JPS58182811A - Condenser mounting structure - Google Patents
Condenser mounting structureInfo
- Publication number
- JPS58182811A JPS58182811A JP6527382A JP6527382A JPS58182811A JP S58182811 A JPS58182811 A JP S58182811A JP 6527382 A JP6527382 A JP 6527382A JP 6527382 A JP6527382 A JP 6527382A JP S58182811 A JPS58182811 A JP S58182811A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- mounting structure
- vibration
- substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は混成集積回路の一部として基板に取り付げたコ
ンデンサ取付構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capacitor mounting structure mounted to a substrate as part of a hybrid integrated circuit.
高電圧高周波用混成集積回路に内菫した高耐圧コンデン
サは電気信号により機械的振動を起しそれによる電気的
ノイズを発生することがわかってきた。これまで混成集
積回路への積層形のコンデンサの実装にあたっては、第
１図に示すように基板１の導体配線２にコンデンサ３０
両端の電也４を半田又は導電ペースト等の接着剤５によ
り接続することＫより取り付けていた。導体配線と接着
剤とは数１０μｍの厚みを有するためコンデンサの中央
部分と基板との間に空隙６が形成され、コンデンサ振動
を起こすものと考えられる。It has been found that high-voltage capacitors incorporated in high-voltage, high-frequency hybrid integrated circuits cause mechanical vibrations due to electrical signals, which generate electrical noise. Until now, when mounting a multilayer capacitor on a hybrid integrated circuit, as shown in FIG.
It was attached by connecting the wires 4 at both ends with an adhesive 5 such as solder or conductive paste. Since the conductor wiring and adhesive have a thickness of several tens of micrometers, a gap 6 is formed between the center portion of the capacitor and the substrate, which is thought to cause the capacitor to vibrate.
本発明は上記した点にかんがみてなされたものであり、
その目的はコンデンサの撮動をなくすことによりノイズ
のない高電圧高周波用混成集積回路を提供することにあ
り、以下実施例にそって説明する。The present invention has been made in view of the above points,
The purpose is to provide a noise-free high-voltage, high-frequency hybrid integrated circuit by eliminating capacitor imaging, and will be described below with reference to embodiments.
第２図は本発明によるコンデンサ取付構造の一例を示す
。この例では基板１上の導体配線２に接着剤５を介して
接続された積層形コンデンサ３と基板１との間隙に振動
吸収性樹脂、例えばシリコーン系ゴム７を充填すること
によりコンデンサ本体の機械的振動を樹脂で吸収し、も
って信号入力により出力に電気的ノイズの発生を防止で
きる。FIG. 2 shows an example of a capacitor mounting structure according to the present invention. In this example, the gap between the multilayer capacitor 3 connected to the conductor wiring 2 on the board 1 via adhesive 5 and the board 1 is filled with vibration absorbing resin, for example, silicone rubber 7, so that the capacitor main body can be By absorbing physical vibrations with the resin, it is possible to prevent the generation of electrical noise in the output due to signal input.
なお、コンデンサと基板との間隙に樹脂を充填するには
熱溶融した樹脂を強制注入することにより可能である。Note that the gap between the capacitor and the substrate can be filled with resin by forcibly injecting hot molten resin.
第３図は本発明によるコンデンサ取付構造の他の例を示
す。この例では基板１上でコンデンサ３全体を覆うよう
に振動吸収性樹脂８を充分な厚さをもって形成したもの
である。この場合、コンデンサ３と基板１との間には依
然として閣ｌ！Ｊ６なのこすが、コンデンサ周囲を充分
な厚さの樹脂８で積っているために、コンデンサの機械
的振動をこの樹脂で吸収し、もってコンデンサ振動によ
る電気的ノイズの発生を防止できる。FIG. 3 shows another example of the capacitor mounting structure according to the present invention. In this example, the vibration absorbing resin 8 is formed on the substrate 1 with a sufficient thickness so as to cover the entire capacitor 3. In this case, there is still a gap between capacitor 3 and substrate 1! Since the J6 capacitor is surrounded by resin 8 of sufficient thickness, the mechanical vibration of the capacitor can be absorbed by this resin, thereby preventing the generation of electrical noise due to the capacitor vibration.
第４図は本発明によるコンデンサ取付構造の他の例をボ
す。この例では基板１とコンデンサ３０間隙に樹脂７な
充填すると同時に基板上でコンデンサを覆うように充分
の厚さの樹脂８を形成したものである。この場合、コン
デンサは上下隙間なく振動吸収性樹脂で榎われ同時に基
板とも機械的に一体に結合するから、コンデンサの機械
的振動なより強力に阻止し、コンデンサ振動による電気
的ノイズの発生な元金に近く防止する。FIG. 4 shows another example of the capacitor mounting structure according to the present invention. In this example, a resin 7 is filled in the gap between the substrate 1 and the capacitor 30, and at the same time, a resin 8 of sufficient thickness is formed on the substrate so as to cover the capacitor. In this case, the capacitor is covered with a vibration-absorbing resin without any vertical gaps, and is also mechanically connected to the board, so the mechanical vibration of the capacitor is more strongly inhibited, and the electrical noise caused by capacitor vibration is prevented. Prevent close to.
上記実施例でｈｓ個々のコンデンサに対し振動吸収性樹
脂で覆う形態を示したが、複数のコンデンサ及び他の電
子部品に対して同時に樹脂を被覆することもできる。In the above embodiment, each hs capacitor is covered with a vibration-absorbing resin, but a plurality of capacitors and other electronic components can be coated with the resin at the same time.
