JPS58142831A - Controlling method of injection molding machine - Google Patents
Controlling method of injection molding machineInfo
- Publication number
- JPS58142831A JPS58142831A JP2656782A JP2656782A JPS58142831A JP S58142831 A JPS58142831 A JP S58142831A JP 2656782 A JP2656782 A JP 2656782A JP 2656782 A JP2656782 A JP 2656782A JP S58142831 A JPS58142831 A JP S58142831A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- pressure
- injection
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7646—Measuring, controlling or regulating viscosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
- B29C2045/2687—Plurality of independent mould cavities in a single mould controlling the filling thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、１回の射出工程で複数個の樹脂成形品を同時
に射出成形するいわゆる多数個取成形の射出成形機にお
ける制御方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a control method for a so-called multi-cavity injection molding machine that simultaneously injection molds a plurality of resin molded products in one injection process.
従来、射出成形機において、成形品の品質を制ωｔし、
良品質の成形品を得るために、金型内の樹脂圧フハ温度
、作動油圧、金型の歪み等を検出し、この検出値に基づ
いて射出装置における射出スクリュのストローク、射出
から射出保持への切換えのタイミング、射出量等の自動
制御を行う方法いわゆるアダプティブコントロールシス
テムが公知である。Conventionally, in injection molding machines, the quality of molded products was controlled ωt,
In order to obtain high-quality molded products, we detect the resin pressure temperature, working pressure, mold distortion, etc. in the mold, and based on these detected values, we control the stroke of the injection screw in the injection device, from injection to injection holding. A so-called adaptive control system is known as a method for automatically controlling switching timing, injection amount, etc.
しかし、従来の方法では、金型の１点で樹脂圧力等を検
出し、射出装置側で射出ストローク等の射出条件を総括
的に制御するものであるため、一般的な射出成形機のよ
うに、１個宛射出成形する場合には有効であるが、１個
の金型に複数個のキャビティを設け、１回の射出工程で
複数個の成形品を同時に射出成形するいわゆる多数個取
成形の場合にはその制御性能を充分に発揮できなかった
。However, in the conventional method, the resin pressure etc. are detected at one point in the mold and the injection conditions such as the injection stroke are comprehensively controlled on the injection device side. , is effective for single-piece injection molding, but it is also effective for so-called multi-cavity molding, in which multiple cavities are provided in one mold and multiple molded items are simultaneously injection molded in one injection process. In some cases, the control performance could not be fully demonstrated.
すなわち、たとえば４個のキャピテイを有する金型を用
いて４個の樹脂成形品を射出成形する場合、第３図に示
すように射出装置による射出圧力（シリンダ内樹脂圧力
）は線Ｉに示す如く制御されるのに対し、第１．第２．
第５．第４の各キャビティ内の樹脂圧力は、各キャビテ
ィの形状、加工精度のばらつき等によって互いに異なり
、それぞれ線１ａ＋ Ｉｌｂ＋ ｊｃｔ Ｉｌａに
示すように変化する。このときの各キャピテイの最適充
填圧力はＰａＩ Ｐｂν Ｐｃ ９Ｐｄ である。この
ような射出工程において、従来のように金型の１点たと
えば最後に充填完了されるキャビティこの場合は第６キ
ヤビテイ内の樹脂圧力のみを検出し、その充填圧力ＰＣ
に基づいて射出装置による射出から射出保持への切換え
を行った場合、先に充填完了した第１．第２．第４の各
キャビティ内の樹脂に対してその充填完了後に射出装置
による射出圧が付加されるために、オーバパック気味と
なり、ばりが発生しまた金型を破損するおそれがある。That is, for example, when four resin molded products are injection molded using a mold having four cavities, the injection pressure by the injection device (resin pressure in the cylinder) is as shown by line I, as shown in FIG. In contrast to the first. Second.
Fifth. The resin pressure in each of the fourth cavities differs depending on the shape of each cavity, variations in processing accuracy, etc., and changes as shown by the lines 1a+Ilb+jctIla, respectively. The optimal filling pressure for each cavity at this time is PaI Pbν Pc 9Pd. In such an injection process, as in the past, only the resin pressure in one point of the mold, for example the last cavity to be filled, in this case the sixth cavity, is detected and the filling pressure PC is detected.
When the injection device switches from injection to injection holding based on Second. Since injection pressure is applied by the injection device to the resin in each of the fourth cavities after filling is completed, there is a risk of overpacking, generating burrs, and damaging the mold.
なお、このオーバパック現象を防止するために、最先に
充填完了されるキャビティこの場合は第１キヤビテイ内
の充填圧力ｐａに基づいて射出から射出保持への切換え
を行うと、その後に充填完了される筈の第２．第３．第
４の各キャビティに対して充填不足（ショートン１ツト
またはヒケ）が生じる。In order to prevent this overpacking phenomenon, if the injection is switched from injection to injection holding based on the filling pressure pa in the cavity that is to be filled first, in this case the first cavity, then the filling is completed. The second thing that should happen. Third. Underfilling (short spots or sink marks) occurs for each of the fourth cavities.
このように金型の１点から検出した１つの検出値のみで
射出装置による射出条件を総括的に制御するだけでは、
各キャビテイ毎に適正な充填制御を行うことができない
という問題がある。In this way, it is not possible to comprehensively control the injection conditions of the injection device using only one detection value detected from one point on the mold.
