JPS5811872U - Printed wiring board connection device using parallel lead wires - Google Patents
Printed wiring board connection device using parallel lead wiresInfo
- Publication number
- JPS5811872U JPS5811872U JP1981106377U JP10637781U JPS5811872U JP S5811872 U JPS5811872 U JP S5811872U JP 1981106377 U JP1981106377 U JP 1981106377U JP 10637781 U JP10637781 U JP 10637781U JP S5811872 U JPS5811872 U JP S5811872U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- parallel
- parallel lead
- wiring board
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本案の接続装置における一実施例の断側面図、
第２図〜第４図は同装置の説明図である。
１・・・・・・シャーシ、２．１２・・・・・・ビス、
５・・・・・・印刷配線板、４・・・・・・前面パネル
、６・・・・・・平行リード線、７，１１・・・・・・
電気部品、８，９・・・・・・導体層、１０・・・・・
・切欠。FIG. 1 is a cross-sectional side view of an embodiment of the connection device of the present invention;
FIGS. 2 to 4 are explanatory diagrams of the device. 1...Chassis, 2.12...Bis,
5...Printed wiring board, 4...Front panel, 6...Parallel lead wire, 7, 11...
Electrical parts, 8, 9... Conductor layer, 10...
・Notch.
Claims (2)
行リード線の端部より突出した各芯線を上記各導体層の
主面に対して互に平行になるように接触させこの状態で
両者間を互に半田付けする平行リード線による印刷配線
板の接続装置において、上記印刷配線板を収納する前面
パネルその他のケースに上記平行リード線の各芯線を上
記印刷配線板の各導体層に対向させ、上記平行リード線
を上記印刷配線に対してはＳ゛平行なるように配置した
とき、上記平行リード線が嵌入される切欠きを形成し、
この切欠きによって上記平行リード線の位置決めを行な
うように構成して成る平行リード線による印刷配線板の
接続装置。(1) Each core wire protruding from the end of the parallel lead wire is brought into contact with each conductor layer formed on the printed wiring board so as to be parallel to the main surface of each conductor layer, and in this state, between the two In a printed wiring board connection device using parallel lead wires that are soldered to each other, each core wire of the parallel lead wires is arranged to face each conductor layer of the printed wiring board on a front panel or other case that houses the printed wiring board. , forming a notch into which the parallel lead wire is inserted when the parallel lead wire is arranged so as to be parallel to the printed wiring;
A connecting device for a printed wiring board using parallel lead wires, which is configured to position the parallel lead wires using the notch.
した状態で上記端部の絶縁被覆を剥離した平行リード線
を使用して成る実用新案登録請求の範囲第１項記載の平
行リード線による印刷配線板の接続装置。(2) Parallel according to claim 1 of the utility model registration claim, which uses a parallel lead wire with the insulating coating removed from the end while leaving a part of the leading end of the parallel lead wire as a parallel lead wire. Connection device for printed wiring boards using lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981106377U JPS5811872U (en) | 1981-07-16 | 1981-07-16 | Printed wiring board connection device using parallel lead wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981106377U JPS5811872U (en) | 1981-07-16 | 1981-07-16 | Printed wiring board connection device using parallel lead wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5811872U true JPS5811872U (en) | 1983-01-25 |
| JPH0129742Y2 JPH0129742Y2 (en) | 1989-09-11 |
Family
ID=29900864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981106377U Granted JPS5811872U (en) | 1981-07-16 | 1981-07-16 | Printed wiring board connection device using parallel lead wires |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811872U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11682914B2 (en) | 2016-11-25 | 2023-06-20 | Dyson Technology Limited | Battery system |
-
1981
- 1981-07-16 JP JP1981106377U patent/JPS5811872U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11682914B2 (en) | 2016-11-25 | 2023-06-20 | Dyson Technology Limited | Battery system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129742Y2 (en) | 1989-09-11 |
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