JPS58155801U - chip parts - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のチップ部品を回路基板へ取付けた構造を
示す縦断面図、第２図から第５図は本考案の取付構造を
示したもので、第２図はチップ部分の上平図、第３図は
第２図のチップ部品を回路基板へ取付けた様子を示す縦
断面図、第４図、第５図は第３図の他の実施例を示した
縦断面図である。 １・・・・・・回路基板、２・・・・・・導電体、３・
・・・・・チップ状絶縁基板、４・・・・・・部品、５
・・・・・・電極、７ｂ・・曲半田、８・・・・・・電
極形成領域、９ａ、　　９ｂ、　　９ｃ・・間係合部。Figure 1 is a vertical cross-sectional view showing the structure in which a conventional chip component is attached to a circuit board, Figures 2 to 5 show the mounting structure of the present invention, and Figure 2 is a top plan view of the chip part. , FIG. 3 is a vertical sectional view showing how the chip component shown in FIG. 2 is attached to a circuit board, and FIGS. 4 and 5 are vertical sectional views showing other embodiments of FIG. 3. 1... Circuit board, 2... Conductor, 3.
... Chip-shaped insulating substrate, 4 ... Parts, 5
...Electrode, 7b...Curved solder, 8...Electrode forming area, 9a, 9b, 9c...Engagement portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両端部に電極形成領域を有し、この電極形成領域の電極
間に部品を配置したチップ状絶縁基板と、導電体を形成
した回路基板とを備え、前記チップ状絶縁基板の電極形
成領域に半田が入り込む保合部を設＆ｊ　、チップ状絶
縁基板を回路基板に固定したことを特徴とするチップ部
品。A chip-shaped insulating substrate having an electrode forming area at both ends and having a component placed between the electrodes in the electrode forming area, and a circuit board having a conductor formed thereon, the chip-shaped insulating substrate having an electrode forming area having solder thereon. A chip component characterized by having a retaining portion into which a chip is inserted, and a chip-shaped insulating substrate is fixed to a circuit board.