There is a problem that proper filling control cannot be performed for each cavity.
本発明は、このような従来の欠点を解決するためになさ
れたもので、多数個取の射出成形法において、金型に設
けた豪数個のキャビティに対し、各キャビテイ毎に互い
に独立して充填状態を制御することにより、各キャビテ
ィに個々に最適な条件で充填−保持を行い、各キャビテ
イ毎のばらつきをなくシ、全てのキャビティから常に良
好な製品が得られるようにしたものである。The present invention was made in order to solve these conventional drawbacks, and in the multi-cavity injection molding method, each cavity is independently controlled from the several cavities provided in the mold. By controlling the filling state, each cavity is individually filled and held under optimal conditions, eliminating variations in each cavity and ensuring that good products are always obtained from all cavities.
本発明の特徴とするとζろは、射出装置により金型内に
設けた豪数個のキャビティ内に溶融樹脂を射出充填して
複数個の樹脂成形品を射出成形する方法において、各キ
ャビティ内の樹脂圧力を個々に検出し、各検出値に基づ
いてそれぞれのキャビティに対応するノズルの近くに設
けた各ヒータの温度を個々に制御することにより、各ノ
ズルから各キャビティに充填される樹脂の粘度を個々に
制御し、以って、各キャビテイ毎に最適な充填、保持が
行えるようにし九点にある。A feature of the present invention is that in a method of injection molding a plurality of resin molded products by injecting and filling several cavities provided in a mold with an injection device, By individually detecting the resin pressure and individually controlling the temperature of each heater installed near the nozzle corresponding to each cavity based on each detected value, the viscosity of the resin filled from each nozzle into each cavity can be adjusted. There are nine points that allow each cavity to be optimally filled and held.
以下、本発明を図に示す実施例に基づいて説明する。Hereinafter, the present invention will be explained based on embodiments shown in the drawings.
第１図は本発明に使用される金型装置の一例を示す。同
図において、１は固定盤、・２は固定金型、６は可動金
型、４は可動盤、５ａ、５ｂは固定金型２に設けられた
型穴、６ａ、６ｂは可動金型３に設けられたコアを示し
、これら型穴５ａ、５ｂとコア６ａ、６ｂによって複数
個、この実施例では４個（ただし２個のみ図示）のキャ
ビティ７ａ。FIG. 1 shows an example of a mold apparatus used in the present invention. In the figure, 1 is a fixed plate, 2 is a fixed mold, 6 is a movable mold, 4 is a movable plate, 5a and 5b are mold holes provided in the fixed mold 2, and 6a and 6b are movable molds 3. The mold holes 5a, 5b and the cores 6a, 6b form a plurality of cavities 7a, four in this embodiment (however, only two are shown).
７ｂ（第２図参照）が形成される。7b (see FIG. 2) is formed.
固定金型２は、複数枚の型板８・・・等を組合わせて構
成されかつ固定盤１に周知の手段により固定されている
。９はダイロケートリング、１０はスプルブツシュ、１
１はスプルを示す。また、１２ａ１１２ｂはホットラン
ナ、１３ａ＋ｉ’ｌはホットランナヒータ、１４ａ１１
４ｂはノズル、１５ａ。The stationary mold 2 is constructed by combining a plurality of template plates 8, etc., and is fixed to the stationary platen 1 by known means. 9 is a dilocate ring, 10 is a sprue bush, 1
1 indicates a sprue. In addition, 12a112b is a hot runner, 13a+i'l is a hot runner heater, 14a11
4b is a nozzle, and 15a.
１５ｂはノズルヒータ、１６ａｊ１６ｔ）はノズルチッ
プを示し、これらは前記キャビティ７ａ＋７ｂの数に相
対応して４個づつ設けられており、溶融樹脂を前記スプ
ル１１から各ホットランナ１２ａｌ１２ｂおよび各ノズ
ル１４ａｙ１４ｂを経て各キャビティ７ａ、７ｂに射出
充填できるようにしている。ノズルチップ１６ａｌ１６
ｋ）は、先端を各ノズλ１４ａ１１４ｔ）内に挿入して
型板８に支持されている。該ノズルチップ１６ａ。Reference numeral 15b indicates a nozzle heater, and reference numeral 16aj16t indicates a nozzle chip. Four of these are provided corresponding to the number of cavities 7a+7b, and the molten resin is transferred from the sprue 11 through each hot runner 12al12b and each nozzle 14ay14b. The cavities 7a and 7b can be filled by injection. Nozzle tip 16al16
k) is supported by the template 8 with its tip inserted into each nozzle λ14a114t). The nozzle tip 16a.
１６１）の内部または後端には個々に温度調節可能なノ
ズルチップヒータ１７’ｔ１７ｂが設けられ、各ヒータ
１７ａｔ１７ｔｌによって各ノズルチップ１６ａ）１６
１）の温度を調節することによって各ノズル１４ａ＋１
４１）内の樹脂の温度を調節できるようにしている。１
８ａｔ１８ｂは冷媒通路を示す。161) is provided with a nozzle tip heater 17't17b whose temperature can be adjusted individually, and each nozzle tip 16a) 16 is controlled by each heater 17at17tl.
