JPS53140578A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS53140578A
JPS53140578A JP5578977A JP5578977A JPS53140578A JP S53140578 A JPS53140578 A JP S53140578A JP 5578977 A JP5578977 A JP 5578977A JP 5578977 A JP5578977 A JP 5578977A JP S53140578 A JPS53140578 A JP S53140578A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5578977A
Other languages
Japanese (ja)
Other versions
JPS568516B2 (en
Inventor
Yorio Iwasaki
Toshirou Okamura
Akishi Nakasaki
Nobuo Uozu
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP5578977A priority Critical patent/JPS53140578A/en
Priority to GB19270/78A priority patent/GB1588475A/en
Priority to US05/905,398 priority patent/US4216246A/en
Priority to DE2821303A priority patent/DE2821303B2/en
Publication of JPS53140578A publication Critical patent/JPS53140578A/en
Publication of JPS568516B2 publication Critical patent/JPS568516B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP5578977A 1977-05-14 1977-05-14 Method of producing printed circuit board Granted JPS53140578A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP5578977A JPS53140578A (en) 1977-05-14 1977-05-14 Method of producing printed circuit board
GB19270/78A GB1588475A (en) 1977-05-14 1978-05-12 Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
US05/905,398 US4216246A (en) 1977-05-14 1978-05-12 Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
DE2821303A DE2821303B2 (en) 1977-05-14 1978-05-16 A method of improving the adhesiveness of the surface of an insulating substrate and use of the substrate to manufacture a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5578977A JPS53140578A (en) 1977-05-14 1977-05-14 Method of producing printed circuit board

Publications (2)

Publication Number Publication Date
JPS53140578A true JPS53140578A (en) 1978-12-07
JPS568516B2 JPS568516B2 (en) 1981-02-24

Family

ID=13008667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5578977A Granted JPS53140578A (en) 1977-05-14 1977-05-14 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS53140578A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764993A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Method of producing printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764993A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Method of producing printed circuit board
JPS5830760B2 (en) * 1980-10-09 1983-07-01 株式会社日立製作所 Manufacturing method of printed circuit board

Also Published As

Publication number Publication date
JPS568516B2 (en) 1981-02-24

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