JPS58192747A - Apparatus for measuring precise dimension - Google Patents
Apparatus for measuring precise dimensionInfo
- Publication number
- JPS58192747A JPS58192747A JP57074129A JP7412982A JPS58192747A JP S58192747 A JPS58192747 A JP S58192747A JP 57074129 A JP57074129 A JP 57074129A JP 7412982 A JP7412982 A JP 7412982A JP S58192747 A JPS58192747 A JP S58192747A
- Authority
- JP
- Japan
- Prior art keywords
- detector
- distance
- polishing
- surface plate
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 abstract description 8
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- -1 Fephite Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、フッピングやメカノケミカルポリッシング
等の加工中に、被加工材の厚みの微小変化を非接触で連
続して精密に測定する装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus that continuously and precisely measures minute changes in the thickness of a workpiece in a non-contact manner during processes such as flapping and mechanochemical polishing.
磁気ヘッド用材料として、パーマロイ、フエフイト、セ
ンダスト等が用いられ、磁気特性、耐摩耗性、精密加工
性等の点から各々特徴を有し、記録波長、メディアとの
関係や磁気ヘッドの用途によって使い分けられている。Permalloy, Fephite, Sendust, etc. are used as materials for magnetic heads, and each has its own characteristics in terms of magnetic properties, wear resistance, precision machinability, etc., and they are used depending on the recording wavelength, relationship with the media, and purpose of the magnetic head. It is being
また今日、オーディオ、ビデオおよびコンピューター用
の磁気ヘッドは磁気記録密度の向上が求められており、
１．Ｃ，テクノロジーを用いて製造する薄膜磁気ヘッド
がこれに最適であると考えられている。Today, magnetic heads for audio, video, and computers are required to have higher magnetic recording densities.
1. A thin film magnetic head manufactured using C. technology is considered to be optimal for this purpose.
例えば薄膜磁気ヘッド用基板には、メタルよりもフェラ
イトが適しており、またかかる基板上には磁気回路を構
成する磁性材料及び非磁性材料あるいは磁界検出用のＬ
素子等をメッキ、蒸着、スノ（ツタ−等で形成するため
、要求される基板表面の平滑性及び厚み寸法精度が厳し
く、さらにフエフイト磁性基板の磁気特性を向上させる
ために表面の無歪加工が要求される。For example, ferrite is more suitable than metal for a substrate for a thin film magnetic head, and magnetic and nonmagnetic materials constituting a magnetic circuit or L for magnetic field detection are used on such a substrate.
Since the elements are formed by plating, vapor deposition, slats, etc., the smoothness and thickness accuracy of the substrate surface are required, and in order to improve the magnetic properties of the FFT magnetic substrate, strain-free processing of the surface is required. required.
上記の加工方法として、従来はダイヤモンド微粉を砥粒
とする機械研摩が多用されているが、研摩加工中におい
て被加工材の厚みの測定ができないため、厚み測定の場
合はその都度研摩機を停止させ、被加工材を取外して洗
浄後、電子マイクロメータ等で実測するか、あるいは予
め特定時間内での研摩条件と被加工材の研摩量、研摩厚
みとの関係を求め、研摩時間より研摩量又は研摩厚みを
推定した。Conventionally, mechanical polishing using fine diamond powder as abrasive grains has been widely used as the above processing method, but since the thickness of the workpiece cannot be measured during the polishing process, the polishing machine is stopped each time the thickness is measured. After removing the workpiece and cleaning it, measure it using an electronic micrometer or the like, or find the relationship between the polishing conditions and the amount of polishing and polishing thickness of the workpiece within a specific time, and calculate the amount of polishing from the polishing time. Or the polishing thickness was estimated.
従って、研摩加工時に数回に及ぶ厚み測定のたびに被加
工材の洗浄作業及び研摩機の休止等のため、多大の工程
を必要とし作業能率が悪く、磁気ヘッド製造工種々の問
題を生じていた。Therefore, each time the thickness is measured several times during polishing, a large number of steps are required, such as cleaning the workpiece and stopping the polishing machine, resulting in poor work efficiency and various problems for the magnetic head manufacturer. Ta.
この発明は、かかる現状に鑑み、フッピングやメカノケ
ミカルポリッシング等において、被加工材の１μｍ以Ｆ
の微少研摩量を非接触連続的にかつ高精度で測定する測
定装置を提案することを目的とする。In view of the current situation, this invention has been developed to provide a method for flapping, mechanochemical polishing, etc.
The purpose of this study is to propose a measuring device that continuously and highly accurately measures the minute amount of polishing in a non-contact manner.