1) by adjusting the temperature of each nozzle 14a+1
41) The temperature of the resin inside can be adjusted. 1
8at18b indicates a refrigerant passage.
可動金型３は、複数枚の型板１９・・・と所要数のコア
６、ａ、６ｂ等を組合わせて構成されかつ可動盤４に周
知の手段により固定されている。２０はスペーサブロッ
ク、２１はエジェクタプレート、２２ａｔ ２２ｂは
圧力センサを示す。各圧力センサ２２ａｊ ２２１）
は先端を各キャビティ７ａ。The movable mold 3 is constructed by combining a plurality of templates 19... and a required number of cores 6, a, 6b, etc., and is fixed to the movable platen 4 by known means. 20 is a spacer block, 21 is an ejector plate, and 22at 22b are pressure sensors. Each pressure sensor 22aj 221)
The tip is connected to each cavity 7a.
７ｂ内に臨ませて設け、各キャビティ７ａ、７ｂ内に充
填される溶融樹脂の圧力を個々に検出できるようにして
いる。各圧力センサ２２ ａ、 ２２ ｂはエジェク
タビンに内蔵してもよいし、エジェクタピンとは別個に
設けてもよい。7b, so that the pressure of the molten resin filled in each cavity 7a, 7b can be individually detected. Each pressure sensor 22a, 22b may be built into the ejector bin, or may be provided separately from the ejector pin.
次に、制御系統を第２図によって説明する。Next, the control system will be explained with reference to FIG.
第２図において、２５は周知の射出装置、２４はホッパ
、２５は射出シリンダ、２６は射出スクリュ、２７は射
出用油圧シリンダ、２８は射出用ノズルを示し、該射出
用ノズル２８が前記金型装置のスプル１１に接続され、
射出スクリュ２６は周知の回転駆動部（図示省略）によ
って回転駆動され、射出用油圧シリンダ２７によって軸
方向に往復移動される。In FIG. 2, 25 is a well-known injection device, 24 is a hopper, 25 is an injection cylinder, 26 is an injection screw, 27 is an injection hydraulic cylinder, and 28 is an injection nozzle. connected to the sprue 11 of the device;
The injection screw 26 is rotationally driven by a well-known rotary drive unit (not shown), and reciprocated in the axial direction by an injection hydraulic cylinder 27.
２９ａ、２９ｂ、２９Ｃ，２９ｄは、前記各圧力センサ
２２ａｌ ２２ｂによる圧力検出値を電流値（または
電圧値）に変換するだめの変換器、３０ａ、３０ｂ、５
０Ｃ，３０ｄはアンプ、３１ａ。29a, 29b, 29C, and 29d are converters 30a, 30b, and 5 for converting the pressure detection values by the pressure sensors 22al and 22b into current values (or voltage values);
0C, 30d is an amplifier, 31a.
３１１）ｔ ３１Ｃ！、！＋１（ｌは演算器□、３２
ａ１３２ｔ）＋ｓ２ｃ＋ ３２ｄは各キャビティ２２
ａ、２２ｂにおける樹脂充填圧力の適正値すなわち第３
図で示した圧力”ａ＋ Ｐｌ：＋＋ ｐｏ、 ”
ｄ を設定した圧力設定器、５５”ｓ ３５ｂｅ
３３Ｃ＋ ３３ｄはサーボアンプ、３４ａ＋ ３
４ｂ、３４Ｃ，３４ｄは可変抵抗器を示し、これら各機
器が図示の如く接続され、かつ、各可変抵抗器３４ａ〜
３４（ｉが各ノズルチップヒータ１７ａｔ１７ｂに接続
され、これによシ、各圧力センサ２２ａ、２２ｂによる
圧力検出値に基づいて各可変抵抗器３４ａ〜３４ｄの抵
抗値を個々に制御し、各ノズルチップヒータ１７ａ、１
７ｂに給電される電流値を個々に制御して各ノズル１６
ｆＬｔ１６ｔ）の温度を個々に制御する第１制御回路を
構成している。311)t 31C! ,! +1 (l is arithmetic unit □, 32
a132t)+s2c+ 32d is each cavity 22
The appropriate value of the resin filling pressure in a and 22b, that is, the third
The pressure shown in the figure “a+ Pl: ++ po,”
d Pressure setting device, 55”s 35be
33C+ 33d is servo amplifier, 34a+ 3
4b, 34C, and 34d indicate variable resistors, and these devices are connected as shown in the figure, and each of the variable resistors 34a to 34d
34 (i) is connected to each nozzle chip heater 17at17b, which individually controls the resistance value of each variable resistor 34a to 34d based on the pressure detected by each pressure sensor 22a, 22b, and Heater 17a, 1
7b is individually controlled to control the current value supplied to each nozzle 16.
fLt16t) constitutes a first control circuit that individually controls the temperature of each.
