JPS5772357A - Mounting method of integrated circuit - Google Patents

Mounting method of integrated circuit

Info

Publication number
JPS5772357A
JPS5772357A JP14977780A JP14977780A JPS5772357A JP S5772357 A JPS5772357 A JP S5772357A JP 14977780 A JP14977780 A JP 14977780A JP 14977780 A JP14977780 A JP 14977780A JP S5772357 A JPS5772357 A JP S5772357A
Authority
JP
Japan
Prior art keywords
integrated circuit
thermal
radiating part
thermal radiating
baseplate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14977780A
Other languages
Japanese (ja)
Other versions
JPS6143857B2 (en
Inventor
Koichi Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14977780A priority Critical patent/JPS5772357A/en
Publication of JPS5772357A publication Critical patent/JPS5772357A/en
Publication of JPS6143857B2 publication Critical patent/JPS6143857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To make it needless to cut and form lead wires by a method wherein a thermal radiating part is built in the face of an integrated circuit, this thermal radiating part is connected to the integrated circuit with a good thermal conductor, and the distance between a multilayer wiring baseplate and a thermal radiating plate is kept constant. CONSTITUTION:Lead wires 6 of an integrated circuit 5 are positioned on corresponding conductor parts 2 of a multilayer wiring baseplate 1, being connected in thermal pressure. Next, a thermal radiating part 4 is positioned in the face of the integrated circuit 5. After that, the thermal radiating part 4 is connected to the integrated circuit 5 by soldering or another technique, and a radiator 7 is installed if needed. In this mounting process, mechanical tools 8 are mounted on the sides of both the baseplate and the thermal radiating part so that the distance between those is kept constant.
JP14977780A 1980-10-24 1980-10-24 Mounting method of integrated circuit Granted JPS5772357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14977780A JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14977780A JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Publications (2)

Publication Number Publication Date
JPS5772357A true JPS5772357A (en) 1982-05-06
JPS6143857B2 JPS6143857B2 (en) 1986-09-30

Family

ID=15482490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14977780A Granted JPS5772357A (en) 1980-10-24 1980-10-24 Mounting method of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5772357A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103068A2 (en) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Cooling device for a plurality of integrated components assembled as a flat structure
JPS628964A (en) * 1985-07-05 1987-01-16 Minolta Camera Co Ltd Copy machine
JPH0240941A (en) * 1988-07-13 1990-02-09 Internatl Business Mach Corp <Ibm> Electronic package
DE4210835C1 (en) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
FR2781924A1 (en) * 1998-07-30 2000-02-04 St Microelectronics Sa Procedure for assembly of integrated circuits including a stage of soldering under mechanical pressure with initial spacing of components determined by the diameter of balls of solder

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4881767U (en) * 1971-12-29 1973-10-05
JPS48101085A (en) * 1972-03-31 1973-12-20
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4881767U (en) * 1971-12-29 1973-10-05
JPS48101085A (en) * 1972-03-31 1973-12-20
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103068A2 (en) * 1982-09-09 1984-03-21 Siemens Aktiengesellschaft Cooling device for a plurality of integrated components assembled as a flat structure
JPS628964A (en) * 1985-07-05 1987-01-16 Minolta Camera Co Ltd Copy machine
JPH0240941A (en) * 1988-07-13 1990-02-09 Internatl Business Mach Corp <Ibm> Electronic package
JPH0712069B2 (en) * 1988-07-13 1995-02-08 インターナショナル・ビジネス・マシーンズ・コーポレーション Electronic component package
DE4210835C1 (en) * 1992-04-01 1993-06-17 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De
FR2781924A1 (en) * 1998-07-30 2000-02-04 St Microelectronics Sa Procedure for assembly of integrated circuits including a stage of soldering under mechanical pressure with initial spacing of components determined by the diameter of balls of solder
US6247637B1 (en) 1998-07-30 2001-06-19 Stmicroelectronics S.A. Method of integrated circuit assembly
US7410091B2 (en) 1998-07-30 2008-08-12 Stmicroelectronics S.A. Method of integrated circuit assembly

Also Published As

Publication number Publication date
JPS6143857B2 (en) 1986-09-30

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