JP2541488B2 - Printed circuit board mounting method - Google Patents

Printed circuit board mounting method

Info

Publication number
JP2541488B2
JP2541488B2 JP5297907A JP29790793A JP2541488B2 JP 2541488 B2 JP2541488 B2 JP 2541488B2 JP 5297907 A JP5297907 A JP 5297907A JP 29790793 A JP29790793 A JP 29790793A JP 2541488 B2 JP2541488 B2 JP 2541488B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
mounting method
mounting
board mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5297907A
Other languages
Japanese (ja)
Other versions
JPH07154050A (en
Inventor
昌宣 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5297907A priority Critical patent/JP2541488B2/en
Publication of JPH07154050A publication Critical patent/JPH07154050A/en
Application granted granted Critical
Publication of JP2541488B2 publication Critical patent/JP2541488B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はプリント基板実装方式に
関する。BACKGROUND OF THE INVENTION The present invention relates to a printed circuit board mounting system.

【０００２】[0002]

【従来の技術】従来、プリント基板に半田付け実装する
場合は、図３に示す如く、プリント基板２の取り付け穴
およびスルーホールを利用し、電子部品１０，１１のリ
ード線を挿入した後、半田付け接続を行っていた。（例
えば、実開昭６２−１４５３０１号公報，実開昭６２−
１５８８６２号公報参照）2. Description of the Related Art Conventionally, when mounting on a printed circuit board by soldering, as shown in FIG. 3, the mounting holes and through holes of the printed circuit board 2 are used to insert the lead wires of the electronic parts 10 and 11 and then solder. I was making a connection. (For example, Japanese Utility Model Publication No. 62-145301, Japanese Utility Model Publication No. 62-
(See Japanese Patent No. 158862)

【発明が解決しようとする課題】上述したプリント基板
実装方式は、通常プリント基板の１つの取り付け穴に
は、１本のリードせを挿入し半田付けするため、例え
ば、プリント基板に２本以上のリード線を挿入取り付け
する場合には、２個以上の取り付け穴と部品スペースを
用意する必要があり、実装する部品に比例してプリント
基板のサイズが大きくなる欠点があった。In the printed circuit board mounting method described above, one lead is usually inserted into one mounting hole of the printed circuit board and soldered. Therefore, for example, two or more printed circuit boards are mounted on the printed circuit board. When inserting and mounting the lead wire, it is necessary to prepare two or more mounting holes and a component space, and there is a drawback that the size of the printed circuit board increases in proportion to the mounted component.

【０００３】[0003]

【課題を解決するための手段】本発明のプリント基板実
装方式は、絶縁体の両面に配線パターンを有したプリン
ト基板の取り付け穴に、両端に電極を備えこの電極の片
端にリード線挿入穴を有する電子部品を挿入し、前記両
電極の各々と前記プリント基板の配線パターンの各々と
を半田付け接続する。According to the printed circuit board mounting method of the present invention, electrodes are provided at both ends of a mounting hole of a printed circuit board having wiring patterns on both sides of an insulator, and a lead wire insertion hole is provided at one end of the electrode. The electronic component is inserted and each of the electrodes and each of the wiring patterns of the printed circuit board are connected by soldering.

【０００４】[0004]

【実施例】次に、本発明について図面を参照して詳細に
説明する。The present invention will be described in detail with reference to the drawings.

【０００５】図１は本発明の一実施例を示す断面図、図
２は図１の等価回路図である。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is an equivalent circuit diagram of FIG.

【０００６】図１において、絶縁体１の両面に配線パタ
ーン１２ａおよび１２ｂを有したプリント基板２に取付
け穴３が、配線パターンに対し、垂直方向に貫通した状
態で備えてある。この取り付け穴３に挿入実装される部
品４は、両端に電極２１，２２を有している。この両端
電極の片端には、リード付部品１０のリード線１０１を
挿入するための挿入穴５が備えてあり、リード線１０１
と挿入穴５に挿入されており、リード線１０１と穴付電
極２１は、半田付けにより固着されている。In FIG. 1, a printed circuit board 2 having wiring patterns 12a and 12b on both sides of an insulator 1 is provided with a mounting hole 3 in a state of vertically penetrating the wiring pattern. The component 4 inserted and mounted in the mounting hole 3 has electrodes 21 and 22 at both ends. An insertion hole 5 for inserting the lead wire 101 of the leaded component 10 is provided at one end of the both-end electrode.
The lead wire 101 and the holed electrode 21 are fixed by soldering.

