダイ
オードチップ゛Ｄ１〜Ｄ４がポンディングされている。In the figure, l denotes an LED lamp, and the LED lamp 1 is composed of a reflector 2 provided at the tip thereof, and an outer shell 3 that encloses a lead wire led out from the reflector 2. The reflector 2 has a disk-shaped bottom 2 as shown in the cross-sectional view of FIG.
-a- and a ring-shaped outer circumferential wall 2b are integrally formed into a substantially rotating body shape, and an inner wall 2C of the outer circumferential wall 2b
is a chi formed by expanding outward from the inner bottom surface 2d, S
The angle θ between the inner wall 2C and the rotation axis of the rotating body is 3.
It is said to be 0c. Furthermore, a lead wire 4.5 is embedded in the reflector 2, and the lead wire 4.5 is
The lead terminal surfaces 4a, 5a, which are a part of the inner bottom surface 2d, are exposed on the inner bottom surface 2d, so that the lead terminal surfaces 4a, 5a and the inner bottom surface 2d are located on the same plane. Further, in the same way as the lead terminal surfaces 4a, 5a, mount terminal surfaces 6, 7 are exposed on both sides of the lead terminal surfaces 4a, 5a, and on the mount terminal surfaces 6.7 and 2. First to fourth light emitting diode chips D1 to D4 as light emitters are bonded onto the terminal surface 5a.
上言己第１乃至第４のダイオードチップＤ、〜Ｄ４のな
かで第１のダイオードチップＤ１は上記一方のマウント
端子面６上にポンディングされ、第２及び第４のダイオ
ードチップＤ２．Ｄ４はリード端子面５ａ上にボンティ
ングされ、。第３のダイオードチップＤ３は他方のマウ
ント端子面７上にポンディングされており、各ダイオー
ドチップＤＩ、Ｄ２．Ｄ３．Ｄ４は略正方形の各頂点に
位置するようにして配置されている。さらに、リード端
子面４ａと第１のダイオードチップＤ１との間、マウン
ト端子面６と第２の夕。Among the first to fourth diode chips D, to D4, the first diode chip D1 is bonded onto the one mount terminal surface 6, and the second and fourth diode chips D2. D4 is bonded onto the lead terminal surface 5a. A third diode chip D3 is bonded onto the other mounting terminal surface 7, and each diode chip DI, D2 . D3. D4 is arranged so as to be located at each vertex of a substantially square. Further, between the lead terminal surface 4a and the first diode chip D1, and between the mount terminal surface 6 and the second diode chip D1.
イオードチップＤ２との間、リード端子面４ａと第３の
ダイオードチップＤ、との間、及びマウント端子面７と
第４のダイオードチップＩ）、との間は、それぞれ金属
細線Ｗにより接続されており、これを回Ｗｆ’を図で表
わしたのが第５図（Ｂ）であって、すなわち、それぞれ
、直列に接続された第１及び第２のダイオードチップＤ
、、Ｄ、と、第３及び第４のダイオードチップＤ３．
Ｄ４が、並列に接続された構成とされている。さらに、
Ｆ記反射Ｉ′１１１２の外部側におけるリード線４の途
中には、セラミック板８上に抵抗導体９が被着された被
膜抵抗器より成る抵抗Ｒが設けられており、この抵抗Ｒ
は上記ダイオードチップＤＩ、Ｄ２．Ｄ：１． Ｄ４に
対して直列に接続されている。また−Ｆ配向底面２ｄと
内壁部２Ｃとで作られた空間には、上記各ダイオードチ
ップＤ１〜Ｄ４を被覆するようにして透明樹脂が充填さ
れ、ライトガイド部１０が形成されており、このライト
ガイド部ＩＯの前端部は中央が***され、凸レンズ状と
されている。Connections are made between the diode chip D2, between the lead terminal surface 4a and the third diode chip D, and between the mount terminal surface 7 and the fourth diode chip I) by thin metal wires W. FIG. 5(B) shows this diagrammatically as the time Wf', that is, the first and second diode chips D connected in series, respectively.
, ,D, and third and fourth diode chips D3.
