JPS58158937A - Surface defect detector - Google Patents

Abstract

PURPOSE:To detect surface defect within a short time by a method wherein a condensing means is installed traversing above an object for inspection to be fed rectilinear to the traversing direction for optical scanning in the traverse direction. CONSTITUTION:A table 12 is slidden on a fixed table 11 by a pulse motor 14 moving a mask 1 in X direction with respect to a condenser 15 to emit laser light 19 and scanning the mask 1 through a Kalvar's mirror 20 to project parallel scanning luminous flux 23 in Y direction on the surface of the mask 1. When the projected light irradiates a defect 5 on the mask 5, turbulent reflected light is projected into the condenser 15 through a slit 16 to be detected 17 through optical fiber. A detected signal is processed 25 and making use of feed amount 27 in X direction, scanned amount 28 of laser light in Y direction to compute 26 a defective position. The patterns on the glass mask 1 are preliminarily memorized by the operator 26 and the defect detecting signals from the condenser 15 corresponding to the patterns are erased and obtain the defect and address as required. Through said constitution, the detecting precision may be improved since the table 12 may be simplified while accelerating scanning speed and increasing the density of detecting points.

Description

【発明の詳細な説明】 本発明は、表−の欠＠検量Ｍｌｌ＃Ｃ係り、脅に、ホト
リングラフィ用のガラスマスクの表面に付着管たに形成
した異物中傷等【欠陥として検出する場合に使用するの
に好適な表面の欠陥検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to defects in the table Mll #C, and the present invention is directed to the detection of defects such as foreign matter formed on the surface of a glass mask for photolithography. The present invention relates to a surface defect inspection device suitable for use in.

一般に、シリコン牛導体装置の製造に不可欠なホトリソ
グラフィ（写真処［１）Ｋは半尋体基板牧面にｍａした
永トレジス）（７１元性耐蝕倒脂）Ｉｌ′？を選択的に
感光させる王権が必要となる。この感光処理は、透明ガ
ラス板の一表面にクロム等からなる不透明ｅｌｋ所要の
パターンに形成してなるガラスマスク【使用し、ホトレ
ジストＭ【形成したウェハ状の半尋体基板の映画に密着
させた状態で露光して選択的に感光させることＫより行
なわれる。そして、１枚のガラスマスクは数百枚のウェ
ハ罠対する感光処理に使用され、その間＆Ｃはガラスマ
スクＯ表面ＶＣ異物や傷か付く仁とかめる。このような
１４′４ＩＪや傷かあると、ホトレジスト談が所管とす
るパターンと異なるパターンが感覚され、不良発注ＯＩ
ｇ因となる。し友かつて、ガラスマスクは使用回数に応
じて時々、異物や傷等の欠陥の有無を検査される。In general, photolithography is essential for the production of silicon conductor devices (photography studio [1) K is a long-lasting resist that has been applied to a half-layered substrate) (71-element corrosion-resistant fat) Il'? A royal authority is required to selectively expose the area to light. This photosensitive treatment uses a glass mask [formed in the desired pattern of opaque elk made of chromium, etc.] on one surface of a transparent glass plate, and a photoresist (M) [is used] that is brought into close contact with the film of the formed wafer-shaped semicircular substrate. This is done by selectively exposing the material to light. One glass mask is used to expose hundreds of wafers, and during this process, &C collects VC foreign matter and scratches on the surface of the glass mask. If there is such a 14'4 IJ or scratch, a pattern different from the one under the jurisdiction of the photoresist consultant will be sensed, and a defective order will be issued.
It causes g. In the past, glass masks were occasionally inspected for defects such as foreign objects and scratches, depending on the number of times they were used.

