JPS5796538A - Processing method for component parts of semiconductor device - Google Patents

Processing method for component parts of semiconductor device

Info

Publication number
JPS5796538A
JPS5796538A JP17208480A JP17208480A JPS5796538A JP S5796538 A JPS5796538 A JP S5796538A JP 17208480 A JP17208480 A JP 17208480A JP 17208480 A JP17208480 A JP 17208480A JP S5796538 A JPS5796538 A JP S5796538A
Authority
JP
Japan
Prior art keywords
lead frame
processing surface
processing
apertures
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17208480A
Other languages
Japanese (ja)
Other versions
JPH0231498B2 (en
Inventor
Shigeru Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17208480A priority Critical patent/JPS5796538A/en
Publication of JPS5796538A publication Critical patent/JPS5796538A/en
Publication of JPH0231498B2 publication Critical patent/JPH0231498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To make it possible to stick closely and locate a member fast to a processing surface by providing apertures through the processing surface plate making respective parts of a pellet mounting part, etc., of a lead frame coincide with said apertures and by attracting a member by means of vacuum being applied through a vacuum port (the attraction may be performed by employing a magnet). CONSTITUTION:When a lead frame 1 is advanced on the surface of a processing surface plate 2 as indicated by an arrow, and one part of said frame is located at a processing head and said lead frame 1 is suctioned to the processing surface, apertures 2a, 2b are provide through the processing surface plate by letting respective one parts of a pellet mounting part, a leading part, a tie bar part and the like of the lead frame coincide with said apertures. With the situation, the member is sucked to the processing surface due to negative pressure at a reducing inlet 3. With the completion of the processing, the negative pressure is removed for having the number to itself before the lead frame is fed to allow the next processing to be performed. In case the lead frame is attracted and fixed to the processing surface, the situation is performed by making a permanent magnet and the like to approach to the processing surface plate. Further, for release, the lead frame is to be made isolated, and is forwarded.
JP17208480A 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device Granted JPS5796538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17208480A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17208480A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796538A true JPS5796538A (en) 1982-06-15
JPH0231498B2 JPH0231498B2 (en) 1990-07-13

Family

ID=15935234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17208480A Granted JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796538A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (en) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp Method of manufacturing semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (en) * 1978-09-14 1980-03-25
JPS56132747U (en) * 1980-03-05 1981-10-08

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT334253B (en) * 1973-04-03 1976-01-10 Yoshida Nederland Bv DEVICE FOR DISPLAYING AND SELLING ITEMS, SUCH AS ZIPS AND OTHER SMALL ITEMS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (en) * 1978-09-14 1980-03-25
JPS56132747U (en) * 1980-03-05 1981-10-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (en) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPH0231498B2 (en) 1990-07-13

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