すなわち、この発明は、ラップ定盤に対向させる下面に
被加工材を固着し、上面に錘を載置した固定リングの中
心部に軸承を介して距離検出器を上記ラップ定盤と特定
距離をもって固定し、この固定リング外周に間隙を介し
てフラグ定盤上に修正リングを載置し、研摩加工時の被
加工材とラップ定盤との相対回転による被加工材の厚み
変化量を前記検出器によ炒検出測定することを要旨とす
る精密寸法測定装置である。That is, in this invention, a workpiece is fixed to the lower surface facing the lap surface plate, and a distance detector is mounted at a specific distance from the lap surface plate through a bearing in the center of a fixing ring with a weight placed on the upper surface. A correction ring is placed on the flag surface plate with a gap around the outer periphery of the fixed ring, and the amount of change in the thickness of the workpiece due to the relative rotation between the workpiece and the lapping surface plate during polishing is detected as described above. This is a precision dimension measuring device whose main purpose is to detect and measure the temperature of a container.
この発明は、ラップ定盤上に、固定板下面に固着した被
加工材を当接させて両者を相対的に回転させ、研摩加工
を行なう装置において、固定リングの外周部に間隙を設
けて修正リングをラップ定盤上に載置し、固定リングの
中心孔部に軸承を介して距離検出器を固定し、これをラ
ップ定盤と特定距離をおいて対向させ、検出器に加工に
よって変化するラップ定盤との距離を検出測定させるも
のである。This invention is a device that performs polishing by bringing a workpiece fixed to the lower surface of a fixing plate into contact with the lower surface of a fixing plate on a lapping surface plate and rotating the two relative to each other. The ring is placed on a lap surface plate, a distance detector is fixed in the center hole of the fixed ring via a bearing, and this is opposed to the lap surface plate at a specific distance, and the detector is changed by machining. This is to detect and measure the distance to the lap surface plate.
検出器には、実施例で示す渦電流検出器のほか、超音波
方式、レーザーホログラフ方式等の非接触の直線距離検
出測定器のいずれのものも使用でき、測定精度を高める
ため複数の検出器を用いるのもよい。In addition to the eddy current detector shown in the example, any type of non-contact linear distance detection measuring device such as an ultrasonic method or a laser holographic method can be used as the detector, and multiple detectors may be used to improve measurement accuracy. It is also good to use
ま九、検出器の先端部とラップ定盤との所定距、ゆ、□
オ、□６．□０．□□２．９・′適宜設定される。9. Specified distance between the tip of the detector and the lap surface plate, □
E, □6. □0. □□2.9・' Set as appropriate.
この発明による測定装置は、ダイヤモンド砥粒によるフ
ッピングのほか、例えばｓｈｏ、等の微粉末の懸濁液を
使用したメカノケミカルポリッシング等、多種の研摩加
工方法に適用でき、被加工材料もセラミックや金属等多
種の材料に適用できる。The measuring device according to the present invention can be applied to various polishing methods such as flapping using diamond abrasive grains and mechanochemical polishing using a suspension of fine powder such as sho. It can be applied to various materials such as
以下圧、この発明による実施例を図面に基づいて説明す
る。ｓ１図は検出器に渦電流検出器を用いたこの発明に
よる測定装置の縦断説明図である。Embodiments of the present invention will be described below with reference to the drawings. Figure s1 is a longitudinal sectional view of a measuring device according to the present invention using an eddy current detector as a detector.
硬質クロスＩＳｎ＃ ガフス、セラミック等からなるラ
ップ定盤（１）上に、ステンレス等からなる固定リング
（３）を置くがＪ定すング（３）下面にはＭｎ−Ｚｎフ
ェライト、Ｎ１−ｚｎフェライトｎ７１７４１等セラミ
ック）を接着してあり、上面にはステンレス製の錘（４
）を載置してあり、ラップ定盤（１）上に被加工材（２
）が接触するように構成している。Hard cloth ISn# A fixing ring (3) made of stainless steel or the like is placed on a wrap surface plate (1) made of gaffs, ceramic, etc., and the lower surface of the J-fixing ring (3) is made of Mn-Zn ferrite or N1-zn ferrite. A stainless steel weight (4
) is placed on the lap surface plate (1), and the workpiece (2) is placed on the lap surface plate (1).
) are configured so that they are in contact with each other.