従来、この糧のガラスマスクの欠陥検量装置として、例
えば第１崗に示すようなものか提案されている。この装
置１は、ＸＹ方向に移動可能な載置台２の上方に受光器
３′に設け、載置台２上にガラスマスク１１ｒその検査
対象面（以下表面という５）會上向きにして載置し、載
置台２を受光ｆｉｔ３かマスク表面に第１図に想嘗耐で
示す軌跡【相対的に描くようにＸＹ肉方同に送り、同時
に１マスクｌに表面と平行な欠陥検出用光１４に一投射
し、この光蘇櫨か欠陥５によって乱反射された光を受光
器３で拾って検出するように、構成さｎている。そして
、マスクｌ上における欠陥５の位Ｉｔは載置台２のＸＹ
両両方への送り量と検出時期との関係によりＸＹＩ！１
１１に求めるようになっている。Hitherto, as a defect measuring device for glass masks, a device as shown in Fig. 1 has been proposed, for example. This device 1 is provided with a light receiver 3' above a mounting table 2 that is movable in the XY directions, and a glass mask 11r is placed on the mounting table 2 with its surface to be inspected (hereinafter referred to as the surface 5) facing upward. Place the mounting table 2 on the light-receiving fit 3 or on the mask surface along the trajectory shown in Fig. The light is projected and diffusely reflected by the defect 5, and the light is picked up by the light receiver 3 and detected. The position It of the defect 5 on the mask l is the XY position of the mounting table 2.
XYI! due to the relationship between the feed amount to both and the detection timing! 1
11.

しかしながら、別記のようなガラスマスクの欠陥検査装
置にあっては、マスク載置台ＱＸＹ内方向に、移動して
欠陥検出点（受光器）かＸＹ内方同に相対的に走査する
ようになっているため、検査時間が極めて長くかかると
いう欠点が控る。However, in a glass mask defect inspection device as described separately, the mask mounting table moves inward in the QXY direction and scans the defect detection point (receiver) relatively in the same direction in the XY direction. This avoids the drawback that the inspection time is extremely long.

本発明は前記欠点會解消するた約になされたもので、検
査時間′に短期化することかできる表面の欠陥検査ｔａ
ｒ提供することｔ目的とする屯のである。The present invention has been made to eliminate the above-mentioned drawbacks, and is a surface defect inspection method that can shorten the inspection time.
It is the purpose of providing this service.

この目的′に達成するため、本発明による表面の欠陥検
査ｉＭ−筐は、機構音物の表面上方に集光手段會横断架
設し、この横断方向と交差する方向に蕾檜食物を相対的
に送るとともに、検査用投光を前記横断方向に走査する
ことＫより、機械的な送９を一方向のみとして高速化す
ることｔ−〜徴とするもの′Ｃある。In order to achieve this objective, the surface defect inspection iM-casing according to the present invention is constructed by installing a light condensing means across the surface above the surface of the mechanical object, and relatively disposing the bud food in a direction crossing the transverse direction. At the same time as scanning the inspection light in the transverse direction, there is a method of speeding up the mechanical feeding 9 by moving it only in one direction.

以下、本発明７図面に示す実施例にしたがってさらに奴
明する。Hereinafter, the present invention will be further explained according to the embodiments shown in the drawings.

