JPS5785870A - Hot-melt polymer composition - Google Patents
Hot-melt polymer compositionInfo
- Publication number
- JPS5785870A JPS5785870A JP16142980A JP16142980A JPS5785870A JP S5785870 A JPS5785870 A JP S5785870A JP 16142980 A JP16142980 A JP 16142980A JP 16142980 A JP16142980 A JP 16142980A JP S5785870 A JPS5785870 A JP S5785870A
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- added
- polymer compsn
- mixture
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To provide the titled polymer compsn. having excellent compatibility, elasticity, heat resistance etc. and suitable for adhesives, etc., by subjecting a monomer composed mainly of styrene in the presence of an ethylene-vinyl acetate copolymer and a butyl rubber to a radical polymn.
CONSTITUTION: An ethylene-vinyl acetate copolymer, a butyl rubber or a mixture thereof, to which is added, if necessary, an ethylene-α-olefin copolymer rubber, is mixed with a monomer composed mainly of styrene or acrylic acid. Then to the resulting mixture is added a free-radical initiator such as benzoyl peroxide or dicumyl peroxide and the mixture is melt-mixed with heating to effect a polymn. reaction to produce a polymer compsn. having a complicated structure where intermolecular bonds are present between polymers. If necessary, a tackifying resin, a softening agent, a wax, etc. are added to the polymer compsn. to produce a hot melt adhesive or a sealant.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16142980A JPS5785870A (en) | 1980-11-18 | 1980-11-18 | Hot-melt polymer composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16142980A JPS5785870A (en) | 1980-11-18 | 1980-11-18 | Hot-melt polymer composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5785870A true JPS5785870A (en) | 1982-05-28 |
Family
ID=15734933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16142980A Pending JPS5785870A (en) | 1980-11-18 | 1980-11-18 | Hot-melt polymer composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5785870A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5468683A (en) * | 1992-09-25 | 1995-11-21 | U.S. Philips Corporation | Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces |
| WO2002034859A1 (en) * | 2000-10-20 | 2002-05-02 | 3M Innovative Properties Company | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
| JP2002180032A (en) * | 2000-12-18 | 2002-06-26 | Nhk Spring Co Ltd | Method for sealing electronic component |
| US6613381B1 (en) | 2000-10-20 | 2003-09-02 | 3M Innovative Properties Company | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
-
1980
- 1980-11-18 JP JP16142980A patent/JPS5785870A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5468683A (en) * | 1992-09-25 | 1995-11-21 | U.S. Philips Corporation | Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces |
| WO2002034859A1 (en) * | 2000-10-20 | 2002-05-02 | 3M Innovative Properties Company | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
| US6613381B1 (en) | 2000-10-20 | 2003-09-02 | 3M Innovative Properties Company | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
| JP2004512421A (en) * | 2000-10-20 | 2004-04-22 | スリーエム イノベイティブ プロパティズ カンパニー | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
| JP2002180032A (en) * | 2000-12-18 | 2002-06-26 | Nhk Spring Co Ltd | Method for sealing electronic component |
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