JPS5796538A - Processing method for component parts of semiconductor device - Google Patents
Processing method for component parts of semiconductor deviceInfo
- Publication number
- JPS5796538A JPS5796538A JP17208480A JP17208480A JPS5796538A JP S5796538 A JPS5796538 A JP S5796538A JP 17208480 A JP17208480 A JP 17208480A JP 17208480 A JP17208480 A JP 17208480A JP S5796538 A JPS5796538 A JP S5796538A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- processing surface
- processing
- apertures
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000008188 pellet Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To make it possible to stick closely and locate a member fast to a processing surface by providing apertures through the processing surface plate making respective parts of a pellet mounting part, etc., of a lead frame coincide with said apertures and by attracting a member by means of vacuum being applied through a vacuum port (the attraction may be performed by employing a magnet). CONSTITUTION:When a lead frame 1 is advanced on the surface of a processing surface plate 2 as indicated by an arrow, and one part of said frame is located at a processing head and said lead frame 1 is suctioned to the processing surface, apertures 2a, 2b are provide through the processing surface plate by letting respective one parts of a pellet mounting part, a leading part, a tie bar part and the like of the lead frame coincide with said apertures. With the situation, the member is sucked to the processing surface due to negative pressure at a reducing inlet 3. With the completion of the processing, the negative pressure is removed for having the number to itself before the lead frame is fed to allow the next processing to be performed. In case the lead frame is attracted and fixed to the processing surface, the situation is performed by making a permanent magnet and the like to approach to the processing surface plate. Further, for release, the lead frame is to be made isolated, and is forwarded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17208480A JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17208480A JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5796538A true JPS5796538A (en) | 1982-06-15 |
JPH0231498B2 JPH0231498B2 (en) | 1990-07-13 |
Family
ID=15935234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17208480A Granted JPS5796538A (en) | 1980-12-08 | 1980-12-08 | Processing method for component parts of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5796538A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009267312A (en) * | 2008-04-30 | 2009-11-12 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227271A (en) * | 1975-08-25 | 1977-03-01 | Nec Corp | Dye bonding device |
JPS5545214U (en) * | 1978-09-14 | 1980-03-25 | ||
JPS56132747U (en) * | 1980-03-05 | 1981-10-08 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT334253B (en) * | 1973-04-03 | 1976-01-10 | Yoshida Nederland Bv | DEVICE FOR DISPLAYING AND SELLING ITEMS, SUCH AS ZIPS AND OTHER SMALL ITEMS |
-
1980
- 1980-12-08 JP JP17208480A patent/JPS5796538A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227271A (en) * | 1975-08-25 | 1977-03-01 | Nec Corp | Dye bonding device |
JPS5545214U (en) * | 1978-09-14 | 1980-03-25 | ||
JPS56132747U (en) * | 1980-03-05 | 1981-10-08 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009267312A (en) * | 2008-04-30 | 2009-11-12 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0231498B2 (en) | 1990-07-13 |
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