JPS5810391Y2 - Printed circuit board with lug terminals - Google Patents

Printed circuit board with lug terminals

Info

Publication number
JPS5810391Y2
JPS5810391Y2 JP1977116766U JP11676677U JPS5810391Y2 JP S5810391 Y2 JPS5810391 Y2 JP S5810391Y2 JP 1977116766 U JP1977116766 U JP 1977116766U JP 11676677 U JP11676677 U JP 11676677U JP S5810391 Y2 JPS5810391 Y2 JP S5810391Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
lug
hole
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977116766U
Other languages
Japanese (ja)
Other versions
JPS5441954U (en
Inventor
昭 西村
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1977116766U priority Critical patent/JPS5810391Y2/en
Publication of JPS5441954U publication Critical patent/JPS5441954U/ja
Application granted granted Critical
Publication of JPS5810391Y2 publication Critical patent/JPS5810391Y2/en
Expired legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 この考案はラグ端子付プリント基板、特に半田浸漬法に
よりプリント配線されたプリント基板と他の基板に固設
したリード支柱とを電気機械的に結合するに好適なラグ
端子の構造に関する。
[Detailed description of the invention] This invention is a printed circuit board with lug terminals, particularly a lug terminal suitable for electromechanically connecting a printed circuit board printed with solder dipping and a lead support fixed to another board. Regarding the structure of

通信機器等の組立構造では複数の配線基板をサブアッセ
ンブルした後、相互に電気機械的に結合して取付部品の
実装密度を高めて小型化を計ることが行なわれている。
BACKGROUND ART In the assembly structure of communication equipment, etc., a plurality of wiring boards are sub-assembled and then electromechanically coupled to each other to increase the mounting density of attached parts and to reduce the size.

例えば、各配線基板としてプリント基板を互に結合する
場合やチューナのようにシャーシベースとプリント基板
との結合がある。
For example, there is a case where printed circuit boards are connected to each other as each wiring board, or a case where a chassis base and a printed circuit board are connected as in a tuner.

このような結合構造は、通常一方の基板に固定されたリ
ード支柱を他方の基板に設けたはとめ端子に挿通し半田
固着したり、それぞれにはとめ端子を設けた複数のプリ
ント基板を各はとめ端子を挿通したリード支柱を用いて
半田固着している。
Such a bonding structure usually involves inserting and soldering a lead post fixed to one board into a grommet terminal on the other board, or connecting multiple printed circuit boards each with a grommet terminal. It is fixed by soldering using a lead post with a stop terminal inserted through it.

そして、プリント基板のサブアッセンブルは半田浸漬法
で半田付けし、リード支柱とはとめ端子間の接続は手半
田で行なわれる。
The subassembly of the printed circuit board is soldered using the solder dipping method, and the connection between the lead support and the eyelet terminal is made by hand soldering.

しかし、従来のはとめ端子構造では半田浸漬に際しては
とめ半田埋まり、すなわち、はとめ端子の穴づまりが生
じてリード支柱の挿通を不可能にすることがあった。
However, in the conventional eyelet terminal structure, when the eyelet terminal is dipped in solder, the eyelet solder may become buried, that is, the hole of the eyelet terminal may become clogged, making it impossible to insert the lead support.

このような半田埋まりはその補修に多大の工数を要し組
立作業にとって重大な障害となっていた。
Such solder filling requires a large amount of man-hours to repair, and is a serious hindrance to assembly work.

特に、多数のはとめ端子を連続的に並べてはとめ穴を比
較的小径にする場合には半田の表面張力が増大して穴づ
まりを生じ易くしている。
In particular, when a large number of eyelet terminals are arranged in succession to make the eyelet holes relatively small in diameter, the surface tension of the solder increases, making the holes more likely to become clogged.

従って、本考案の目的は上記に鑑み提案されたものであ
り、改良されたラグ付きプリント基板を提供することに
ある。
SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an improved printed circuit board with lugs.

本考案によれば、従来のはとめ端子に代えて金属板を打
抜き形成したラグ端子が用いられる。
According to the present invention, a lug terminal formed by stamping a metal plate is used in place of the conventional eyelet terminal.

