JPS5760715A - Production for stem of surface accustic wave device - Google Patents

Production for stem of surface accustic wave device

Info

Publication number
JPS5760715A
JPS5760715A JP13453680A JP13453680A JPS5760715A JP S5760715 A JPS5760715 A JP S5760715A JP 13453680 A JP13453680 A JP 13453680A JP 13453680 A JP13453680 A JP 13453680A JP S5760715 A JPS5760715 A JP S5760715A
Authority
JP
Japan
Prior art keywords
glass
stem
shell
sintering
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13453680A
Other languages
Japanese (ja)
Inventor
Shoei Ikemoto
Kotaro Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Components Co Ltd
Original Assignee
Toshiba Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Components Co Ltd filed Critical Toshiba Components Co Ltd
Priority to JP13453680A priority Critical patent/JPS5760715A/en
Publication of JPS5760715A publication Critical patent/JPS5760715A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To produce a stem for surface acoustic wave device efficiently, by sintering a glass onto a stem main body and by causing an earth lead for output and input to adhere to the stem main body. CONSTITUTION:A worked part 3 to which an earth lead 2 for input and output is to be fixed is provided in a shell 1. A glass 6 and a nail lead for wire bonding are provided for a hole 5 for glass sintering. Before sintering the glass, the shell and the lead 2 are subjected to Ni plating in single substances and a silver 4 is fixed to the worked part 3 of the shell 1. Under the state of single substances of parts, the lead 2 is cuased to adhere to the shell 1 simultaneously with sintering of the glass 6 and the stem. As a result, the welding work for the earth lead is disused, and the earth lead is caused to adhere to the shell simultaneously with glass sintering to reduce the labor considerably.
JP13453680A 1980-09-27 1980-09-27 Production for stem of surface accustic wave device Pending JPS5760715A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13453680A JPS5760715A (en) 1980-09-27 1980-09-27 Production for stem of surface accustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13453680A JPS5760715A (en) 1980-09-27 1980-09-27 Production for stem of surface accustic wave device

Publications (1)

Publication Number Publication Date
JPS5760715A true JPS5760715A (en) 1982-04-12

Family

ID=15130605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13453680A Pending JPS5760715A (en) 1980-09-27 1980-09-27 Production for stem of surface accustic wave device

Country Status (1)

Country Link
JP (1) JPS5760715A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4321651Y1 (en) * 1965-06-17 1968-09-11
JPS509472A (en) * 1973-05-21 1975-01-30
JPS5056879A (en) * 1973-09-14 1975-05-17
JPS516057U (en) * 1974-06-29 1976-01-17
JPS5615060B2 (en) * 1975-05-19 1981-04-08

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4321651Y1 (en) * 1965-06-17 1968-09-11
JPS509472A (en) * 1973-05-21 1975-01-30
JPS5056879A (en) * 1973-09-14 1975-05-17
JPS516057U (en) * 1974-06-29 1976-01-17
JPS5615060B2 (en) * 1975-05-19 1981-04-08

Similar Documents

Publication Publication Date Title
JPS5760715A (en) Production for stem of surface accustic wave device
JPS542683A (en) Semiconductor chip
JPS5396489A (en) Connecting method of lead wire
JPS57194539A (en) Pressing structure for lead frame
JPS5337396A (en) Crystal vibrator
JPS5439297A (en) Wire-cut processing method
JPS568831A (en) Wire bonding method
JPS53111594A (en) Method of mounting workpiece on holder
JPS5360572A (en) Ultrasonic wire bonding device
JPS5353290A (en) Supporting construction of piezoelectric vibrator chip
JPS5249010A (en) Method of forming gaps of magnetic head
JPS51147941A (en) Method of manufacturing supersonic wave delay lines
JPS55163911A (en) Manufacture of vibrator
JPS51147943A (en) Method of manufacturing supersonic wave delay lines
JPS5226823A (en) Vibrating board for speaker and manufacturing method thereof
JPS5291675A (en) Vibrator unit
JPS53112242A (en) Soldering method
JPS5352065A (en) Wire procissing unit after wire bonding
JPS5580130A (en) Manufacture of change drum
JPS5439343A (en) Bonding method
JPS5717141A (en) Bonding device
JPS577951A (en) Manufacture of stem for semiconductor device needing no whole surface finishing nickel plating process
JPS51130977A (en) Method of cutting thin sleeve
JPS5796543A (en) Wire bonder
JPS53134737A (en) Method of plating metal pipe with melted metal