第２図は本発明による表面の欠陥検査［１の一実施飼會
示す斜視図であり、ガラスマスクｌのパターンが形成さ
ｎ友＠ｅ面に何着箇たは形成し友典物や傷等の欠陥５を
検査する場合につき示している。このガラスマスクの欠
陥検査装置ＩＬは固定テーブルｌｌ］備えており、この
テーブル１１上［にマスクｍ１１台１２が一方向（以下
Ｘ方向という。）に往復摺動自在に設けられている。テ
ーブル１１には送りねじ軸１３がＸ方向に延在するよう
に配され回転自在に支承されており、このねじ軸１３は
パルスモータ１４等により回転駆動さｎるようになって
いる。送りねじ軸１３には載置台１２の一部が螺合して
おり、載置台１２はモー４１４の（ロ）転によりＸ方向
に所費量送られる５載重合１２の上方に／ｆｉ多数本の
元ファイバを一体に束ねてなる集光手段としての集光体
１５か載置台のＸ方向移動から独立するように、すなわ
ち相対的に移動し祷るように配設されている。集光体１
５ｒｆＭ長す集光面１ｒ庸し、この集光面は各党ファイ
バの先端面を揃えてＩｉ鹸状に螢列されることにより形
成され、載置台１２の上方においてＸ方向と直角に交差
する方向（以下Ｙ方向とかう。）［１在し、かつ載ｍ萱
１２の上面に対向するように配設されている。集光体１
５の集光面の真下にはスリット部材１６か配ｔ＆芒れ、
この部材のスリットはその真下で乱反射した光だｆｆｔ
−集光面に入射させるようになっている３元ファイバ群
の後端を一束に結束してなる集光体Ｍ端部にはディテク
タ（受光器）１７が接続され、”ディテクタは集′光体
１５からの元ｒ受けて電気的信号に変換するようになっ
ている。FIG. 2 is a perspective view showing one implementation of the surface defect inspection [1] according to the present invention. This figure shows a case where a defect 5 such as the like is inspected. This glass mask defect inspection apparatus IL is equipped with a fixed table 11, on which a mask m11 12 is provided so as to be able to slide back and forth in one direction (hereinafter referred to as the X direction). A feed screw shaft 13 is disposed and rotatably supported on the table 11 so as to extend in the X direction, and this screw shaft 13 is rotatably driven by a pulse motor 14 or the like. A part of the mounting table 12 is screwed onto the feed screw shaft 13, and the mounting table 12 is arranged above the 5-mounted stack 12 which is sent by the required amount in the X direction by the rotation of the motor 414. A condensing body 15, which is a condensing means made by bundling original fibers together, is arranged so as to be independent of the movement of the mounting table in the X direction, that is, to move relatively. Light collector 1
The light collecting surface 1r has a length of 5 rfM, and this light collecting surface is formed by aligning the end surfaces of each fiber and arranging them in a spiral shape. (hereinafter referred to as the Y direction). Light collector 1
A slit member 16 is arranged directly below the light condensing surface of 5.
The slit in this member is the light that is diffusely reflected just below it.fft
- A detector (light receiver) 17 is connected to the end of the condenser M, which is formed by bundling the rear ends of a group of ternary fibers that are made to enter the light condensing surface. It receives the element r from the light body 15 and converts it into an electrical signal.

前記集光体１５のＸ方向の片−空間には投光手段として
の投光装置１８が設備され、この装置はレーザー光−発
生６１９と、往復回動してレーザー元＃ｔｓ状に走査さ
せるガルバーイラ−２０と、扇状［走査するレーザー光
束會平行に７Ｆ！査さゼるスキャナーレンズ２１と、こ
の平行走査光束が前記載置台１２上に載置されるガラス
マスクｌの表面に投射するように一同させるばラー２２
とｔ倫えている。この平行走査光束２３は第２図に点−
矢団で示すようＶＣマスクｌｏ＆面においてＹ方図ＶＣ
砥在し、かつマスクｌのパターン（不図示）彫戟鄭分よ
Ｖ着干広い一’ｔ−Ｎする走査投射−２４會描き、この
投射ｆＩＩＩ２４が前記スリット部材１６のはば真下に
位置するように投光装置１８か設定されている。A light projecting device 18 as a light projecting means is installed in one space of the condenser 15 in the X direction, and this device generates a laser beam 619 and rotates back and forth to scan the laser source #ts. Galvanizer 20 and fan-shaped [scanning laser beam beam parallel to 7F! a scanner lens 21 for scanning, and a mirror 22 for unifying the parallel scanning beam so that it is projected onto the surface of the glass mask l placed on the mounting table 12.
I am very proud of this. This parallel scanning light beam 23 is shown at the point -
Y-direction VC in the VC mask lo&plane as shown by the arrow.
The pattern of the mask l (not shown) is carved by a wide scanning projection fIII24, and this projection fIII24 is located directly below the edge of the slit member 16. The light projecting device 18 is set as follows.

