JPS5817161A - Resin composition with low expansivity and high heat conductivity - Google Patents

Abstract

PURPOSE:To provide the titled resin compsn. having high heat conductivity and low expansivity, prepared by adding small alumina particles and molten quartz having a larger particle size, to a synthetic resin. CONSTITUTION:Alumina with a small particle diameter (0.1-100mu) and molten quartz with a larger particle diameter (10-200mu) are added, as filler, in amount of 50-500 and 100-1,000pts.wt., respectively, to 100pts.wt. synthetic resin with a low heat conductivity. The small alumina particles have an increased number of contact points and improve thermal conductivity of the resin, while the larger quartz lowers the expansivity of the resin.

Description

【発明の詳細な説明】 この発＃１け低膨張高熱伝導性樹脂組成物で、さらＫｆ
１４しくは、小粒子としては、アルミナを用い、大粒子
としては、溶融石英を樹脂に充填したことを特徴とする
低膨張高熱伝導性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION This #1 low-expansion, high-thermal-conductivity resin composition further increases Kf
More specifically, the present invention relates to a low expansion, high thermal conductivity resin composition characterized in that alumina is used as the small particles and fused quartz is filled in the resin as the large particles.

熱硬化性樹脂や熱可塑性樹脂は、樹脂成分の他に、無機
質の充填材が混入され、それぞれの特徴を出している。Thermosetting resins and thermoplastic resins have inorganic fillers mixed in with them in addition to resin components, giving them their own characteristics.

とくに、ガラスチョップなどけ樹脂組成物の機械的強度
を向上させ、溶融石英は、樹脂の膨張係数を低下させ、
アルミナは、熱伝導率を向上させるためにしばしば樹脂
に充填されている。これら充填材の一般的な性質につい
て宍１に示す。In particular, glass chopping improves the mechanical strength of the resin composition, fused quartz reduces the expansion coefficient of the resin,
Alumina is often filled into resins to improve thermal conductivity. The general properties of these fillers are shown in Figure 1.

弐　１ 低膨張高熱伝導性樹脂組成物は、種々の分野で開発の要
求があり、特に電気機器絶縁材料として重要な性質であ
る。そこで本発明者らは、アルミナと溶融石英を用いて
檀々検討したＪ＃小粒子にアルミナを大粒子に溶融石英
をＷｒｈることにより、性質のよい低膨張高熱伝導性樹
脂組成物、を得ることを見い出した。2. Low expansion and high thermal conductivity resin compositions are in demand for development in various fields, and have particularly important properties as insulating materials for electrical equipment. Therefore, the present inventors obtained a low expansion and high thermal conductivity resin composition with good properties by adding alumina to large particles and fused quartz to J# small particles, which had been extensively studied using alumina and fused quartz. I discovered that.

この発明に用いるアルミナは、粒子径０．１−１００ミ
クロンの単一または、混合物が用いられ、溶融石英とし
ては、粒子径１０〜２００　ミクロンの単一または、混
合物が用いられる。The alumina used in this invention may be a single alumina or a mixture of particles having a particle size of 0.1 to 100 microns, and the fused silica may be a single particle or a mixture of particles having a particle size of 10 to 200 microns.

用いる粒子径は、必ずアルミナの方が小さい粒子径のも
のを用いる。また、上記小粒子と大粒子炭 の中間の充填材は、シリカや岸酸カルシクムを用いても
よい、他の充填材として、マイカやガラスチョップのよ
うなフレーク状または、繊維状のものを用いもよい。ア
ルミナは、樹脂１００重量部に５６〜５００重量部望ま
しくは、５０−一重量部７、多いと溶融石英の充填が不
可能で、少ないと熱伝導性が悪くなる。また、溶融石英
は上記アルミナ充填樹脂組成物に１００〜１０００重量
部で、多いと混合不可能で、少ないと低膨張にならない
。The particle size used is always smaller for alumina. In addition, the filler between the small particles and the large particle charcoal may be silica or calcium chloride, and other fillers may be flakes or fibers such as mica or glass chops. Good too. The amount of alumina is preferably 56 to 500 parts by weight per 100 parts by weight of the resin, preferably 50-1 parts by weight.If it is too large, filling with fused quartz is impossible, and if it is too small, the thermal conductivity becomes poor. Further, fused quartz is added to the alumina-filled resin composition in an amount of 100 to 1000 parts by weight; if it is too large, it will not be possible to mix it, and if it is too small, it will not be possible to achieve low expansion.

この発明は一般に熱伝導率の低い樹脂に小粒子のアルミ
ナを充填することにより樹脂の熱伝導率を向上させ大粒
子として溶融石英を充填することにより樹脂自体の膨張
率を低下させることにある小粒子にアルミナを用いると
、アルミナ同志の一接触点数が多くなり良好な熱伝導媒
体になることにある。This invention generally involves filling a resin with low thermal conductivity with small particles of alumina to improve the thermal conductivity of the resin, and filling it with large particles of fused quartz to reduce the expansion coefficient of the resin itself. When alumina is used as particles, the number of points of contact between alumina particles increases, resulting in a good heat conduction medium.