第５図はコンデンサを含む混成集積回路全体を振動吸収
性樹脂で覆って例を示すものである。同図において、９
はセラミック基板、１０髪末基板と一体に焼成されたセ
ラミック枠体、１１は枠体内より導出された外部メタラ
イズ配線でこの上に外部金属リードを接続することにな
る。１２は内部メメライズ配線、１３はコンデンサで、
図示されないがコンデンサ以外に半導体素子、抵抗等の
回路素子が同じ基板上に内蔵されている。１４は振動吸
収性樹脂でコンデンサを含む回路素子全体を榎うように
形成される。なおコンデンサのみに振動吸収性樹脂を限
定し、他の回路素子には篇出し又は他の樹脂で被覆する
ようにしてもよい。このセラミック枠体の上は金属キャ
ップで覆うのが普通であるが、振動吸収性樹脂で全面を
憶うことにより金属キャップを省略することができる。FIG. 5 shows an example in which the entire hybrid integrated circuit including a capacitor is covered with a vibration-absorbing resin. In the same figure, 9
10 is a ceramic frame body which is fired integrally with the ceramic substrate; 11 is an external metallized wiring led out from inside the frame body, and an external metal lead is connected thereon. 12 is internal memerized wiring, 13 is a capacitor,
Although not shown, in addition to the capacitor, circuit elements such as semiconductor elements and resistors are built on the same substrate. Reference numeral 14 is a vibration-absorbing resin formed so as to cover the entire circuit element including the capacitor. Note that the vibration-absorbing resin may be limited to only the capacitor, and other circuit elements may be coated or coated with other resins. The top of this ceramic frame is normally covered with a metal cap, but by covering the entire surface with vibration-absorbing resin, the metal cap can be omitted.
以上実施例で述べたように本発明によれば、コンデンサ
と基板との間に振動吸収性の樹脂を接触させることによ
ってコンデンサ振動を阻止し電気的ノイズの発生を防止
するに有効であり、高耐圧コンデンサを内蔵した高電圧
高周波用混成集積回路の実現が可能となった。As described in the embodiments above, according to the present invention, by bringing the vibration-absorbing resin into contact between the capacitor and the substrate, it is effective to block capacitor vibration and prevent the generation of electrical noise. It has become possible to realize a high-voltage, high-frequency hybrid integrated circuit with a built-in voltage-resistant capacitor.
第１図はこれまでのコンデンサ取付構造を示す縦断面図
、第２図乃至第４図は本発明によるコンデンサ取付構造
の各実施例な示す縦断面図、第５図は本発明を適用した
混成集積回路装置の全体斜面図である。
１・・・基板、２・・配線、３・・・コンデンサ（本体
）、４・端子部、５・・導電接着剤、６・・・間隙、７
．８・振動吸収性樹脂、９・セラミック基板、ｌＯ・・
・セラミック枠体、１１・・・外部配線、１２・・・内
部配線、１３・・コンデンサ、１４・・・振動吸収性樹
脂。
第 １ 図
第 ２ 図
第 ３ 図
゛′−−−パ゛、グFIG. 1 is a longitudinal sectional view showing a conventional capacitor mounting structure, FIGS. 2 to 4 are longitudinal sectional views showing each embodiment of the capacitor mounting structure according to the present invention, and FIG. 5 is a vertical sectional view showing a conventional capacitor mounting structure. FIG. 1 is an overall perspective view of the integrated circuit device. DESCRIPTION OF SYMBOLS 1... Board, 2... Wiring, 3... Capacitor (main body), 4... Terminal part, 5... Conductive adhesive, 6... Gap, 7
．． 8. Vibration absorbing resin, 9. Ceramic substrate, lO...
-Ceramic frame, 11...external wiring, 12...internal wiring, 13...capacitor, 14...vibration absorbing resin. Figure 1 Figure 2 Figure 3
Claims (1)
ンデンサの上面又は下面のうち少なくとも一方の直と基
板との間に振動吸収性樹脂を接触した状態で固定したこ
とを特徴とするコンデンサ取付構造。 乙 上記撮動吸収性樹脂はシリコーン系ゴムである特許
請求の範囲第１項記載のコンデンサ取付構造。[Scope of Claims] A vibration-absorbing resin is fixed in contact between at least one of the upper or lower surfaces of a capacitor incorporated on a substrate as part of a hybrid integrated circuit and the substrate. Features a capacitor mounting structure. B. The capacitor mounting structure according to claim 1, wherein the photographic absorbent resin is silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6527382A JPS58182811A (en) | 1982-04-21 | 1982-04-21 | Condenser mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6527382A JPS58182811A (en) | 1982-04-21 | 1982-04-21 | Condenser mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58182811A true JPS58182811A (en) | 1983-10-25 |
Family
ID=13282148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6527382A Pending JPS58182811A (en) | 1982-04-21 | 1982-04-21 | Condenser mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182811A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241809A (en) * | 1988-03-23 | 1989-09-26 | Nec Corp | Laminated ceramic chip parts |
| JP2016092221A (en) * | 2014-11-05 | 2016-05-23 | 株式会社村田製作所 | Electronic component embedded substrate and manufacturing method thereof |
-
1982
- 1982-04-21 JP JP6527382A patent/JPS58182811A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241809A (en) * | 1988-03-23 | 1989-09-26 | Nec Corp | Laminated ceramic chip parts |
| JPH0440849B2 (en) * | 1988-03-23 | 1992-07-06 | Nippon Electric Co | |
| JP2016092221A (en) * | 2014-11-05 | 2016-05-23 | 株式会社村田製作所 | Electronic component embedded substrate and manufacturing method thereof |
| US9961775B2 (en) | 2014-11-05 | 2018-05-01 | Murata Manufacturing Co., Ltd. | Built-in-electronic-component substrate and manufacturing method therefor |
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