創配デイテクメ１７には欠陥検出信号処境器２５が接続
され、この処理器２５扛ディチク４１１７からの電気的
信号につき波形整形、増幅等の処１３１行ない、欠陥位
置演算処ａｌｌ！２６に人力するようＫなっている。ま
九、前記パルスモータ１４ＫＨ！方向送り量検出処理器
２７か接続され、この処Ｉｔ器２７ｔ；ｊパルスモータ
１４の回転数からＩＫｗｔ、台１２の基準位置に対する
Ｘ方向の送り量ｋＮＦｆｆｌしその結果を前記欠陥位置
演算処理器２６に人力するようになってｂる。さらに、
前記投光装置１８のガルバーミラー２０にはレーザー光
＊走査角檜出処理器２８が接続され、この処理器２８に
ピラー〇回動角により基準位置がらの罰紀矩棄投射−２
４の長さｔ検出し、その帖釆を前記欠陥位ｔＩＬｙ！算
処珈器２６に人力するようになっている。欠陥位置演算
処理器２６は、前記各処ｆｌ器２５，２７゜２８からの
人力信号に基づき欠陥５の所在付置ｒ基準位置に対する
ＸＹ座＠ｔｉｃて出力し我示するようになっている。A defect detection signal processor 25 is connected to the generation/distribution data processor 17, and this processor 25 performs 131 processes such as waveform shaping and amplification on the electrical signal from the processor 4117, and performs defect position calculation processing (ALL!). K is set to require manual labor on the 26th. Nine, the pulse motor 14KH! A directional feed amount detection processor 27 is connected, and this processor 27t;j calculates IKwt from the rotation speed of the pulse motor 14, the feed amount kNFffl in the X direction with respect to the reference position of the table 12, and sends the result to the defect position calculation processor 26. It started to be done manually. moreover,
A laser beam*scanning angle processing device 28 is connected to the galvanic mirror 20 of the light projecting device 18, and this processing device 28 is used to project a penalty from the reference position according to the rotation angle of the pillar 〇.
Detect the length t of 4 and place the button at the defective position tILy! 26 calculation machines are now operated manually. The defect position arithmetic processor 26 outputs and indicates the location of the defect 5 based on the manual signals from the fl/25, 27, and 28 reference positions.

次に使用方ｆｆ、Ｍびに作用を説明する。Next, how to use ff, M and the effect will be explained.

箇ず、載置台１２上にガラスマスク１ｔｉｆｍ食表面ｒ
上向きにして、かつ台とマスクとの基準を合歓して載置
し保持せしめる。続いて、パルスモータ１４４（作動せ
しめて載置台１２１Ｈ固定テーブル１１上で摺動させる
ことによりマスク１を集光体１５νＣ対しＸ方向に移動
させる３１Ｗ１時に、レーザー光−発生器１９でレーザ
ー光［Ｊ＠射するとともに、ガルバーミラー２０に一往
復回勧させて光ｍｒ７Ｆ！食し、平行走査光束２３ｔ−
マスクｌの表面にＹ方向に投射する。この場合、載置台
１２μＸ方同のみＶＣ移動するだけであるから、従来の
ようｒ＜：ＸＹ両方に移動させる場合に比べて一通に移
動場ゼることか可能となり、かつ、構造も大１１１！に
簡牟化される。また、投射光＃に光学的にＸ方向に走査
されるため、その走査量には憶めて早くてることができ
、従来のようＫＹＸ方向−ブルを間欠的に送る場合に比
べて大−に鍋速化することかでき、検査点ｒ＾密度化し
て検査性能を同上化する仁とかできる。このように、マ
スクｌかＸ方向に棒曽するとともに、投射光−かＸ方向
に往＊走食するから、投射光−のマスク１０９面におり
る投射光束の軌跡は、第２図に想＊ｌｉｌで示すように
三角波形状に描出さ１％Ｙ方向の走査逐度ｒ可及的［早
く丁れは、投射光点の密度は極めて高くなり、検査点が
高密度化する。In addition, a glass mask 1tifm eclipse surface r is placed on the mounting table 12.
Place and hold the mask facing upward and aligning the standards of the stand and the mask. Subsequently, at 31W1 when the mask 1 is moved in the X direction with respect to the condenser 15νC by activating the pulse motor 144 and sliding it on the mounting table 121H fixed table 11, the laser beam generator 19 generates a laser beam [J At the same time, the galver mirror 20 reciprocates once and eclipses the light mr7F!, producing a parallel scanning beam 23t-
Project onto the surface of mask l in the Y direction. In this case, since the mounting table only moves in the VC direction in the 12μX direction, it is possible to use a single movement field compared to the conventional case in which it is moved in both r<:XY directions, and the structure is also large! It is simplified to In addition, since the projected light # is optically scanned in the X direction, the amount of scanning can be memorized quickly, and compared to the conventional case of sending bulls in the KYX direction intermittently. It is possible to speed up the pot speed, increase the density of inspection points, and increase the inspection performance. In this way, the mask l moves in the X direction, and the projected light eclipses forward in the *As shown by lil, it is drawn in a triangular wave shape and the scan rate in the Y direction is 1%.