５５ａｊ ５５ｂ、５５Ｃｓ ３５ａはアンプ、３
６は演算器、５７は充填完了後に射出装置２５を射出か
ら保持に切換えるときの各キャピテイ２２ａ＄ ２２
ｂ内の樹脂圧力の適正値たとえば第３図における圧力Ｐ
ｘを設定した圧力設定器、５８はサーボアンプ、３９は
サーボパルプ、４゜は油圧ポンプ、４１は逆止弁、４２
はＩＪ ＩＪ−フ弁を示し、これら各機器を図示の如く
接続することにより、前記各圧力センサ２２ａ＃ ２
２ｂによる圧力検出値に基づいて射出装置２５の射出−
保持の切換えを制御する第２制御回路を構成している。55aj 55b, 55Cs 35a is amplifier, 3
6 is a computing unit, and 57 is each capacity 22a when switching the injection device 25 from injection to holding after completion of filling.
Appropriate value of resin pressure in b For example, pressure P in Fig. 3
58 is a servo amplifier, 39 is a servo pulp, 4° is a hydraulic pump, 41 is a check valve, 42
indicates an IJ valve, and by connecting these devices as shown, each of the pressure sensors 22a#2
Injection of the injection device 25 based on the pressure detection value by 2b.
A second control circuit that controls switching of holding is configured.
４３ａ、４３ｂ、４３０．４！ｌｄはアンプ、４４はＡ
／ Ｄ変換器、４５は中央処理装置、４６は各キャビ
ティ２２ａ＃ ２２１）内の樹脂圧力の上限値Ｐｎａ
−Ｐａａを設定した圧力設定器、４７は同樹脂圧力の下
限値ＰＬａ−ＰＬｄ を設定した圧力設定器、４８は圧
力監視スイッチ、４９は入力装置、５０は出力装置、５
１ａｊ ５１ｂｊ ５１Ｑ。43a, 43b, 430.4! ld is amplifier, 44 is A
/D converter, 45 is the central processing unit, 46 is the upper limit value Pna of the resin pressure in each cavity 22a#221)
47 is a pressure setting device that sets the lower limit value PLa-PLd of the same resin pressure, 48 is a pressure monitoring switch, 49 is an input device, 50 is an output device, 5
1aj 51bj 51Q.
５１ｄは表示ランプ、５２は警報ブザーを示し、これら
を図示の如く接続することにより、各キャビティ２２ａ
、２２１）内の樹脂圧力に異常が発生したときに表示ラ
ンプ５１ａ〜５１ｄを点灯すると共に、警報ブザ−５２
を鳴動させ′て警報を発する補助的な第６制御回路を構
成している。51d is an indicator lamp, 52 is an alarm buzzer, and by connecting these as shown, each cavity 22a
, 221), the indicator lamps 51a to 51d are turned on and the alarm buzzer 52 is turned on.
This constitutes an auxiliary sixth control circuit that sounds the alarm and issues an alarm.
次に作用について説明する。Next, the effect will be explained.
まず、射出装置２５のホッパ２４から投入された樹脂は
射出シリンダ２５内で射出スクリュ２６の回転により溶
融混練され、その溶融樹脂が射出用油圧シリンダ２７の
作動によって金型装置のスプル１１に射出され、該スプ
ル１１から各ホノトラ／す１２ａｔｔ２ｂに分散され、
各ノズル１４ａ＋１４１）を経て各キャビティ７ａ、Ｚ
ｂ内に充填される。First, the resin introduced from the hopper 24 of the injection device 25 is melted and kneaded in the injection cylinder 25 by the rotation of the injection screw 26, and the molten resin is injected into the sprue 11 of the mold device by the operation of the injection hydraulic cylinder 27. , distributed from the sprue 11 to each honotra/su 12att2b,
Each cavity 7a, Z via each nozzle 14a+141)
filled in b.
このとき、第１制御回路において、各キャビティ７ａｔ
７１）内の樹脂圧力がそれぞれ圧力センサ２２ａ、２２
１）によって個々に検出され、それらの検出信号がそれ
ぞれ変換器２９ａ〜２９ｄに送られて電流値に変換され
た後、各アンプ３０ａ〜３０ｄにより増幅され、各演算
器３１ａ〜３１ｄを経て各サーボアンプ３３ａ〜３３ｄ
に送られ、ここで予め設定された各圧力設定器３２ａ−
３２ｄからの信号と比較され、その比較値に基づいて各
可変抵抗器３４ａ〜５４ｄの抵抗値が制御され、各ノズ
ルチップヒータ１７ａｌ１７ｂに給電される電流値が制
御され、各ヒータ１７ａ、１７ｂの温度すなわち各ノズ
ルチップ１６ａ１１６ｂの温度が個々に第４図または第
５図に示す如く制御される。At this time, in the first control circuit, each cavity 7at
71) are detected by the pressure sensors 22a and 22, respectively.
1), and the detection signals are sent to converters 29a to 29d and converted into current values, and then amplified by each amplifier 30a to 30d, and passed through each arithmetic unit 31a to 31d to each servo. Amplifiers 33a to 33d
and each pressure setting device 32a- set in advance here.
32d, the resistance value of each variable resistor 34a to 54d is controlled based on the comparison value, the current value supplied to each nozzle chip heater 17al17b is controlled, and the temperature of each heater 17a, 17b is controlled. That is, the temperature of each nozzle tip 16a116b is individually controlled as shown in FIG. 4 or FIG. 5.