D4 are connected in parallel. moreover,
A resistor R consisting of a film resistor in which a resistive conductor 9 is deposited on a ceramic plate 8 is provided in the middle of the lead wire 4 on the outside of the reflection I'1112.
are the diode chips DI, D2. D:1. Connected in series to D4. Further, the space created by the -F orientation bottom surface 2d and the inner wall portion 2C is filled with a transparent resin so as to cover each of the diode chips D1 to D4, and a light guide portion 10 is formed. The front end of the guide portion IO is raised at the center and has a convex lens shape.
一方、上記反射器２の背部に設けられる外殻３は、円筒
状のリード線通挿部３ａと、該リード線通挿部３ａの後
端から後方に突出形成される接点保持部３ｂを有してお
り、この接点保持部３ｂは略長方体状とされ、該接点保
持部３ｂの外側面より−Ｅ記リード線４．５に形成され
ている突出部４ｂ。On the other hand, the outer shell 3 provided on the back of the reflector 2 has a cylindrical lead wire insertion part 3a and a contact holding part 3b formed to protrude rearward from the rear end of the lead wire insertion part 3a. The contact holding part 3b has a substantially rectangular parallelepiped shape, and a protruding part 4b is formed at the -E lead wire 4.5 from the outer surface of the contact holding part 3b.
５ｂが突出した状態で保持されている。上記外殻３はこ
の実施例では半割嵌着形とされてお９、すなわち第６図
、第７図に示すように外殻３は前後方向に沿って二つに
分割され、分割された一方が外殻雄部１１、他方が外殻
雌部１２とされている。5b is held in a protruding state. In this embodiment, the outer shell 3 is of a half-fitting type 9, that is, as shown in FIGS. 6 and 7, the outer shell 3 is divided into two along the front and back direction. One side is a male outer shell part 11 and the other side is a female outer shell part 12.
上記外殻雄部１１及び外殻雌部１２の内側には、その先
端側に前記反射器２の背部が嵌入して接合される接合開
口１３と、反射器２の位置決めを行う係止部１４が形成
され、この係止部１４の背部側は仕切板１５により左右
に仕切られたリード線通挿空間１６ａ、１６ｂとされて
おり、前記接点保持部３ｂと対応する位置における外殻
雄部１１と外殻雌部１２の夫々には、前記リード線４，
５の一部と突出部４ｂ、５ｂが嵌入されるスリット１７
．１８が形成され、該スリット１７．１８の一部は接点
保持部３ｂの外側面に至るスリット開口１７ａ、＋８ａ
とされている。さらに外殻雄部１１ （ｔｉｌ＋には外
殻雌部１２方向に突出する結合ビン１９．１９が形成さ
れ、外殻雌部１２側にはその結合ビン１９．１９が嵌着
される結合孔２０ 、２０が形成されている。しかして
上記外殻雄部１１と外殻雌部１２とが前記反射器２及び
リード線４，５を挾み込むようにして嵌着されて、接合
開口１３には反射器２が位置され、リード線通挿空間１
６ａ。Inside the male outer shell part 11 and the female outer shell part 12, there is a joining opening 13 on the tip side thereof into which the back part of the reflector 2 is fitted and joined, and a locking part 14 for positioning the reflector 2. The back side of this locking part 14 is formed into lead wire passage spaces 16a and 16b partitioned left and right by a partition plate 15, and the outer shell male part 11 at a position corresponding to the contact holding part 3b is formed. and outer shell female part 12, respectively, the lead wires 4,
5 and the protrusions 4b, 5b are fitted into the slit 17
．． 18 is formed, and a part of the slit 17.18 is slit opening 17a, +8a reaching the outer surface of the contact holding part 3b.
It is said that Further, a coupling bottle 19.19 is formed in the outer shell male part 11 (til+) and protrudes in the direction of the outer shell female part 12, and a coupling hole 20 in which the coupling bottle 19.19 is fitted is formed on the outer shell female part 12 side. . The lead wire insertion space 1
6a.
１６ｂにはリード線４，５及び抵抗Ｒが収納されると共
に、スリット開口１７ａ、１８ａからは突出部４ｂ、５
ｂが外方に向けて突出されている。The lead wires 4 and 5 and the resistor R are housed in the slit openings 17a and 18a, and the protrusions 4b and 5 are inserted into the slit openings 17a and 18a.
b protrudes outward.
