JPS5764993A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS5764993A JPS5764993A JP55140445A JP14044580A JPS5764993A JP S5764993 A JPS5764993 A JP S5764993A JP 55140445 A JP55140445 A JP 55140445A JP 14044580 A JP14044580 A JP 14044580A JP S5764993 A JPS5764993 A JP S5764993A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1407—Applying catalyst before applying plating resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55140445A JPS5830760B2 (ja) | 1980-10-09 | 1980-10-09 | プリント回路板の製法 |
DE3140082A DE3140082C2 (de) | 1980-10-09 | 1981-10-08 | Verfahren zur Herstellung gedruckter Schaltungen |
US06/485,399 US4457952A (en) | 1980-10-09 | 1983-04-15 | Process for producing printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55140445A JPS5830760B2 (ja) | 1980-10-09 | 1980-10-09 | プリント回路板の製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5764993A true JPS5764993A (en) | 1982-04-20 |
JPS5830760B2 JPS5830760B2 (ja) | 1983-07-01 |
Family
ID=15268792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55140445A Expired JPS5830760B2 (ja) | 1980-10-09 | 1980-10-09 | プリント回路板の製法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4457952A (ja) |
JP (1) | JPS5830760B2 (ja) |
DE (1) | DE3140082C2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58180087A (ja) * | 1982-12-27 | 1983-10-21 | 株式会社日立製作所 | プリント回路板 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61118552A (ja) * | 1984-11-13 | 1986-06-05 | Sanshin Ind Co Ltd | 船外機の燃料噴射システム |
JPH0710967B2 (ja) * | 1985-02-04 | 1995-02-08 | 日立化成工業株式会社 | 印刷配線板基板用接着剤 |
US4752499A (en) * | 1985-05-16 | 1988-06-21 | Ibiden Co. Ltd. | Adhesive for electroless plating and method of preparation of circuit board using this adhesive |
CA1283411C (en) * | 1985-09-25 | 1991-04-23 | Masami Doteuchi | 9-(substituted thio)-4h-pyrido[1,2-a]-pyrimidin-4-one derivatives |
US4804575A (en) * | 1987-01-14 | 1989-02-14 | Kollmorgen Corporation | Multilayer printed wiring boards |
US4927742A (en) * | 1987-01-14 | 1990-05-22 | Kollmorgen Corporation | Multilayer printed wiring boards |
DE3913966B4 (de) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung |
US5419946A (en) * | 1993-09-30 | 1995-05-30 | Hitachi Chemical Co., Ltd. | Adhesive for printed wiring board and production thereof |
DE10254927B4 (de) * | 2002-11-25 | 2012-11-22 | Infineon Technologies Ag | Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger und Verwendung des Verfahrens |
US20090133923A1 (en) * | 2006-03-09 | 2009-05-28 | Bridgestone Corporation | Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter |
US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
CN101845625B (zh) * | 2010-06-01 | 2012-03-21 | 无锡阿尔法电子科技有限公司 | 一种在电容式触摸屏表面进行化学镀金的方法 |
US9398703B2 (en) | 2014-05-19 | 2016-07-19 | Sierra Circuits, Inc. | Via in a printed circuit board |
US10849233B2 (en) | 2017-07-10 | 2020-11-24 | Catlam, Llc | Process for forming traces on a catalytic laminate |
US9706650B1 (en) | 2016-08-18 | 2017-07-11 | Sierra Circuits, Inc. | Catalytic laminate apparatus and method |
US9922951B1 (en) | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
US10349520B2 (en) | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
US10765012B2 (en) | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
US10827624B2 (en) | 2018-03-05 | 2020-11-03 | Catlam, Llc | Catalytic laminate with conductive traces formed during lamination |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53140578A (en) * | 1977-05-14 | 1978-12-07 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3534147A (en) * | 1966-03-07 | 1970-10-13 | Schjeldahl Co G T | Printed wiring means having a flame retardant constituent |
DE1640635A1 (de) * | 1966-07-28 | 1970-12-10 | Kupfer Asbest Co | Verfahren zur Herstellung gedruckter Schaltungen und Basismaterial hierzu |
DE1615961A1 (de) * | 1967-04-12 | 1970-06-25 | Degussa | Verfahren zur Herstellung von gedruckten Schaltungen |
JPS5627594B2 (ja) * | 1975-03-14 | 1981-06-25 | ||
DE2612438C2 (de) * | 1976-03-24 | 1983-04-28 | Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel | Haftvermittlerschicht zur Herstellung von Leiterplatten |
US4151313A (en) * | 1977-03-11 | 1979-04-24 | Hitachi, Ltd. | Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material |
JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
JPS588597B2 (ja) * | 1978-08-07 | 1983-02-16 | 株式会社日立製作所 | プリント回路板の製造方法 |
-
1980
- 1980-10-09 JP JP55140445A patent/JPS5830760B2/ja not_active Expired
-
1981
- 1981-10-08 DE DE3140082A patent/DE3140082C2/de not_active Expired
-
1983
- 1983-04-15 US US06/485,399 patent/US4457952A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53140578A (en) * | 1977-05-14 | 1978-12-07 | Hitachi Chemical Co Ltd | Method of producing printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58180087A (ja) * | 1982-12-27 | 1983-10-21 | 株式会社日立製作所 | プリント回路板 |
Also Published As
Publication number | Publication date |
---|---|
US4457952A (en) | 1984-07-03 |
DE3140082C2 (de) | 1984-02-09 |
JPS5830760B2 (ja) | 1983-07-01 |
DE3140082A1 (de) | 1982-05-13 |
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