さらに、ラップ定盤（１）上に、固定リング（３）の外
周に所定の間隙を設けて、耐摩耗性材料からなるラップ
定盤（１）の平坦度修正のための修正リング（６）を、
定盤上に図示しない位置決め用の支持リングに保持させ
て周装置しである。Further, on the lap surface plate (1), a predetermined gap is provided around the outer periphery of the fixing ring (3), and a correction ring (6) for correcting the flatness of the lap surface plate (1) made of a wear-resistant material is provided. of,
The peripheral device is held on a surface plate by a positioning support ring (not shown).
この固定リング（３）の中心孔部には軸受等の軸承（６
）を挿着して渦電流検出器（７）がその先端をラップ定
盤（１）上面と所定の距離をもって対向するよう固定し
である。The center hole of this fixing ring (3) is provided with a bearing (6) such as a bearing.
) is inserted, and the eddy current detector (7) is fixed such that its tip faces the upper surface of the lap surface plate (1) at a predetermined distance.
上記の構成において研摩加工の場合、ラップ定盤（１）
を回転させると、修正りング（５）と供に錘（４）によ
り荷重された固定リング（３）の回転により被加工材（
２）は例えばダイヤモンド砥粒により研摩加工され、被
加工材（２）の厚みは減少していく。In the case of polishing with the above configuration, the lap surface plate (1)
When the fixing ring (5) and the fixing ring (3) loaded by the weight (4) rotate, the workpiece (
2) is polished using, for example, diamond abrasive grains, and the thickness of the workpiece (2) is reduced.
この際、回転リング（３）に軸承（６）を介して固定さ
れる渦電流検出器（７）の先端部と、ラップ定盤（１）
表面との距離が減少するにつれて、上記検出器（８）に
おける電圧が変動する。この変動電圧を研摩量に変換し
て直接記録針に記録させるか、あるいは上記変動電圧を
演算装置（８）に入力し、予め設定された被加工材の目
標研摩量と検出研摩量とを対比させて、研摩量が目標値
に達したとき、電気信号をラップ定盤駆動機の制御機（
９）に入力させ、駆動機を停止させて研摩を完了する。At this time, the tip of the eddy current detector (7) fixed to the rotating ring (3) via the bearing (6) and the lap surface plate (1)
As the distance to the surface decreases, the voltage at the detector (8) varies. Either convert this fluctuating voltage into a polishing amount and record it directly on the recording needle, or input the fluctuating voltage to the calculation device (8) and compare the detected polishing amount with the preset target polishing amount of the workpiece. When the amount of polishing reaches the target value, an electric signal is sent to the lap surface plate drive controller (
9) to stop the drive machine and complete the polishing.
次に、を述し九測定装置を用いて、第１表に示す研摩条
件で研摩加工を実施した場合の研摩時間。Next, we will describe the polishing time when polishing was carried out under the polishing conditions shown in Table 1 using a measuring device.
変動電圧及び研摩量との関係を測定した。その結果を第
２図に示す。The relationship between the varying voltage and the amount of polishing was measured. The results are shown in FIG.
すなわち、この発明による測定装置は、ヲツデ定盤の材
質にかかわらず±３μｍ以内の精度まで測定可能であり
、研摩能率向上と共Ｋ、検出電圧の演算処理により研摩
作業の自動制御が可能であし、工業生産に極めて有効で
ある。In other words, the measuring device according to the present invention can measure to an accuracy of within ±3 μm regardless of the material of the surface plate, improves polishing efficiency, and automatically controls the polishing work by calculating the detected voltage. , extremely effective in industrial production.
第 １ 表Chapter 1 Table
第１図はこの発明による測定装置の縦断説明図、第２図
は実施例装置を使用した被加工材の研摩時間と検出変動
電圧、研摩量との関係を示すグラフである。
図中、１・・・ヲツデ定盤、２・・・被加工材、３・・
・固定リング、４・・・錘、５・・・修正リング、６・
・・軸承、７・・・渦電流検出器、８・・・演算装置、
９・・・・制御機。
出願人 住友特殊金属株式会社FIG. 1 is a longitudinal sectional view of the measuring device according to the present invention, and FIG. 2 is a graph showing the relationship between the polishing time of a workpiece, the detected fluctuation voltage, and the amount of polishing using the embodiment device. In the figure, 1... wotsude surface plate, 2... workpiece material, 3...
・Fixing ring, 4... Weight, 5... Correction ring, 6.
... Bearing, 7... Eddy current detector, 8... Arithmetic device,
9...control machine. Applicant: Sumitomo Special Metals Co., Ltd.