すなわち、第４図において、射出開始時を１゜時とする
と、まず、射出開始前の一１１時（一般には金型の閉鎖
が開始された時）に、ノズルチップヒータ１７ａ、１７
１）にかける電流値を最大ＡＮａＮＡＮｄとし、射出開
始前にノズルチップ１６ａ、１６ｂの温度を所定の温度
ＴＮａ−Ｔｎｄ℃に上昇させる。然る後、射出開始時ｔ
ｏに射出を開始し、金型内の各キャピテイ７ａ、７ｂに
樹脂を充填する。この充填時には、第５図に示した如く
各キャビティ７ａ、７ｂ毎に充填圧力の特性が異なり、
充填状況が異なる。従って、第４図では１個のキャビテ
ィに対応する１組の制御曲線のみを代表的に図示してい
るが、実際には各キャビティ７ａ、７ｂ毎にそのキャピ
テイの特性に対応して第４図に示す制御曲線に基づいて
各ノズルチップヒータ１７ａ、１７ｂにかける電流値を
個々に制御する。That is, in FIG. 4, assuming that the injection start time is 1 o'clock, the nozzle tip heaters 17a and 17 are
1) The current value applied is set to the maximum ANaNANd, and the temperature of the nozzle tips 16a, 16b is raised to a predetermined temperature TNa-Tnd° C. before the start of injection. After that, at the start of injection t
Injection is started at o, and each cavity 7a, 7b in the mold is filled with resin. During this filling, the characteristics of the filling pressure are different for each cavity 7a, 7b as shown in FIG.
Filling situation is different. Therefore, although FIG. 4 representatively shows only one set of control curves corresponding to one cavity, in reality, FIG. The current value applied to each nozzle tip heater 17a, 17b is individually controlled based on the control curve shown in FIG.
こうして各キャビティ７ａν ７ｂ毎にそのキャビティ
の特性に対応して各ノズルチップヒータ１７ａ１．１７
１）にかける電流値（または電圧値）を個々に制御し、
これら各ヒータ１７ａｔ１７ｂの温度すなわち各ノズル
チップ１６ａ、１６ｂの温度を個々に制御することによ
って、各ノズル１４ａ１１４ｔｌ内の樹脂さらには各キ
ャビティ７ａｔ７ｂ内の樹脂の温度が個々に制御され、
これに伴って各キャビティ７ａｔ７ｂ内の樹脂の粘性が
個々に制御されると共に、各キャピテイ７ａｔＺｂ内の
樹脂圧力が個々に制御され、各キャビティ７ａ＋７ｂ毎
に最適な充填圧力で樹脂が充填されることになる。In this way, each nozzle tip heater 17a1.
1) Individually control the current value (or voltage value) applied to the
By individually controlling the temperature of each of these heaters 17at17b, that is, the temperature of each nozzle chip 16a, 16b, the temperature of the resin in each nozzle 14a114tl and also the resin in each cavity 7at7b is individually controlled,
Accordingly, the viscosity of the resin in each cavity 7at7b is individually controlled, and the resin pressure in each cavity 7atZb is individually controlled, so that each cavity 7a+7b is filled with resin at the optimal filling pressure. Become.
そして、射出開始から所定時間経過しくｔａ〜ｔｄ時）
、前゛記キャピテイ７ａ、７ｂ内の樹脂圧力が最適充填
圧力Ｐａ、−、＝Ｐｄになると、その圧力を検出した各
圧力センサ２２ａ＄ ２２ｂからの検出信号に基づい
て各ノズルチップヒータにかけられる電流値を遂次小さ
くなるように制御し、各ノズルチップトロａｔ１６ｂの
温度を遂次低下するように制御する。 。Then, a predetermined period of time has elapsed since the start of injection (from ta to td).
, When the resin pressure in the cavities 7a and 7b reaches the optimum filling pressure Pa, -, = Pd, the current is applied to each nozzle tip heater based on the detection signal from each pressure sensor 22a$22b that detects the pressure. The temperature of each nozzle tip at 16b is controlled so as to gradually decrease. .
なお、第４図の制御では、射出開始前に各ノズルチップ
ヒータ１７ａ＄１７１）の電流値およびノズルチップ１
６１！Ｌ、１６１）の温度をそれぞれ最高値に制御し、
各キャビティ内の樹脂圧力がそれぞれ最適充填圧力Ｐａ
−Ｐｄになったときに、前記各電流値および各温度を急
勾配で逐次最低値に切換えるいわゆるタイミング制御を
主としており、この制御だけでも一般的な成形品の射出
成形であれば充分に効果を発揮できるが、寸法精度を要
求される精密品の場合には第５図に示す如く制御する。In addition, in the control shown in FIG. 4, the current value of each nozzle tip heater 17a ($171) and the nozzle tip 1 are
61! L, 161) are controlled to their respective maximum values,
The resin pressure in each cavity is the optimum filling pressure Pa
-Pd, the current value and each temperature are sequentially switched to the lowest value at a steep gradient.This control alone is sufficient for injection molding of general molded products. However, in the case of precision products requiring dimensional accuracy, control is performed as shown in FIG.
すなわち、第５図では、各ノズルチップヒータ１７ａ、
１７ｂの電流値を、各圧力センサ２２ａ。That is, in FIG. 5, each nozzle chip heater 17a,
17b to each pressure sensor 22a.
