JPS53140578A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS53140578A JPS53140578A JP5578977A JP5578977A JPS53140578A JP S53140578 A JPS53140578 A JP S53140578A JP 5578977 A JP5578977 A JP 5578977A JP 5578977 A JP5578977 A JP 5578977A JP S53140578 A JPS53140578 A JP S53140578A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5578977A JPS53140578A (en) | 1977-05-14 | 1977-05-14 | Method of producing printed circuit board |
GB19270/78A GB1588475A (en) | 1977-05-14 | 1978-05-12 | Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards |
US05/905,398 US4216246A (en) | 1977-05-14 | 1978-05-12 | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards |
DE2821303A DE2821303B2 (en) | 1977-05-14 | 1978-05-16 | A method of improving the adhesiveness of the surface of an insulating substrate and use of the substrate to manufacture a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5578977A JPS53140578A (en) | 1977-05-14 | 1977-05-14 | Method of producing printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53140578A true JPS53140578A (en) | 1978-12-07 |
JPS568516B2 JPS568516B2 (en) | 1981-02-24 |
Family
ID=13008667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5578977A Granted JPS53140578A (en) | 1977-05-14 | 1977-05-14 | Method of producing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53140578A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764993A (en) * | 1980-10-09 | 1982-04-20 | Hitachi Ltd | Method of producing printed circuit board |
-
1977
- 1977-05-14 JP JP5578977A patent/JPS53140578A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764993A (en) * | 1980-10-09 | 1982-04-20 | Hitachi Ltd | Method of producing printed circuit board |
JPS5830760B2 (en) * | 1980-10-09 | 1983-07-01 | 株式会社日立製作所 | Manufacturing method of printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS568516B2 (en) | 1981-02-24 |
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