JPS5783535A - Preparation of laminate - Google Patents

Preparation of laminate

Info

Publication number
JPS5783535A
JPS5783535A JP15975380A JP15975380A JPS5783535A JP S5783535 A JPS5783535 A JP S5783535A JP 15975380 A JP15975380 A JP 15975380A JP 15975380 A JP15975380 A JP 15975380A JP S5783535 A JPS5783535 A JP S5783535A
Authority
JP
Japan
Prior art keywords
epoxy resin
resultant
base material
amount
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15975380A
Other languages
Japanese (ja)
Other versions
JPS6039288B2 (en
Inventor
Shuichi Matsuura
Yasuo Miyadera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP15975380A priority Critical patent/JPS6039288B2/en
Publication of JPS5783535A publication Critical patent/JPS5783535A/en
Publication of JPS6039288B2 publication Critical patent/JPS6039288B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: To obtain a laminate useful for a copper-clad laminate used as a printed wiring without using a solvent, by impregnating or coating a base material material with a solventless varnish composition consisting of a polyhydric alcohol, epoxy resin, curing agent, etc., and heating and pressing the resultant impregnated or coated material.
CONSTITUTION: An epoxy resin containing two or more epoxy groups in one molecule and a polyhydric phenol having two or more phenolic hydroxyl groups in one molecule are dissolved at a temperature of insufficient reaction under heating, and a curing agent in an amount corresponding to the difference in equivalents of the epoxy resin and the polyhydric phenol, a catalyst for the etherifying reaction of the phenolic hydroxyl groups with the epoxy groups in an amount of 0.001W1wt% based on the epoxy resin and a curing accelerator preferably in an amount of 0.01W5wt% based on the total amount of the epoxy resin and the polyhydric phenol are dissolved in the resultant solution under heating to form a solventless varnish composition. A base material is then impregnated with the resultant varnish composition and heated to give a preperg of the stage B. Plural sheets of the resultant prepregs are then placed on top of each other and hot-pressed, or the composition is applied to the base material and hot- pressed to give the aimed laminate.
COPYRIGHT: (C)1982,JPO&Japio
JP15975380A 1980-11-12 1980-11-12 Method of manufacturing laminates Expired JPS6039288B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15975380A JPS6039288B2 (en) 1980-11-12 1980-11-12 Method of manufacturing laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15975380A JPS6039288B2 (en) 1980-11-12 1980-11-12 Method of manufacturing laminates

Publications (2)

Publication Number Publication Date
JPS5783535A true JPS5783535A (en) 1982-05-25
JPS6039288B2 JPS6039288B2 (en) 1985-09-05

Family

ID=15700502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15975380A Expired JPS6039288B2 (en) 1980-11-12 1980-11-12 Method of manufacturing laminates

Country Status (1)

Country Link
JP (1) JPS6039288B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501212A (en) * 1984-07-17 1986-06-19 ザ　ダウ　ケミカル　カンパニ− Manufacturing method of partially advanced epoxy resin
WO1992017532A1 (en) * 1991-03-28 1992-10-15 Hüls Troisdorf Aktiengesellschaft Process for manufacturing prepregs containing solvent-free epoxy resin
JPH1036639A (en) * 1996-07-29 1998-02-10 Matsushita Electric Works Ltd Epoxy resin composition for laminate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501212A (en) * 1984-07-17 1986-06-19 ザ　ダウ　ケミカル　カンパニ− Manufacturing method of partially advanced epoxy resin
JPS632967B2 (en) * 1984-07-17 1988-01-21 Dow Chemical Co
WO1992017532A1 (en) * 1991-03-28 1992-10-15 Hüls Troisdorf Aktiengesellschaft Process for manufacturing prepregs containing solvent-free epoxy resin
JPH1036639A (en) * 1996-07-29 1998-02-10 Matsushita Electric Works Ltd Epoxy resin composition for laminate

Also Published As

Publication number Publication date
JPS6039288B2 (en) 1985-09-05

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