さらに、この突出部４ｂ、５ｂにはその一部が切り欠か
れて位置決め係合部２１．２１とされており、また、上
記リード線通挿部３ａにおける外周壁部にはＬＥＤラン
プ１の取り外し操作時に用いられる係合溝２２が形成さ
れている。Further, a part of the protruding parts 4b, 5b is cut out to form a positioning engagement part 21.21, and an outer peripheral wall part of the lead wire insertion part 3a is provided with a part for removing the LED lamp 1. An engagement groove 22 used during operation is formed.
上記ＬＥＤランプｌは第１２図に示すようにプラタン）
Ｂに抜挿自在と１．て装着されるものであり、このプラ
タン）Ｂはランプ挿入孔３０とこの挿入孔３０内に形成
されるブラケット接点３１．３２を有１７、該ブラケッ
ト接点３］、３２の先端には前記位置決め係合部２１．
２１と係合される係合突部３１ａ、３２ａが形成され、
他端はブラケットＢの外部に導出されて接続端子部３１
ｂ、３２ｂとされている。しかしてＬＥＤランプｌがブ
ラケットＢ内に装着された状態においては、前記突出部
４ｂ。The above LED lamp l is shown in Fig. 12)
1. Can be freely inserted into and removed from B. This platen) B has a lamp insertion hole 30 and bracket contacts 31 and 32 formed in the insertion hole 30, and the ends of the bracket contacts 3 and 32 are provided with the positioning locks. Joint section 21.
Engagement protrusions 31a and 32a that are engaged with 21 are formed,
The other end is led out to the outside of the bracket B and is connected to a connecting terminal portion 31.
b, 32b. Thus, when the LED lamp l is installed in the bracket B, the protruding portion 4b.
５ｂがランプ側接点として、上記ブラケット接点３１．
３２と接触され、電気的な接続が成されており、ＬＥＤ
ランプｌは上記位置決め係合部２１゜２１と係合突部３
１ａ、３２ａとの係合により抜は止めが成されている。5b is the lamp side contact, and the bracket contact 31.5b is the lamp side contact.
32, an electrical connection is made, and the LED
The lamp 1 is connected to the positioning engagement portion 21゜21 and the engagement protrusion 3.
Removal is prevented by engagement with 1a and 32a.
次に、上述した構成によるＬＥＤランプの製法を説明す
る。Next, a method for manufacturing an LED lamp with the above-described configuration will be explained.
まず、第８図に示すリードフレーム２３を作成する。こ
のリードフレーム２３は、金属薄板にその不要部分を取
り除いて、前記外部リード線４゜５と、リード端子面４
ｍ、５ａと、マウント端子面６，７と、電子素子接続部
２４と、支持枠部２５と、を一体に形成したものであり
、・この各部拐を有するリードフレーム２３は図示のよ
うに多数枚並設されるようにしてパンチプレス等により
形成されるものである。First, a lead frame 23 shown in FIG. 8 is created. This lead frame 23 is made by removing unnecessary parts from a thin metal plate and connecting the external lead wire 4.5 and the lead terminal surface 4.
m, 5a, mount terminal surfaces 6, 7, electronic element connection portion 24, and support frame portion 25 are integrally formed, and the lead frame 23 having each of these parts is formed in a large number as shown in the figure. They are formed by a punch press or the like so that they are arranged side by side.
次に、第８図に一点鎖線Ｓで示した箇所に、第９図に示
す金型２６，２７を挾持させて、該金型２．６．２７に
溶融したプラスチック材を注入する。Next, the molds 26 and 27 shown in FIG. 9 are held between the positions indicated by the dashed line S in FIG. 8, and the molten plastic material is injected into the molds 2, 6, and 27.
ヒ記金型２６側には、前記反射器２の外周壁部２ｂに対
応する型２６ａが形成され、他方の金型２７側には、反
射器２の底部２ａに対応する型２７ａとスプルー２７ｂ
が形成されている。A mold 26a corresponding to the outer peripheral wall 2b of the reflector 2 is formed on the mold 26 side, and a mold 27a corresponding to the bottom 2a of the reflector 2 and a sprue 27b are formed on the other mold 27 side.
is formed.