このラグ端子は中央に透孔を形成した基部と先端を折曲
した脚部とを具備する。
This lug terminal includes a base portion having a through hole formed in the center and a leg portion having a bent tip.

すなわち、金属シート板に連続する状態で所定形状にプ
レス成形された打抜体から各プレス片を切り離し、次に
対向する脚部を折曲形威し、更に脚部先端を折曲する。
That is, each press piece is separated from a punched body that has been press-formed into a predetermined shape while continuing on a metal sheet plate, and then the opposing legs are bent and the tips of the legs are bent.

このような金属板ラグ端子はその両脚部を弾性変形して
プリント基板のスルーホールに挿着され、その先端側で
プリント基板の導電ランドと半田浸漬法で半田付けされ
る。
Such a metal plate lug terminal is inserted into a through hole of a printed circuit board by elastically deforming both legs, and its tip side is soldered to a conductive land of the printed circuit board by a solder dipping method.

ここで、ラグ端子の基部はスルーホールより大きく形威
しラグ端子の挿着を容易にし脚部の折曲先端と共にプリ
ント基板上での仮保持に役立てられる。
Here, the base of the lug terminal is larger in shape than the through hole to facilitate insertion and attachment of the lug terminal, and to be used together with the bent ends of the legs to temporarily hold the lug terminal on the printed circuit board.

また、プリント基板の導電ランドはスルーホールの周辺
部分のうちラグ端子の脚部が位置する部分にのみ延在さ
せることで導電ランド間の半田ブリッヂやそれによるス
ルーホール穴づまりの防止になる。
Further, by extending the conductive lands of the printed circuit board only to the portions around the through holes where the leg portions of the lug terminals are located, solder bridges between the conductive lands and clogging of the through holes due to the solder bridges can be prevented.

一方、本考案の別の観点において、前述するようなラグ
端子付プリント基板は、別の基板に固設したリード支柱
、例えば、シールドケースに取付けた貫通コンデンサの
リードと電気的機械的に結合される。
On the other hand, in another aspect of the present invention, a printed circuit board with lug terminals as described above is electrically and mechanically coupled to a lead support fixed to another board, for example, a feedthrough capacitor lead attached to a shield case. Ru.

リード支柱はこれをラグ端子の基部の中央透孔に挿通し
ラグ端子と手半田等により半田付けされる。
The lead support is inserted into the central through hole at the base of the lug terminal and soldered to the lug terminal by hand soldering or the like.

従って、半田埋まりかなく配線基板間をリード支柱で結
合し得るラグ端子付プリント基板が簡単な構造と組立作
業により得られる。
Therefore, a printed circuit board with lug terminals capable of connecting wiring boards with lead supports without being filled with solder can be obtained with a simple structure and assembly work.

特に、ラグ端子は自動化に適する構造であるがらその工
業的価値が大きい。
In particular, lug terminals have a structure suitable for automation and have great industrial value.

以下、本考案について図面を参照しつつ詳述する。Hereinafter, the present invention will be explained in detail with reference to the drawings.

第1図乃至第3図は従来のはとめ端子付プリント基板の
取付構造を示している。
1 to 3 show a conventional mounting structure for a printed circuit board with eyelet terminals.

第1図の部分断面図においては、はとめ端子1を取付け
たプリント基板2が別の基板3に固定したリード支柱4
を介して結合する構造が示されているが、リード支柱4
をはとめ1に挿通し半田5で固着するに先立つプリント
基板20半田処理ではとめの穴づまりが問題となる。
In the partial cross-sectional view of FIG.
Although a structure is shown that connects via the lead strut 4
In soldering of the printed circuit board 20 prior to inserting it into the eyelet 1 and fixing it with solder 5, clogging of the eyelet hole becomes a problem.

通常、はとめ端子1はプリント基板2の導電ランド6側
でスルーホール7の全周に亙って位置しているので(第
2図参照)、プリント基板2を半田浸漬処理するとき、
第3図に示すように、スルーホール7に半田槽8のデツ
プ用半田が゛ない上って半田埋よりとなる。
Normally, the eyelet terminal 1 is located around the entire circumference of the through hole 7 on the conductive land 6 side of the printed circuit board 2 (see Fig. 2), so when the printed circuit board 2 is subjected to solder dipping,
As shown in FIG. 3, there is no solder for the depth in the solder tank 8 in the through hole 7, and the solder is buried therein.