２２ｂによる検出信号に基づいて、各キャビティ７ａ、
Ｚｂ内の樹脂圧力がそれぞれ篭適充填圧力Ｐａ−Ｐｄに
なった時点から第６図で示した圧力特性に旧って降下す
る圧力曲線に比例するように、各演算器３１ａ２３１ｂ
ｔ ３１Ｃ，３１（ｌにて演舞しながら連続的にかつ
緩勾配で降下するように個々に制御し、これによって、
各ノズルチップ１７ａ、１７ｂの温度を制御すると共に
、各ノズ／Ｌ１６ａｌ１６ｂならびに各キャビティ７ａ
、７ｂ内の樹脂温度を制御し、該樹脂の粘度を制御して
各キャピテイ・７ａｊ ７１１内の実際の樹脂圧力が
第５図で示した各キャビティの特性に対応した圧力とな
るように遂次補正する如く制御される。この制御方法に
よれば、第４図の制御に比べてより精密な制御が行われ
、精度を要求される成形品を成形する場合に最適な樹脂
充填圧力の制御が行われる。22b, each cavity 7a,
Each computing unit 31a231b is adjusted so that the resin pressure in Zb is proportional to the pressure curve that drops to the pressure characteristic shown in FIG.
t 31C, 31 (l) and are individually controlled to descend continuously and at a gentle slope, thereby
While controlling the temperature of each nozzle chip 17a, 17b, each nozzle/L16al16b and each cavity 7a
, 7b and the viscosity of the resin so that the actual resin pressure in each cavity 7aj 711 corresponds to the characteristics of each cavity shown in FIG. It is controlled to correct. According to this control method, more precise control is performed compared to the control shown in FIG. 4, and optimal resin filling pressure control is performed when molding a molded product that requires precision.
一方、上記各圧力センサ２２ａｔ ２２１）による検
出信号は、各変換器２９１Ｌ〜２９ｄにより電流値に変
換された後、第２制御回路の各アンプ５５ａ〜３５ｄに
も送られ、増幅された後、演算器５６を経てサーボアン
プ３８に送られ、ここで圧力設定器３７からの信号と比
較され、その比較値に基づいてサーボパルプ３９のスプ
ール開度力制御され、油圧ポンプ４０から射出用油圧シ
リンダ２７に供給される圧油の流量が制御され、射出ス
クリュ２６の射出ストロークおよび射出速度が制御され
る。そして、最後に充填完了されたキャビティこの場合
は第６キヤピテイ内の樹脂圧力が所定の圧力Ｐｘまで降
下すると、これを検出した圧力センサからの信号に基づ
いて前記サーボパルプ５９が制御され、射出用油圧シリ
ンダ２７に対する油圧力が射出圧力から保持圧力に切換
えられる０また、この切換えに伴って各冷却媒体通路１
８ａ、［１３ｂに冷却水または油等の冷却媒体が供給さ
れ、各キャビティ７ａｐＺｂ内に充填された樹脂が冷却
固化され、然る後、金型を用いて各キャビティ７ａ、７
１）内で冷却固化された樹脂成形品が取出される。On the other hand, the detection signals from the pressure sensors 22at 221) are converted into current values by the converters 291L to 29d, and then sent to the amplifiers 55a to 35d of the second control circuit, amplified, and then calculated. The signal is sent to the servo amplifier 38 via the pressure setting device 56, where it is compared with the signal from the pressure setting device 37, and the spool opening force of the servo pulp 39 is controlled based on the comparison value, and the signal is sent from the hydraulic pump 40 to the injection hydraulic cylinder 27. The flow rate of pressure oil supplied to the injection screw 26 is controlled, and the injection stroke and injection speed of the injection screw 26 are controlled. When the resin pressure in the cavity that has been filled lastly, in this case, the sixth cavity, drops to a predetermined pressure Px, the servo pulp 59 is controlled based on the signal from the pressure sensor that detects this, and the injection The hydraulic pressure applied to the hydraulic cylinder 27 is switched from injection pressure to holding pressure. Also, with this switching, each cooling medium passage 1
A cooling medium such as cooling water or oil is supplied to 8a and 13b, and the resin filled in each cavity 7apZb is cooled and solidified, and then a mold is used to mold each cavity 7a and 7.
The resin molded product cooled and solidified in 1) is taken out.
なお、前記射出、充填工程において、各圧力センサ２２
ａｌ ２２１）による検出信号は、各変換器２９ａ〜
２９ｄにより電流値に変換された後、第３制御回路の各
アンプ４５＆〜４３ｄにも送られ増幅された後、’Ａ／
Ｄ変換器４４によりデジタル信号に変換されて中央処理
装置４５に送られ、ここで、各圧力設定器４６．４７か
らの信号と比較され、前記各キャビティ７ａ＋７ｂ内の
樹脂圧力に異常が発生したときに、そのキャビティに対
応する表示ランプ５１ａ〜５１ｄを点灯すると共に、警
報ブザ−５２を鳴動させて警報を発する。In addition, in the injection and filling process, each pressure sensor 22
al 221) is detected by each converter 29a~
After being converted into a current value by 29d, it is also sent to each amplifier 45&~43d of the third control circuit and amplified, and then 'A/
It is converted into a digital signal by the D converter 44 and sent to the central processing unit 45, where it is compared with the signals from each pressure setting device 46, 47, and when an abnormality occurs in the resin pressure in each cavity 7a+7b. Then, the display lamps 51a to 51d corresponding to the cavity are turned on, and the alarm buzzer 52 is sounded to issue an alarm.
