JPS5793533A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5793533A JPS5793533A JP17042180A JP17042180A JPS5793533A JP S5793533 A JPS5793533 A JP S5793533A JP 17042180 A JP17042180 A JP 17042180A JP 17042180 A JP17042180 A JP 17042180A JP S5793533 A JPS5793533 A JP S5793533A
- Authority
- JP
- Japan
- Prior art keywords
- burr
- lead
- resin
- block
- root
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 238000005507 spraying Methods 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To simply remove a resin burr projected at the root of a lead led externally from a resin block by spraying high temperature steam to the burr. CONSTITUTION:A resin burr 4 is produced at the root of each lead 3 of a lead frame 2 projected from the side face of a sealing resin block 1, and high temperature steam being higher than 190 deg.C is sprayed from a nozzle 5 toward the burr 4, thereby embrittling and spraying out the burr 4. In this manner, the burr can be readily removed without damaging the lead 3 and the block 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17042180A JPS5793533A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17042180A JPS5793533A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5793533A true JPS5793533A (en) | 1982-06-10 |
Family
ID=15904604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17042180A Pending JPS5793533A (en) | 1980-12-03 | 1980-12-03 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5793533A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017168508A (en) * | 2016-03-14 | 2017-09-21 | 富士電機株式会社 | Removal method and manufacturing method |
-
1980
- 1980-12-03 JP JP17042180A patent/JPS5793533A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017168508A (en) * | 2016-03-14 | 2017-09-21 | 富士電機株式会社 | Removal method and manufacturing method |
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