また、上記金型２６．２７に注入されるプラスチック材
として、ポリサルホン熱可塑性樹脂又はポリエステル熱
可塑性樹脂あるいはエポキシ熱硬化性樹脂に、光反射剤
として酸化チタン（Ｔ １０２ ） ＋酸化アルミニウ
ム（Ａｔ、ｚ ０３ ）、二酸化ケイ素（８ｉ （Ｊ２
） 。Furthermore, as the plastic material injected into the molds 26 and 27, titanium oxide (T 102 ) + aluminum oxide (At, z 03 ), silicon dioxide (8i (J2
).
炭酸力ルンウム（ＣａＣ０３）の少なくともいずれかを
５チル４０％混入した材料が用いられている。A material containing 40% of at least one of carbonic acid carbonate (CaC03) is used.
こうして、リードフレーム２３には、上記インサート成
形により第１０図に示すように反射器１１が形成され、
この状態で前記電子素子接続部２４に抵抗Ｒを半田づけ
等により取り付ける。次に、上記リードフレーム２３の
支持枠部２５を切除１７て第１１図に示すように外部リ
ード線４．５と、反射器２と、抵抗Ｒと、突出部４ｂ、
５ｂのみを残した状態とする。次に、リード線４．５を
後方に折曲させ、各端子面５ａ、５ｂ、６．７にダイオ
ードチップＤ、〜Ｄ４をポンディングする。しかして第
６図に示すように外筐３のリード線通挿空間１６ａ、１
６ｂ内にリード線４．５と抵抗Ｒを入れ、スリット１７
．１８内に突出部４ｂ、５ｂを挿入するようにして外殻
雄部１１と外殻雌部１２を嵌着させると、第１図に示す
ＬＥＤランプｌが構成され、突出部４ｂ、５ｂはスリッ
ト開口１７ａ。In this way, the reflector 11 is formed on the lead frame 23 by the insert molding as shown in FIG.
In this state, a resistor R is attached to the electronic element connecting portion 24 by soldering or the like. Next, the support frame portion 25 of the lead frame 23 is cut out 17, and as shown in FIG. 11, the external lead wire 4.5, the reflector 2, the resistor R, the protruding portion 4b,
Only 5b remains. Next, the lead wire 4.5 is bent backward, and the diode chips D, -D4 are bonded to each terminal surface 5a, 5b, 6.7. Therefore, as shown in FIG. 6, the lead wire insertion spaces 16a, 1
Insert lead wire 4.5 and resistor R into 6b, and insert slit 17.
．． When the outer shell male part 11 and the outer shell female part 12 are fitted by inserting the protrusions 4b and 5b into the LED lamp 1 shown in FIG. Opening 17a.
１８ａより突出した状態で保持される。It is held in a state protruding from 18a.
次に、上述した構成によるＬＥＤランプ１の作用を説明
する。Next, the operation of the LED lamp 1 having the above-described configuration will be explained.
ダイオードチップＤ、〜Ｄ４より発光された光は、ライ
トガイド部１０を透過して外部に取り出されるのである
が、ライトガイド部１０内で反射される光においても、
内底面２ｄと内壁面２Ｃとの間は継ぎ目の々い連続状と
されているのでライトガイト部１０内での減衰はきわめ
て少ないものとなっている。The light emitted from the diode chips D, ~D4 passes through the light guide section 10 and is extracted to the outside, but the light reflected within the light guide section 10 also
Since the inner bottom surface 2d and the inner wall surface 2C are seamlessly continuous, attenuation within the light guide portion 10 is extremely small.
壕だ、スリット開口１７ａ、１８ａより突出されている
突出部４ｂ、５ｂは、外殻３の接点保持％ＪＳ３ｂによ
り確実に保持されていると共に、外殻３内に収納されて
いるリード線４．５と一体とされているので抜けたり位
置がずれたりするおそれがなく、構造的に機械的強度が
非常に強いものとなっている。The protrusions 4b and 5b protruding from the trenches and slit openings 17a and 18a are securely held by the contact holding part JS3b of the outer shell 3, and the lead wires 4. Since it is integrated with 5, there is no risk of it falling out or shifting its position, and the structure has extremely strong mechanical strength.
また、リード線４の途中にはダイオードチップＩ〕１〜
Ｄ、の電流を制御する電子素子として抵抗Ｒが１１Ｖ、
り付けられているので、その抵抗Ｒの抵抗値を村−々設
定すれば種々の定格のＬＥＤランプを構成することがで
きる。In addition, in the middle of the lead wire 4, there are diode chips I]1 to
The resistor R is 11V as an electronic element that controls the current of D,
Since the resistance value of the resistor R is set individually, LED lamps with various ratings can be constructed.