ところで、上記実施例では、各ノズルチップ１６ａｔ１
６１）に設けたノズルチップヒータ１７ａ。By the way, in the above embodiment, each nozzle chip 16at1
Nozzle chip heater 17a provided in 61).
１７ｂの電流値を個々に制御してノズルチップ１６ａｔ
１６ｔ）の温度を制御しているが、各ノズル１４ａｔ１
４ｂのまわりに設けたノズルヒータ１５ａ、１５ｂの電
流値を個々に制御してもよい。The current value of the nozzle tip 16at is individually controlled.
16t), but each nozzle 14at1
The current values of the nozzle heaters 15a and 15b provided around the nozzle heater 4b may be individually controlled.
以上説明したように、本発明によれば、一台の射出装置
から金型内に設けた複数個のキャビティ内に溶融樹脂を
射出充填する際に、各キャビテイ毎に樹脂の射出充填圧
力を検出し、それらの検出値に基づいて、それぞれのキ
ャビティに対応するノズルの近く′に設けた各ノズルチ
ップヒータまたは各ノズルヒータの温度を個々に制御す
ることにより、各ノズルから各キャピテイに充填される
樹脂の温度、粘度を個々を制御し、以って各キャビティ
内の樹脂圧力を個々に制御し、各キャビテイ毎に最適な
状態で樹脂を射出充填でき、ショートシ冒ットやオーバ
パック現象が生じることなく、全てのキャビティから良
品質の樹脂成形品を得ることができる。また、オーバパ
ックに起因する金型の破損も未然に防止できるのである
。As explained above, according to the present invention, when injecting and filling molten resin into a plurality of cavities provided in a mold from one injection device, the injection filling pressure of the resin is detected for each cavity. Based on these detected values, the temperature of each nozzle chip heater or each nozzle heater installed near the nozzle corresponding to each cavity is individually controlled, thereby reducing the amount of resin filled into each cavity from each nozzle. By individually controlling the temperature and viscosity of each cavity, the resin pressure inside each cavity can be individually controlled, and resin can be injected and filled in the optimal condition for each cavity, which prevents short discharge and overpacking phenomena. Good quality resin molded products can be obtained from all cavities without any problems. Furthermore, damage to the mold due to overpacking can be prevented.
第１図は本発明に使用される金型装置の一例を示す断面
図、第２図は本発明の実施例を示す制御系統説明図、第
３図は射出圧力と各キャビティ内の樹脂圧力との関係を
示す圧力特性図、第４図は本発明による制御例を示す制
御特性図、第５図は本発明の別の制御例を示す制御特性
図である。
１・・・固定盤、２・・・固定金型、３・・・可動金型
、４・・・可動盤、５ａ、５ｂ・・・型孔、６’＋６ｂ
・・・コア、７ａ）７ｂ・・・キャビティ、１１・・・
スプル、、 １２ ａ。
１２１）・・・ホットランナ、１３ａ、１３ｂ・・・ホ
ットランナヒータ、１４ａｊ １４ｂ・ ノズル、１
５ａ。
１５ｂ・・・ノズルヒータ、１６ａｌ１６ｂ・・・ノズ
ルチッ７”、１７ａ、 １７ｂ・・・ノズルチップヒ
ータ、２３・・・射出装置、２４・・・ホッパ、２５・
・射出シリンダ、２６・・・射出スクリュ、２７・・・
射出用油圧シリンダ、２８・・・射出ノズル、２９ａ〜
２９ｄ・・・変換器、５０ａ 〜３０ｄ−７ｙブ、３１
ａ〜５１ｄ・・・演算器、５２ａ〜３２ｄ・・・圧力設
定器、３３ａ〜３３（ｉ・・・サーボアンプ、５４ａ〜
３４ｄ・・・可変抵抗器、５５ａ〜３５（１・・・アン
プ、５６・・・演算器、３７・・・圧力設定器、５８・
・・サーボアンプ、６９サーボバルブ、４０−・・油圧
ボシプ。
特許出願人 株式会社神戸製鋼所
代理人 弁理士 小 谷 悦 司？二
仄、。
、、、−＋Ｈ′Fig. 1 is a sectional view showing an example of a mold device used in the present invention, Fig. 2 is an explanatory diagram of a control system showing an embodiment of the present invention, and Fig. 3 is a diagram showing injection pressure and resin pressure in each cavity. FIG. 4 is a control characteristic diagram showing a control example according to the present invention, and FIG. 5 is a control characteristic diagram showing another control example according to the present invention. 1... Fixed plate, 2... Fixed mold, 3... Movable mold, 4... Movable plate, 5a, 5b... Mold hole, 6'+6b
... Core, 7a) 7b... Cavity, 11...
Sprue,, 12 a. 121)...Hot runner, 13a, 13b...Hot runner heater, 14aj 14b・Nozzle, 1
5a. 15b... Nozzle heater, 16al16b... Nozzle tip 7'', 17a, 17b... Nozzle tip heater, 23... Injection device, 24... Hopper, 25...
・Injection cylinder, 26... Injection screw, 27...