このような半田埋まりのしたはとめ端子1はリード支柱
4の挿通を不能にするので第1図の組立体に利用できず
再度加熱して穴づまりの半田を除去しなければならない
Such a solder-filled eyelet terminal 1 makes it impossible to insert the lead support 4, and therefore cannot be used in the assembly shown in FIG. 1, and must be heated again to remove the solder stuck in the hole.

また、このような半田埋まりを防ぐため、半田の付かな
い詰物の使用や半田レジストの利用があったが、作業性
を著しるしく低下させ付加部品や付加工程を必要とする
ので製造コストの上昇を招いていた。
Additionally, in order to prevent such solder filling, non-solder fillers and solder resists have been used, but this significantly reduces workability and requires additional parts and processes, which increases manufacturing costs. was inviting.

本考案は上記欠陥を除去するものであり、第4図乃至第
8図にその取付構造を示している。
The present invention eliminates the above defects, and its mounting structure is shown in FIGS. 4 to 8.

第4図は本考案に係るラグ端子10を取付けたプリント
基板20に別の基板として、例えば、チューナのシャー
シベース30を、このシャーシベース30に固定した貫
通コンデンサ31のリード支柱32を介して電気機械的
に結合した構造の部分的断面図である。
FIG. 4 shows that a chassis base 30 of a tuner, for example, is connected to the printed circuit board 20 on which the lug terminal 10 according to the present invention is attached, and electricity is supplied via the lead support 32 of a feedthrough capacitor 31 fixed to the chassis base 30. FIG. 3 is a partial cross-sectional view of a mechanically coupled structure.

プリント基板20に対するラグ端子10の取付けは通常
のプリント基板20への実装部品と共に半田浸漬法によ
り半田付けして、サブアッセンブルされたものが用いら
れる。
The lug terminals 10 are attached to the printed circuit board 20 by soldering together with ordinary components mounted on the printed circuit board 20 by a solder dipping method, thereby subassembling the lug terminals 10.

第5図に示すように、ラグ端子10は中央に透孔11を
形成した基部12に先端13を折曲した脚部14を対向
して設けた金属板から戒る。
As shown in FIG. 5, the lug terminal 10 consists of a metal plate having a base 12 having a through hole 11 formed in the center and legs 14 having bent tips 13 facing each other.

このラグ端子10は好ましくは、第6図に示すような金
属シート板15を所定形状にプレス加工して互に連絡し
た打抜片16を、その連結部分17から切り離して新曲
加工されて作られる。
This lug terminal 10 is preferably made by pressing a metal sheet plate 15 into a predetermined shape as shown in FIG. .

ここで18は切り離しを容易にする孔である。Here, 18 is a hole that facilitates separation.

一方、プリント基板20は、第7図に示すように、ラグ
端子の対向する脚部14を挿通する略長方形のスルーホ
ール21及びこのスルーホール21の周辺部分に延在す
る導電ランド22を形成している。
On the other hand, as shown in FIG. 7, the printed circuit board 20 has a substantially rectangular through hole 21 through which the opposing legs 14 of the lug terminals are inserted, and a conductive land 22 extending around the through hole 21. ing.

スルーホール21の寸法はラグ端子10の基部12の寸
法より小さく形成することによりラグ端子10のプリン
ト基板への挿着の容易化が計られる。
By forming the size of the through hole 21 smaller than the size of the base 12 of the lug terminal 10, the lug terminal 10 can be easily inserted into the printed circuit board.

また、対向する脚部14の弾性と折曲する先端13との
利用によりラグ端子10は半田固着されるまでの間プリ
ント基板20上で仮係止され得る。
Further, by utilizing the elasticity of the opposing leg portions 14 and the bent tip 13, the lug terminal 10 can be temporarily secured on the printed circuit board 20 until it is fixed by soldering.