なお、上述した実施例では電子素子として竺抗Ｉ（が用
いられているが、この電子素子としてフォトダイオード
を用いれば外界に卯じてダイオードチップＤ、〜Ｄ４の
発光輝窒を自動調整させることができ、また、その電子
素子としてＩ−Ｃを用いれば自動点滅等、種々の動作を
行わせることができる。Incidentally, in the above-described embodiment, a resistor I is used as the electronic element, but if a photodiode is used as the electronic element, the luminous intensity of the diode chips D and D4 can be automatically adjusted according to the outside world. Furthermore, if an IC is used as the electronic element, various operations such as automatic blinking can be performed.
以上説明したように本発明によれば、ランプの発光体と
接続される一対のリード線の夫々に、予じめリード線の
長さ方向と直交する方向に突出する突出部を形成し、こ
の突出部をリード線が内包される外殻の外側面より突出
させ、この突出部を直接ランプ側接点としたので、その
ランプ側接点は外殻により強度的に充分保護され、ブラ
ケットへの着脱操作を繰り返しても接点不良を招くおそ
れがなく信頼性が大きく向上する効果がある。また、リ
ード線と一体に形成される突出部を直接、ランプ側接点
としたので他の接点金具を用いる必要がなく、コスト的
に非常に有利となる効果があると共に、組立製造作業が
容易となり、作業能率が大幅に向上する効果がある。As explained above, according to the present invention, each of the pair of lead wires connected to the light emitting body of the lamp is formed in advance with a protrusion that protrudes in a direction perpendicular to the length direction of the lead wire. The protruding part is made to protrude from the outer surface of the outer shell in which the lead wire is enclosed, and this protruding part is used as a direct lamp-side contact, so the lamp-side contact is sufficiently protected by the outer shell, making it easy to attach and remove it from the bracket. Even if the process is repeated, there is no risk of contact failure, and reliability is greatly improved. In addition, since the protrusion formed integrally with the lead wire is used as a direct contact on the lamp side, there is no need to use other contact metal fittings, which is extremely advantageous in terms of cost, and also simplifies assembly and manufacturing work. , which has the effect of significantly improving work efficiency.
なお、本発明は、上述した実施例に限定されるものでは
なく、その要旨を変更しない範囲で種々変形して実施で
き、るものであり、発光体としてタングステンフィラメ
ントを用いる構成としても良い。It should be noted that the present invention is not limited to the embodiments described above, but can be implemented with various modifications without changing the gist thereof, and a configuration may be adopted in which a tungsten filament is used as the light emitting body.
図は本発明に係るランプの一実施例を示すものであり、
第１図１ｄＬＥＤランプを示す斜視図、第２１）＋ （
７ｆ、回正面図、第３図は同背面図、第４図は第２１）
ＩのＩ −ＩＩ線における反射器の部分を示す断面図、
第５図（Ａ） （Ｂ）は電気的な構成を示す説明図及び
回路図、第６図は第１図の分解斜視図、笛７図は第６図
の外殻雄部を逆方向から見た斜視図、第８図はＬ ｌ＝
： Ｄランプの製法に用いられるリードフレームの・に
面図、第９図はい０（Ｂ）は同金型を示す断面図、第１
０図はリードフレームに取り付けられた反射Ｊｌｎ）ｌ
び抵抗を示す斜視図、第１１図は同リードフレームの支
持枠部を取り除いた状態を示す斜視図、第１２図はＬＥ
Ｄランプがブラケットに装着された状態を示すブラケッ
トの断面図である。
Ｉ ・・ランプとしてのＬＥＤランプ、３・・・外殻、
４・５・・リード線、４ｂ、５ｂ・・・ランプ側接点と
される突出部、１７ａ、１８ａ・・・スリット開口、３
１．３２・・・ブラケットの接点、Ｄ、−Ｄ、・・発光
体としての発光ダイオード、Ｂ・・ブラケット。
第８図
５ｈ
第９図（Ａ）
第９１１（８）−The figure shows an embodiment of the lamp according to the present invention,
Fig. 1 is a perspective view showing a 1d LED lamp, Fig. 21) + (
7f, front view, Figure 3 is the rear view, Figure 4 is Figure 21)
A cross-sectional view showing a portion of the reflector along line I-II of I,
Figures 5 (A) and (B) are explanatory diagrams and circuit diagrams showing the electrical configuration, Figure 6 is an exploded perspective view of Figure 1, and Figure 7 shows the male part of the outer shell in Figure 6 from the opposite direction. The perspective view shown in FIG. 8 is L l=
: A side view of the lead frame used in the manufacturing method of the D lamp, Figure 9 (B) is a cross-sectional view showing the same mold, Figure 1
Figure 0 shows the reflection mounted on the lead frame.