前記投射光＃にガラスマスクｌの表ＦｋＪに投りすると
乱反射せずに全反射する几め、投射光虜の真上にある集
光体１５の集光面には入射しなり０ところか、投射光−
がマスク表面の欠陥５に投射すると乱反射するため、そ
の乱反射光がスリット部材１６′ｇｔ！遇して集光体１
５に入射する。この入射光−に光ファイバケ経てディテ
クタ１７で受九され、ディテクタ１７は電気的信号を欠
陥検出信号処理器２５に印加し処理器２５に欠陥検出信
号を欠陥位置演算処理器２６に人力する。演其処畦器２
６にはＸ方向送り童検田処理器２７からＸ方向の送９童
が、レーサー元＃Ｈ足食角検出処堆！２ｇからＸ方向の
走査量かそれぞｎ常時人力さｎている。したかって、欠
陥検出信号とＸ方向の込り置匍号およびＸ方向の走査量
信号との菖合時点を演算することにより、マスクｌの我
面上における欠陥の所在箇所１基準に対するＸＹ座標に
て求めることができる。When the projected light # is projected onto the surface FkJ of the glass mask 1, it is totally reflected without being diffusely reflected, so that it is incident on the condensing surface of the condensing body 15 located directly above the projected light beam, and is 0. Projection light-
When projected onto the defect 5 on the mask surface, it is diffusely reflected, and the diffusely reflected light is reflected by the slit member 16'gt! Light concentrator 1
5. This incident light is received by a detector 17 through an optical fiber, and the detector 17 applies an electrical signal to a defect detection signal processor 25, and the processor 25 inputs a defect detection signal to a defect position calculation processor 26. Stage ridge 2
6, the X-direction sending 9th child from the X-direction sending child detection processing device 27 is the racer former #H foot eating angle detection station! From 2g to the scanning amount in the X direction, manual labor is required at all times. Therefore, by calculating the point of convergence between the defect detection signal, the X-direction intrusion signal, and the X-direction scanning amount signal, the XY coordinates of the location of the defect on the first side of the mask l with respect to the first standard can be determined. can be found.

ところで、ガラスマスクｌの表面に形成されたパターン
においても、前記投射光−の乱反射が起こる場合が考え
られるが、例えば、欠陥位置演算処理器２６にあらかじ
めパターン【記憶させておき、この１憧により集光体１
５からの欠陥検出信号のうちパターンに相当する信号を
消去するように葡償しておけは、ＩｇＴｌｌの欠陥およ
びその所在１庖のみ１ｒ侍ることかできる。Incidentally, even in the pattern formed on the surface of the glass mask l, it is conceivable that diffuse reflection of the projected light may occur. Light collector 1
If the signal corresponding to the pattern is erased from among the defect detection signals from 5, only one portion of the IgTll defect and its location can be detected.

本実施的によれば、載置台ｉｆＸ方同にのみ送り、欠陥
検査のための投射光−１ｒＹ方回に走査し、欠陥での跣
反射光ｉＹ方同に延在する集光体で捕捉するようにした
ので、載置台１ｒ構造上一連化かつ量率１しすることか
可能であり、しかも、ｌｌ１Ｉｌ迷化してもＸ方向の走
査に光学的に毬めて高速化することができるので、欠陥
検量のための投射光＃による検査点に尚ｖＢ度化するこ
とかでき、したかつて、検量′ｈ４ｔＩＩ″同上させる
ことができる。According to this embodiment, the mounting table is sent only in the direction of if By doing this, it is possible to serialize and have a mass rate of 1 due to the structure of the mounting table 1r, and even if Il1Il gets lost, the scanning speed can be increased by optically confining the scanning in the X direction. The inspection point using the projection light # for defect calibration can be set to vB degrees, and the calibration 'h4tII' can also be made as described above.