従って、半田浸漬法による半田付けが確実に達成できる
Therefore, soldering by the solder dipping method can be reliably achieved.

本考案の重要な特徴は、プリント基板20とラグ端子1
0とが半田25により互に電気機械的に結合されるが、
この際、第8図に示すように、スルーホール21内への
半田槽28からの侵入半田が残されず且つラグ端子10
の基部の透孔11が半田浸漬処理で全く関係ない位置に
あることにより、半田埋まりが確実に阻止できる。
The important features of the present invention are that the printed circuit board 20 and the lug terminals 1
0 are electromechanically coupled to each other by solder 25,
At this time, as shown in FIG.
By locating the through hole 11 at the base at a position completely unrelated to the solder dipping process, solder filling can be reliably prevented.

従って、第4図に示すリード支柱32はスルーホール2
1を通してラグ端子10の透孔11に確実に挿通できる
こととなる。
Therefore, the lead support 32 shown in FIG.
1 and into the through hole 11 of the lug terminal 10.

ここで、半田埋まりの防止はプリント基板20のスルー
ホール21が比較的大きく形成できることもその要因と
なっている。
Here, the prevention of solder filling is also caused by the fact that the through holes 21 of the printed circuit board 20 can be formed relatively large.

そして、プリント基板20の導電ランド22をスルーホ
ール21の周辺部分のうちラグ端子10の脚部先端13
が位置する部分にのみ延在させることはスルーホールを
横切って形成される半田ブリッヂの防止にもなり、特に
好ましい構造である。
Then, the conductive land 22 of the printed circuit board 20 is connected to the leg tip 13 of the lug terminal 10 in the peripheral portion of the through hole 21.
Extending only the portion where the through hole is located also prevents a solder bridge from being formed across the through hole, and is a particularly preferred structure.

第4図の複数基板の取付構造においては、プリント基板
20のサブアッセンブルによりラグ端子10が半田25
で固着され、次いで別の基板30に固定したリード支柱
32がラグ端子10の基部に半田35で固着される。
In the mounting structure of multiple circuit boards shown in FIG.
Then, a lead support 32 fixed to another board 30 is fixed to the base of the lug terminal 10 with solder 35.

従って異なる基板間の電気的機械的結合が遠戚できる。Therefore, electrical and mechanical coupling between different substrates can be distantly related.

特に、本考案に係る構造では各基板の修理、交換におい
ての分解時にその離脱も比較的容易であるという利点も
ある。
In particular, the structure according to the present invention has the advantage that it is relatively easy to remove each board when it is disassembled for repair or replacement.