以下実施例により説明する。This will be explained below using examples.

実施例１ °樹脂として、エピコート８１５（シェル社）９９重量
部に２工チルメチルメイミダゾール１重量部を添加し、
よく混合したものを用いた。樹脂１００重量部に平均粒
子径１０ミクロンのアルミナ同志３ｏｏｏ（不二見研摩
材工業）１００重量部添加し、次いで平均粒子径７０ミ
クロンの溶融石英の粒子を１００　ｇ置部添加し、入空
脱気し、テフロン型に注入しく約１０ｍ厚さ）１００℃
２４ｈ硬化し、樹脂板を作った。Example 1 As a resin, 1 part by weight of 2-functional methyl meimidazole was added to 99 parts by weight of Epicoat 815 (Shell Company),
A well-mixed mixture was used. To 100 parts by weight of the resin, 100 parts by weight of alumina Doshi 3ooo (Fujimi Abrasive Industries) with an average particle diameter of 10 microns was added, and then 100 g of fused silica particles with an average particle diameter of 70 microns were added, followed by air degassing. Then, pour it into a Teflon mold (about 10m thick) at 100℃.
It was cured for 24 hours to make a resin board.

この樹脂板を５０Ｘ１００．ＩＩＫ切断し熱伝導測定用
試料とした。また、樹脂板より５Ｘ５Ｘ３０■切断し線
膨張係数試料とした。This resin plate is 50x100. It was cut with IIK and used as a sample for thermal conductivity measurement. In addition, 5×5×30 square pieces were cut from the resin plate to obtain linear expansion coefficient samples.

実施例２ 実施例１の溶融石英とじ信嵜子径７０ミクロンのものを
５００ミクロンに代えて同様な実施を試みた。Example 2 A similar experiment was carried out except that the diameter of the fused silica binding sheath of Example 1, which was 70 microns, was replaced with 500 microns.

実施例３ 実施例２に平均粒子径１００ミクロンのシリカを２００
重量部さらに追加充填し、硬化させｆｃ。Example 3 200% of silica with an average particle size of 100 microns was added to Example 2.
Add additional parts by weight and harden fc.

実施例４ 実施例１に３２メツシユパスのマイカ粉末を５０重量部
さらに追加充填し、硬化させた。Example 4 In Example 1, 50 parts by weight of mica powder of 32 mesh passes was additionally filled and cured.

実施例５ 平均粒子径６０ミクロンのアルミナＷＡ２４０　（不二
見研摩材工業）と平均粒子径５００ミクロンの溶融石英
を重量比で１：２に混合し、１０麿厚さ′のテフロン型
にこれらの充填剤３００重量部を注入し、振動させた後
、実施例１の樹＠　１００重量部を真空で含浸し樹脂板
を作った。以外は、実施例１と同一である。Example 5 Alumina WA240 (Fujimi Abrasive Industries) with an average particle diameter of 60 microns and fused silica with an average particle diameter of 500 microns were mixed at a weight ratio of 1:2, and these were filled into a Teflon mold with a thickness of 10 mm. After injecting 300 parts by weight of the agent and vibrating, the resin board was impregnated with 100 parts by weight of the tree of Example 1 under vacuum. The rest is the same as in Example 1.

比°較例°１ 実施例１の小粒子に溶融石英（平均粒子径１０ミクロン
）を用い、大粒子にアルミナ（平均粒子径７０ミクロン
）を用いた以外は実施例１と同一である。　　・′　　
　　　　　　　　゛ 比較例２ 実施例１のアルミナの代りにシリカを用いたものの信実
残飼１と同一である。Comparative Example 1 This is the same as Example 1 except that fused silica (average particle diameter 10 microns) is used for the small particles and alumina (average particle diameter 70 microns) is used for the large particles.・′
゛Comparative Example 2 This is the same as Residue Residue 1 except that silica was used instead of alumina in Example 1.

比較例３ 実施例５の小粒子が溶融石英（平均粒子径６０ミクロン
）を用い大粒子にアルミナ（平均粒子径５００ミクロン
）を用いた以外は実施例５と同じである。Comparative Example 3 This was the same as Example 5 except that the small particles in Example 5 were made of fused silica (average particle size: 60 microns) and the large particles were made of alumina (average particle size: 500 microns).

以上の結果を表２に示した。結果より明らかなように、
本発明たより低膨張係数で高い伝導率の樹脂組成物が得
られる。The above results are shown in Table 2. As is clear from the results,
The present invention provides a resin composition with a lower expansion coefficient and higher conductivity.

Claims (1)

【特許請求の範囲】[Claims] 合成樹脂に充填材として、アルミナと溶融石英を混入さ
せるものにおいて、溶融石英の平均粒子径より小さい平
均粒子径のアルミナを用いることを特徴とする低膨張高
熱伝導性樹脂組成物。A low-expansion, high-thermal-conductivity resin composition in which alumina and fused quartz are mixed as fillers in a synthetic resin, characterized in that alumina having an average particle diameter smaller than the average particle diameter of fused silica is used.