Claims (1)
上面に錘を載置し九固定リングの中心部に軸承を介して
、距離検出器を、上記ラップ定盤と特定距離をもって固
着し、上記固定リングの外周に間隙を介してラップ定盤
上に修正リングを載置し、研摩加工時の被加工材とラッ
プ定盤との相対回転による被加工材の厚み変化量を上記
検出器により検出測定することを特徴とする精密寸法測
定装置。1. Fix the workpiece on the lower surface facing the lap surface plate,
A weight is placed on the top surface, and a distance detector is fixed to the lap surface plate at a specific distance through a bearing in the center of the fixing ring, and is placed on the lap surface plate with a gap around the outer periphery of the fixing ring. A precision dimension measuring device, characterized in that a correction ring is placed thereon, and the detector detects and measures the amount of change in thickness of the workpiece due to relative rotation between the workpiece and the lapping surface plate during polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57074129A JPS58192747A (en) | 1982-04-30 | 1982-04-30 | Apparatus for measuring precise dimension |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57074129A JPS58192747A (en) | 1982-04-30 | 1982-04-30 | Apparatus for measuring precise dimension |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58192747A true JPS58192747A (en) | 1983-11-10 |
Family
ID=13538267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57074129A Pending JPS58192747A (en) | 1982-04-30 | 1982-04-30 | Apparatus for measuring precise dimension |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58192747A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819500A1 (en) * | 1996-07-18 | 1998-01-21 | Speedfam Co., Ltd. | Automatic measuring apparatus |
| US6918815B2 (en) | 2003-09-16 | 2005-07-19 | Hitachi Global Storage Technologies Netherlands B.V. | System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
| US6939200B2 (en) | 2003-09-16 | 2005-09-06 | Hitachi Global Storage Technologies Netherlands B.V. | Method of predicting plate lapping properties to improve slider fabrication yield |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56146665A (en) * | 1980-04-14 | 1981-11-14 | Supiide Fuamu Kk | Lapping process and its device |
-
1982
- 1982-04-30 JP JP57074129A patent/JPS58192747A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56146665A (en) * | 1980-04-14 | 1981-11-14 | Supiide Fuamu Kk | Lapping process and its device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0819500A1 (en) * | 1996-07-18 | 1998-01-21 | Speedfam Co., Ltd. | Automatic measuring apparatus |
| US5969521A (en) * | 1996-07-18 | 1999-10-19 | Speedfam Co., Ltd. | Automatic measuring apparatus having a switching means to generate an output signal only when a sensor is positioned at a predetermined space |
| US6918815B2 (en) | 2003-09-16 | 2005-07-19 | Hitachi Global Storage Technologies Netherlands B.V. | System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
| US6939200B2 (en) | 2003-09-16 | 2005-09-06 | Hitachi Global Storage Technologies Netherlands B.V. | Method of predicting plate lapping properties to improve slider fabrication yield |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5722156A (en) | Method for processing ceramic wafers comprising plural magnetic head forming units | |
| JP4685734B2 (en) | Manufacturing method of magnetic head slider | |
| US5472371A (en) | Method and apparatus for truing and trued grinding tool | |
| JP3439129B2 (en) | Manufacturing method of magnetic head | |
| US7386935B2 (en) | Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field | |
| JPS58192747A (en) | Apparatus for measuring precise dimension | |
| CN102458763B (en) | Method for machining flat workpieces | |
| JPS58186559A (en) | Device for accurately measuring dimension | |
| US7147539B1 (en) | Head performance based nano-machining process control for stripe forming of advanced sliders | |
| JPS639943B2 (en) | ||
| US20150111468A1 (en) | Lapping Head with a Sensor Device on the Rotating Lapping Head | |
| JP2941317B2 (en) | Fixed size polishing processing method | |
| US6918815B2 (en) | System and apparatus for predicting plate lapping properties to improve slider fabrication yield | |
| JPS623412A (en) | Lapping device | |
| US10672423B2 (en) | Electronic test structures for one or more magnetoresistive elements, and related methods | |
| US6939200B2 (en) | Method of predicting plate lapping properties to improve slider fabrication yield | |
| US7147540B2 (en) | Magnetic head slider and method of manufacturing the same | |
| JP2003094327A (en) | Polishing device | |
| JPS63156650A (en) | Processing device for finishing disc | |
| JPS61192474A (en) | Chip polishing jig | |
| JPS6125766A (en) | Automatic fixed dimension finish mechanism for lapping | |
| JPS63140408A (en) | Grinding device for magnetic head | |
| JP2949982B2 (en) | Processing method of magnetic gap depth of thin film magnetic head | |
| JPS591148A (en) | Polisher | |
| JPH0639738A (en) | Ceramics tool and polishing device |