Hydraulic cylinder for injection, 28... Injection nozzle, 29a~
29d...Converter, 50a to 30d-7y, 31
a to 51d...Arithmetic unit, 52a to 32d...Pressure setting device, 33a to 33 (i...Servo amplifier, 54a to
34d... Variable resistor, 55a-35 (1... Amplifier, 56... Arithmetic unit, 37... Pressure setting device, 58...
...Servo amplifier, 69 servo valve, 40-...hydraulic boss. Patent applicant Kobe Steel, Ltd. Representative Patent attorney Etsuka Kotani? Two quarters. ,,,−+H′
Claims (1)
内に溶融樹脂を射出充填して複数個の樹脂成形品を射出
成形する方法において、各キャビティ内の樹脂圧力を個
々に検出し、各検出値に基づいてそれぞれのキャビティ
に対応するノズルの近くに設けた各ヒータの温度を個々
に制御することにより、各ノズルから各キャビティに充
填される樹脂の粘度を個々に制御することを特徴とする
射出成形機の制御方法。1. In a method of injection molding multiple resin molded products by injecting and filling multiple cavities provided in a mold with an injection device, the resin pressure in each cavity is individually detected. By individually controlling the temperature of each heater installed near the nozzle corresponding to each cavity based on each detected value, it is possible to individually control the viscosity of the resin filled from each nozzle into each cavity. Characteristic injection molding machine control method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2656782A JPS58142831A (en) | 1982-02-19 | 1982-02-19 | Controlling method of injection molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2656782A JPS58142831A (en) | 1982-02-19 | 1982-02-19 | Controlling method of injection molding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58142831A true JPS58142831A (en) | 1983-08-25 |
Family
ID=12197113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2656782A Pending JPS58142831A (en) | 1982-02-19 | 1982-02-19 | Controlling method of injection molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58142831A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2774323A1 (en) * | 1998-02-05 | 1999-08-06 | Segaplast | Automatic closed loop viscosity regulation equipment for injection molding press |
| WO2006000411A1 (en) * | 2004-06-29 | 2006-01-05 | Priamus System Technologies Ag | Method for filling at least one cavity |
| EP1862292A2 (en) * | 2002-01-09 | 2007-12-05 | Mold-Masters Limited | Method and apparatus for adjusting the temperature of molten material in a mold cavity |
| CN112805133A (en) * | 2018-10-05 | 2021-05-14 | 基斯特勒控股公司 | Method for controlling an injection molding system |
-
1982
- 1982-02-19 JP JP2656782A patent/JPS58142831A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2774323A1 (en) * | 1998-02-05 | 1999-08-06 | Segaplast | Automatic closed loop viscosity regulation equipment for injection molding press |
| EP1862292A2 (en) * | 2002-01-09 | 2007-12-05 | Mold-Masters Limited | Method and apparatus for adjusting the temperature of molten material in a mold cavity |
| EP1862292A3 (en) * | 2002-01-09 | 2007-12-26 | Mold-Masters Limited | Method and apparatus for adjusting the temperature of molten material in a mold cavity |
| USRE40952E1 (en) | 2002-01-09 | 2009-11-10 | Mold-Masters (2007) Limited | Method and apparatus for measuring the temperature of molten material in a mold cavity |
| WO2006000411A1 (en) * | 2004-06-29 | 2006-01-05 | Priamus System Technologies Ag | Method for filling at least one cavity |
| CN112805133A (en) * | 2018-10-05 | 2021-05-14 | 基斯特勒控股公司 | Method for controlling an injection molding system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5154935A (en) | Injection pressure control apparatus for an electrically-operated injection molding machine | |
| KR100408886B1 (en) | Method And Apparatus For Controlling Injection Molding Machine Capable Of Reducing Variations In Weight Of Molded Products | |
| JPS58142831A (en) | Controlling method of injection molding machine | |
| US4844847A (en) | Method and apparatus for controlling injection molding machines | |
| KR20100048392A (en) | Apparatus and method for injection molding | |
| JP3437907B2 (en) | Insulation control method and apparatus for injection molding machine | |
| JPS63209918A (en) | Method for setting molding conditions of injection molder | |
| JP4210099B2 (en) | Injection molding machine | |
| JP2005111507A (en) | Metal mold with multi-cavities for injection molding | |
| JPH0622845B2 (en) | Control method of injection molding machine | |
| JPH0422130B2 (en) | ||
| JPS6146293B2 (en) | ||
| JPS6326686B2 (en) | ||
| JPS6125816A (en) | Injection molding method and injection molding machine | |
| JP2000117800A (en) | Equipment and method for raising temperature of injection molding machine | |
| JPH07121539B2 (en) | Setting device of injection molding machine | |
| JP2595834B2 (en) | How to measure the number of low pressure castings | |
| JPH0548735B2 (en) | ||
| JP2711909B2 (en) | Insulation control device for injection molding machine | |
| JP2000211001A (en) | Method for injection press molding and injection press molding machine | |
| JPH0212161B2 (en) | ||
| CA1087279A (en) | Time independent cycle control for plastic injection molding machines | |
| SU861087A1 (en) | Method of automatic control of stage of filling mould cavity with melt at pressure casting of precesion articles from plastics | |
| JPS6225086B2 (en) | ||
| JP2021098277A (en) | Injection molding machine and program |