FIG. 11 is a perspective view showing the lead frame with the support frame removed, and FIG. 12 is a perspective view showing the lead frame with the support frame removed.
FIG. 3 is a cross-sectional view of the bracket showing a state in which the D lamp is attached to the bracket. I...LED lamp as a lamp, 3...Outer shell,
4, 5...Lead wires, 4b, 5b...Protrusions serving as lamp side contacts, 17a, 18a...Slit openings, 3
1.32...Bracket contacts, D, -D,...Light emitting diode as a light emitter, B...Bracket. Figure 8 5h Figure 9 (A) 911(8)-
Claims (1)
ランプであって、ランプの発光体と接続される一対のリ
ード線の夫々は、該リード線の長さ方向と直交する方向
に予じめ突設された突出部を有しており、この突出部は
上記リード線が内包される外殻の外側面より突出されて
、上記ブラケットへの挿入時にブラケットの接点と接触
されるランプ側接点とされている構成になることを特徴
とするランプ。 （２）前記外殻は、外側面に至る一対のスリット開口が
形成されている半割嵌着形とされ、この外殻の組み付は
時に上記スリット開口より前記突出部が突出される構成
になる特許請求の範囲第１項記載によるう／ブ。[Scope of Claims] (]) A lamp that is removably attached to a bulb, in which each of a pair of lead wires connected to the light emitting body of the lamp extends in a direction perpendicular to the length direction of the lead wire. The lamp has a protruding portion provided in advance, and this protruding portion protrudes from the outer surface of the outer shell in which the lead wire is contained, and comes into contact with a contact point of the bracket when inserted into the bracket. A lamp characterized by having a configuration with a side contact. (2) The outer shell is of a half-fitting type in which a pair of slit openings extending to the outer surface are formed, and the outer shell is sometimes assembled so that the protrusion protrudes from the slit opening. The software according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56099722A JPS582080A (en) | 1981-06-29 | 1981-06-29 | Lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56099722A JPS582080A (en) | 1981-06-29 | 1981-06-29 | Lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS582080A true JPS582080A (en) | 1983-01-07 |
| JPS6244839B2 JPS6244839B2 (en) | 1987-09-22 |
Family
ID=14254961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56099722A Granted JPS582080A (en) | 1981-06-29 | 1981-06-29 | Lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582080A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037261U (en) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | Heat dissipation structure of light emitting part of light emitting diode lamp |
| JPS6092851U (en) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | Light emitting part of light emitting diode lamp |
| JPH0311771A (en) * | 1989-05-31 | 1991-01-21 | Siemens Ag | Opto-device to which surface mounting is enabled |
| US5396086A (en) * | 1993-08-24 | 1995-03-07 | Dialight Corporation | LED spacer assembly |
| WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
| US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
-
1981
- 1981-06-29 JP JP56099722A patent/JPS582080A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5257797A (en) * | 1975-10-31 | 1977-05-12 | Western Electric Co | Light emitting display unit |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6037261U (en) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | Heat dissipation structure of light emitting part of light emitting diode lamp |
| JPS6092851U (en) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | Light emitting part of light emitting diode lamp |
| JPH0311771A (en) * | 1989-05-31 | 1991-01-21 | Siemens Ag | Opto-device to which surface mounting is enabled |
| US5396086A (en) * | 1993-08-24 | 1995-03-07 | Dialight Corporation | LED spacer assembly |
| WO2002089222A1 (en) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
| US7380961B2 (en) | 2002-04-24 | 2008-06-03 | Moriyama Sangyo Kabushiki Kaisha | Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244839B2 (en) | 1987-09-22 |
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