【０００７】プリント基板２の配線パターン１２ａに
は、穴付電極２１とこの穴付電極２１の挿入穴５に挿入
したリード付部品１０１が挿入され、同時に半田付け接
続されている。一方、配線パターン１２ｂは、部品４の
他の電極２２と半田付け接続されている。In the wiring pattern 12a of the printed circuit board 2, the electrode with hole 21 and the component with lead 101 inserted into the insertion hole 5 of the electrode with hole 21 are inserted, and simultaneously soldered and connected. On the other hand, the wiring pattern 12b is soldered to the other electrode 22 of the component 4.

【０００８】本発明によれば、同一取り付け穴を利用で
きるため取り付けスペースが不要となり、高密度実装を
可能とする。According to the present invention, since the same mounting hole can be used, a mounting space is not required, and high density mounting is possible.

【０００９】[0009]

【発明の効果】本発明のプリント基板実装方式は、プリ
ント基板穴を利用した穴付電極と挿入穴を有した部品を
挿入実装することにより、プリント基板穴に複数の部品
の使用が可能となり、実装密度が向上するという効果が
ある。According to the printed circuit board mounting method of the present invention, a plurality of parts can be used in the printed circuit board hole by inserting and mounting a component having a holed electrode utilizing the printed circuit board hole and the insertion hole. This has the effect of improving the packaging density.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図２】図１の等価回路図である。FIG. 2 is an equivalent circuit diagram of FIG.

【図３】従来の一例を示す断面図である。FIG. 3 is a cross-sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

１ 絶縁体 ２ プリント基板 ３ 取り付け穴 ４ 部品 ５ 挿入穴 ６ 半田付け １０，１１ リード付部品 １２ａ，１２ｂ 配線パターン ２１ 穴付電極 ２２ 電極 １０１ リード線 1 Insulator 2 Printed Circuit Board 3 Mounting Hole 4 Component 5 Insertion Hole 6 Soldering 10, 11 Leaded Parts 12a, 12b Wiring Pattern 21 Holeed Electrode 22 Electrode 101 Lead Wire

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 絶縁体の両面に配線パターンを有したプ
リント基板の取り付け穴に、両端に電極を備えこの電極
の片端にリード線挿入穴を有する電子部品を挿入し、前
記両電極の各々と前記プリント基板の配線パターンの各
々とを半田付け接続したことを特徴とするプリント基板
実装方式。1. An electronic component having electrodes at both ends and a lead wire insertion hole at one end of the electrode is inserted into a mounting hole of a printed circuit board having wiring patterns on both sides of an insulator, and each of the electrodes is connected to the both electrodes. A printed circuit board mounting method, wherein each of the wiring patterns of the printed circuit board is connected by soldering. 【請求項２】 前記電子部品としてコンデンサを用いる
請求項１記載のプリント基板実装方式。2. The printed circuit board mounting method according to claim 1, wherein a capacitor is used as the electronic component.
JP5297907A 1993-11-29 1993-11-29 Printed circuit board mounting method Expired - Fee Related JP2541488B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5297907A JP2541488B2 (en) 1993-11-29 1993-11-29 Printed circuit board mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5297907A JP2541488B2 (en) 1993-11-29 1993-11-29 Printed circuit board mounting method

Publications (2)

Publication Number Publication Date
JPH07154050A JPH07154050A (en) 1995-06-16
JP2541488B2 true JP2541488B2 (en) 1996-10-09

Family

ID=17852644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5297907A Expired - Fee Related JP2541488B2 (en) 1993-11-29 1993-11-29 Printed circuit board mounting method

Country Status (1)

Country Link
JP (1) JP2541488B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120624A (en) * 1973-03-20 1974-11-18
JPS56104147A (en) * 1980-12-27 1981-08-19 Iseki & Co Ltd Waterproof device for air cleaner of agricultural tractor or the like

Also Published As

Publication number Publication date
JPH07154050A (en) 1995-06-16

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