幕３図および纂１図は本発明の他の夾抛飼ｒ示丁もので
、前記実施例と異なる点は、集光手段として、光ファイ
バを束ねてなる集光体を用いる代りに光導材料１ｒはぼ
棒状に一体成形さｎてなる集光器１５ムに＃４いた点に
ある。この集光−１５ムに先端に行くに従って太くなる
ほぼ半円形柱状に形成され、細くなった基端部がディテ
クタ１７に接続されるとともに、その平坦面を載置台１
２上のマスク１＆１ｉＩｉＫ対向するように配設される
。第４図に示すように、マスク１＆−面上の欠陥５での
乱反射光が平坦な集光面から集光−１３Ａ内に入射する
と、この入射光は集光体１５Ａ内で全反射【繰り返し基
端部のディテクタ１７に至る。本実ｈガの作用効果は前
記実施例と同様である。本実Ｊ１ガによれば、集光手段
か比較的安価に入手できるという利点か祷られる。Figure 3 and Figure 1 show other examples of the present invention, and the difference from the above embodiment is that instead of using a light condenser made of bundled optical fibers, a light guide material is used as the light condensing means. 1r is located at the point #4 in the condenser 15 which is integrally molded into a rod shape. This condensing light is formed into an approximately semicircular column shape that becomes thicker toward the tip, and the tapered base end is connected to the detector 17, and its flat surface is placed on the mounting table 1.
Masks 1 & 1iIiK on 2 are arranged to face each other. As shown in FIG. 4, when the diffusely reflected light from the defect 5 on the mask 1 & - surface enters the condenser 13A from the flat condensing surface, this incident light is totally reflected within the condenser 15A [repeatedly]. It reaches the detector 17 at the proximal end. The operation and effect of this practical example are the same as those of the above embodiment. According to Honji J1 Ga, the advantage is that the light condensing means can be obtained relatively inexpensively.

なお、創配実ＪＩＩ例では、ガラスマスクの叡山の欠１
１１ｉ＆に検査する場合にっｌ！説明したか、これに限
らず、ガえは１研摩したウェハ、−収約なガラス、レン
ズ、圧砥ロール等々あらゆる分野の′＆面欠陥検査＃／
ｃ迩柑することかできる。１几、欠陥所在−所’ｔＸＹ
座標で求める場合に限らず、欠陥の数量友けｒ求めるよ
うにしてもよい。この場合、欠陥検査用投光はＹ方向に
投射森會描けはよく、走査する必ＩｉＬはない。投光と
してレーザー光を用いたか、これに限らず、他の光を用
いてもよい。被検査物に！方間に送る手段は載置台ｔテ
ーブル上で摺動さぜるようにしてなる構造に限らず、飼
えば、コンベア勢の搬送手段を用いてもよい。被検査物
ｉ！方方間送る場合に限らず、集光手段’ｌｊＸ方同に
方間ようにしてもよい。なお、前配実ｈガではレーザー
元−髪用いたので、九字糸を暗箱内に収容しなくても済
むが、池の九を用いる場合と同様に箱内に収容すること
が望筐しい。In addition, in the Sokaijitsu JII example, Eizan's lack of glass mask 1
When inspecting on 11i&! As explained above, burrs can be used for surface defect inspection in all fields such as polished wafers, compact glass, lenses, pressure rolls, etc.
I can do things like c. 1 box, defect location - location'tXY
It is not limited to the case of calculating by coordinates, but may also be calculated by calculating the quantity of defects. In this case, the defect inspection light can be projected in the Y direction, and there is no need for scanning. Although laser light is used as the light projection, the present invention is not limited to this, and other light may be used. For the inspected object! The means for conveying the material to both directions is not limited to a structure in which it is slid on a mounting table (t), but a conveyor type conveying means may also be used. Inspected object i! It is not limited to the case where the light is sent in both directions, but the condensing means 'ljX may be sent in both directions. In addition, since laser hair was used in the previous method, it is not necessary to store the Kuji yarn in a dark box, but it is preferable to store it in a box as in the case of using Ikeno Ku.