更に、本考案による構造は半田工数を大巾に低減すると
共に品質向上がなされ、加えて、ラグ端子の量産自動化
を容易にすることによりコスト低減を計る等その実用的
効果が大きい。
Furthermore, the structure according to the present invention greatly reduces the number of soldering steps and improves quality.In addition, it has great practical effects, such as reducing costs by facilitating the automation of mass production of lug terminals.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のはとめ端子付プリント基板の部分的断面
図、第2図は第1図のプリント基板の半田付は前の状態
における部分拡大背面図、第3図は第1図のプリント基
板の半田処理状態を示す断面図、第4図は本考案に係る
ラグ端子付プリント基板の部分的断面図、第5図は第4
図のラグ端子の拡大図、第6図は第5図のラグ端子を作
る金属シート板打抜体の平面図、第7図は第4図のプリ
ント基板の半田処理前の状態を示す部分拡大背面図、お
よび第8図は第4図のプリント基板の半田処理状態を示
す断面図である。 10・・・・・・ラグ端子、11・・・・・・透孔、1
2・・・・・・基部、13・・・・・・脚部先端、14
・・・・・・脚部、15・・・・・・金属シート板、1
6・・・・・・打抜片、20・・・・・・プリント基板
、21・・・・・・スルーホール、22・・・・・・導
電ランド、25・・・・・・半田、30・・・・・・(
第2の)基板、32・・・・・・リード支柱、35・・
・・・・半田。
Figure 1 is a partial cross-sectional view of a conventional printed circuit board with grommet terminals, Figure 2 is a partially enlarged rear view of the printed circuit board shown in Figure 1 before soldering, and Figure 3 is a printed circuit board of Figure 1. 4 is a partial sectional view of the printed circuit board with lug terminals according to the present invention, and FIG.
Figure 6 is an enlarged view of the lug terminal in Figure 5. Figure 6 is a plan view of the punched metal sheet that makes the lug terminal in Figure 5. Figure 7 is an enlarged view of the printed circuit board in Figure 4 before soldering. The rear view and FIG. 8 are cross-sectional views showing the soldering state of the printed circuit board of FIG. 4. 10...Lug terminal, 11...Through hole, 1
2... Base, 13... Leg tip, 14
... Legs, 15 ... Metal sheet plate, 1
6... Punching piece, 20... Printed circuit board, 21... Through hole, 22... Conductive land, 25... Solder, 30・・・・・・(
2nd) board, 32... Lead support, 35...
····solder.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)中央に透孔を形成した基部に先端を折曲した脚部
を対向して設けた金属板ラグ端子、およびこの対向する
脚部の挿通用スルーホールと各脚部先端側位置に対応し
た導電ランドとを形成したプリント基板とから構成され
、前記基部は前記スルーホールより大きく形成されると
共に前記脚部は前記プリント基板の導電ランドに半田付
けしたことを特徴とするラグ端子付プリント基板。
(1) A metal plate lug terminal with a base with a through hole in the center and legs with bent ends facing each other, and corresponding to the insertion through hole of the opposing legs and the position on the tip side of each leg. A printed circuit board with lug terminals, the base portion being formed larger than the through hole, and the leg portions being soldered to the conductive lands of the printed circuit board. .
(2)前記導電ランドは前記ラグ端子の脚部が位置する
前記スルーホールの周辺部分にのみ延在させた実用新案
登録請求の範囲第1項に記載のラグ端子付プリント基板
(2) The printed circuit board with a lug terminal according to claim 1, wherein the conductive land extends only to a peripheral portion of the through hole where the leg portion of the lug terminal is located.
(3)前記ラグ端子は金属シート板に連結する状態で所
定形状にプレス成形された打抜片を切り離して前記脚部
を折曲形成して前記プリント基板のスルーホールに挿着
した実用新案登録請求の範囲第1項又は第2項に記載の
ラグ端子付プリント基板。
(3) The lug terminal is registered as a utility model in which a punched piece press-formed into a predetermined shape is cut off while connected to a metal sheet plate, the leg portions are bent and inserted into the through holes of the printed circuit board. A printed circuit board with lug terminals according to claim 1 or 2.
(4)前記ラグ端子はその基部透孔に別の基板に取付固
定されたリード支柱が挿通され電気機械的に接続された
実用新案登録請求の範囲第1項乃至第3項のいずれかに
記載のラグ端子付プリント基板。
(4) The lug terminal is electrically and mechanically connected to each other by inserting a lead post attached and fixed to another board into the through-hole at the base of the lug terminal, as claimed in any one of claims 1 to 3. Printed circuit board with lug terminals.
JP1977116766U 1977-08-30 1977-08-30 Printed circuit board with lug terminals Expired JPS5810391Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977116766U JPS5810391Y2 (en) 1977-08-30 1977-08-30 Printed circuit board with lug terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977116766U JPS5810391Y2 (en) 1977-08-30 1977-08-30 Printed circuit board with lug terminals

Publications (2)

Publication Number Publication Date
JPS5441954U JPS5441954U (en) 1979-03-20
JPS5810391Y2 true JPS5810391Y2 (en) 1983-02-25

Family

ID=29069600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977116766U Expired JPS5810391Y2 (en) 1977-08-30 1977-08-30 Printed circuit board with lug terminals

Country Status (1)

Country Link
JP (1) JPS5810391Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57142815A (en) * 1981-02-18 1982-09-03 Ckd Corp Method and device for automitically connecting film
JPS5860597A (en) * 1981-10-06 1983-04-11 株式会社フジクラ Method of producing porcelain board

Also Published As

Publication number Publication date
JPS5441954U (en) 1979-03-20

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