JPS5749388Y2 - - Google Patents

Info

Publication number: JPS5749388Y2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP12674278U

Other languages

Japanese (ja)

Other versions

JPS5545214U (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-14

Filing date

1978-09-14

Publication date

1982-10-29

1978-09-14 Application filed filed Critical

1978-09-14 Priority to JP12674278U priority Critical patent/JPS5749388Y2/ja

1980-03-25 Publication of JPS5545214U publication Critical patent/JPS5545214U/ja

1982-10-29 Application granted granted Critical

1982-10-29 Publication of JPS5749388Y2 publication Critical patent/JPS5749388Y2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements

Landscapes

Wire Bonding (AREA)

JP12674278U 1978-09-14 1978-09-14 Expired JPS5749388Y2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP12674278U JPS5749388Y2 (en)	1978-09-14	1978-09-14

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP12674278U JPS5749388Y2 (en)	1978-09-14	1978-09-14

Publications (2)

Publication Number	Publication Date
JPS5545214U JPS5545214U (en)	1980-03-25
JPS5749388Y2 true JPS5749388Y2 (en)	1982-10-29

Family

ID=29088857

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP12674278U Expired JPS5749388Y2 (en)	1978-09-14	1978-09-14

Country Status (1)

Country	Link
JP (1)	JPS5749388Y2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL168342C (en) *	1974-06-28	1982-03-16	Oce Van Der Grinten Nv	REPRODUCTION DEVICE
JPS5785133U (en) *	1980-11-14	1982-05-26
JPS5796538A (en) *	1980-12-08	1982-06-15	Toshiba Corp	Processing method for component parts of semiconductor device
JPH01179336A (en) *	1987-12-30	1989-07-17	Sanken Electric Co Ltd	Wire bonding

1978
- 1978-09-14 JP JP12674278U patent/JPS5749388Y2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5545214U (en)	1980-03-25

Publication	Publication Date	Title
FR2415293B1 (en)	1983-07-08
CH628197B (en)
FR2415047B1 (en)	1983-09-30
DE2952424C2 (en)	1990-01-25
FR2413864B1 (en)	1983-05-20
DE2908009C2 (en)	1987-04-23
FR2415231B1 (en)	1984-04-27
FR2413668B1 (en)	1982-04-23
JPS5749388Y2 (en)	1982-10-29
FR2414998B1 (en)	1980-07-18
FR2414607B2 (en)	1983-06-03
FR2414101B3 (en)	1980-10-17
AU3898778A (en)	1978-09-28
AU3803078A (en)	1978-09-04
JPS54166262U (en)	1979-11-22
FR2414547B1 (en)	1984-10-05
DE2833656C2 (en)	1987-03-26
AU73950S (en)	1978-04-07
AU3892778A (en)	1978-10-13
BG25889A1 (en)	1979-01-12
BG25897A1 (en)	1979-01-12
BG25922A1 (en)	1979-01-12
BG25972A1 (en)	1979-01-12
BG25921A1 (en)	1979-01-12
BG25971A1 (en)	1979-01-12