以上貌明したように、本発明によれは、表面の欠陥検量
ｋＪ１ｉ達化するＣとができ、かつ検食梢嵐ｒ同上させ
ることができる。As explained above, according to the present invention, it is possible to achieve the surface defect measurement kJ1i, and also to achieve the surface defect detection kJ1i.

図面の簡単な貌− ！１図μ従従来を示す斜視図、纂２図は本％明　　　　
゛Ｑ−央ｊｌｌｉ？！ｌｋ示す斜視図、第３図および第
４図は本発朗の他の実施ガを示す斜視図および止面図で
める。A simple look at the drawing! Figure 1 is a perspective view showing the prior art;
゛Q-central jlli? ! Figures 3 and 4 are perspective views and stop views showing other embodiments of the present invention.

ｌ・・・ガラスマスク、５・・・欠陥、１５・・・集光
体、１５ム・・・集光体、１６・・・スリット部材、１
７・・・ディテクタ、１８・・・投光ｉｆｒ置、１９・
・・レーザー光−発止（至）、２０・・・ガルバーミラ
ー、２１・・・スキャナミラー、２２・・・ミラー、２
３川平行走査光束、２４・・・投射銀、２５・・・欠陥
検出信号処８！器、２６・・・欠陥位置演算処ｌ！ｌＩ
器、２７・・・Ｘ方間送り量検出処理器、２８・・・レ
ーザー光耐走食角檜出処唾器。l...Glass mask, 5...Defect, 15...Light collector, 15mu...Light collector, 16...Slit member, 1
7...Detector, 18...Light emitter ifr position, 19.
... Laser light - start (to), 20 ... Galver mirror, 21 ... Scanner mirror, 22 ... Mirror, 2
3-river parallel scanning beam, 24... Projection silver, 25... Defect detection signal processing 8! 26...Defect location calculation process l! lI
27... X-direction feed amount detection processor, 28... Laser light corrosion resistant square cypress extractor.

代理人　弁理士　薄　１）利０．９８、“″　　　コ〜 第　　２　　図 第　　３　　図 第　　４　　図Agent Patent Attorney Susuki 1) Profit 0.98, “″　　　〜 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 １、　１Ｆ検査物の表面の外方にこの表面からの乱反射
光ｉ集光する集光手段ｒ仁の表面【横断するように設け
るとともに、この集光手段と１検食物とｉ前記横断方向
と交差する方向に相対的［８動させる移動手段を設け、
さらに、前記豪検査暢我面に光を前記横断方向と＃１ぼ
平行に投射する投光生膜を設けてなる表面の欠陥検査装
置。 ２、　１１ｔＪ記集元＋段が、複数本のｉ７アイバを各
元端面が壷列して細長い集光面を形成するように束ねて
なること’ｒｅ黴とする特許請求の範囲第１墳記載の欠
陥検査装置。 ３、前記集光＋段か、入射元髪内部で全反射して少なく
ともｌｌ１ｈＩ９ｒに集合するように形成された集光−
からなること【％黴とする特許請求の範囲第１ＪＪｌ記
載の欠陥検査装置。[Claims] 1. The surface of a condensing means r that condenses diffusely reflected light from this surface on the outside of the surface of the 1F test object. and (i) providing a moving means for moving it relative [8] in a direction intersecting the transverse direction;
Furthermore, the surface defect inspection apparatus is provided with a projection biofilm that projects light onto the inspection surface substantially parallel to the transverse direction. 2. Claim 1 states that the 11tJ collecting element + stage is formed by bundling a plurality of i7 eyeglasses so that each end face is arranged in a row to form an elongated light condensing surface. defect inspection equipment. 3. The light condensing + step or the condensing light formed so as to be totally reflected inside the incident hair and converge at least at ll1hI9r.
The defect inspection device according to claim 1 JJl, which comprises [% mold].