JPS5785991A - Resin composition for plating - Google Patents
Resin composition for platingInfo
- Publication number
- JPS5785991A JPS5785991A JP16089980A JP16089980A JPS5785991A JP S5785991 A JPS5785991 A JP S5785991A JP 16089980 A JP16089980 A JP 16089980A JP 16089980 A JP16089980 A JP 16089980A JP S5785991 A JPS5785991 A JP S5785991A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- resin composition
- carbon black
- metallic
- sulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To provide a resin composition for plating which permits application of electroplating directly without application of chemical plating by compounding respectively prescribed weight ratios of carbon black, sulfur, and metallic powder or metallic sulfide with a thermoplastic resin.
CONSTITUTION: A resin composition for plating consisting of compunding 15W 50pts.wt. carbon black, 0.05W5pts.wt. sulfur and 1W15pts.wt. metallic powder of iron or the like or metallic sulfide such as zinc sulfide or the like with 100pts.wt. a thermoplastic resin (e.g.; PE). For example, acetylene black is used for the carbon black. This resin composition eliminates electroless plating (chemical plating) processes completely, and permits direct electroplating. When strike nickel plating is applied on the moldings molded of such composition, the moldings exhibit ≥2.0kg/cm plating adhesive strength within 5min/dm2 throwing power time and have a good plating appearance free from pinholes and the like.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16089980A JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16089980A JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5785991A true JPS5785991A (en) | 1982-05-28 |
JPS6113497B2 JPS6113497B2 (en) | 1986-04-14 |
Family
ID=15724753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16089980A Granted JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5785991A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
-
1980
- 1980-11-17 JP JP16089980A patent/JPS5785991A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
Also Published As
Publication number | Publication date |
---|---|
JPS6113497B2 (en) | 1986-04-14 |
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