JPS546186A - Wire-cut processing method and apparatus - Google Patents
Wire-cut processing method and apparatusInfo
- Publication number
- JPS546186A JPS546186A JP7136477A JP7136477A JPS546186A JP S546186 A JPS546186 A JP S546186A JP 7136477 A JP7136477 A JP 7136477A JP 7136477 A JP7136477 A JP 7136477A JP S546186 A JPS546186 A JP S546186A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- processing method
- cut processing
- primary
- processing table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
- B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
PURPOSE:To simultaneously and easily process into similar figures works placed on primary and secondary processing tables while driving the secondary processing table relative to the primary processing table at an arbitrary shift amount.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7136477A JPS546186A (en) | 1977-06-15 | 1977-06-15 | Wire-cut processing method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7136477A JPS546186A (en) | 1977-06-15 | 1977-06-15 | Wire-cut processing method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS546186A true JPS546186A (en) | 1979-01-18 |
Family
ID=13458360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7136477A Pending JPS546186A (en) | 1977-06-15 | 1977-06-15 | Wire-cut processing method and apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS546186A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61284323A (en) * | 1985-06-07 | 1986-12-15 | アクチエンゲゼルシヤフト フユ−ル インヅストリエル エレクトロニク アギ− ロ−ソネ バイ ロカルノ | Wire guide apparatus |
US4762974A (en) * | 1987-01-20 | 1988-08-09 | Harry Kern | Electrically independent wire electroerosion discharge machine |
US5315087A (en) * | 1992-03-02 | 1994-05-24 | Mitsubishi Denki Kabushiki Kaisha | Wirecut electrical discharge machine utilizing silicon powder suspended in a dielectric material |
JP2010274136A (en) * | 2010-09-14 | 2010-12-09 | Taiyo Elec Co Ltd | Game machine |
CN104249201A (en) * | 2013-06-28 | 2014-12-31 | 佳能市场营销日本株式会社 | Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52129095A (en) * | 1976-04-21 | 1977-10-29 | Houden Seimitsu Kakou Kenkiyuu | Plural wire electrodes discharge machining device |
-
1977
- 1977-06-15 JP JP7136477A patent/JPS546186A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52129095A (en) * | 1976-04-21 | 1977-10-29 | Houden Seimitsu Kakou Kenkiyuu | Plural wire electrodes discharge machining device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61284323A (en) * | 1985-06-07 | 1986-12-15 | アクチエンゲゼルシヤフト フユ−ル インヅストリエル エレクトロニク アギ− ロ−ソネ バイ ロカルノ | Wire guide apparatus |
US4762974A (en) * | 1987-01-20 | 1988-08-09 | Harry Kern | Electrically independent wire electroerosion discharge machine |
US5315087A (en) * | 1992-03-02 | 1994-05-24 | Mitsubishi Denki Kabushiki Kaisha | Wirecut electrical discharge machine utilizing silicon powder suspended in a dielectric material |
JP2010274136A (en) * | 2010-09-14 | 2010-12-09 | Taiyo Elec Co Ltd | Game machine |
CN104249201A (en) * | 2013-06-28 | 2014-12-31 | 佳能市场营销日本株式会社 | Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate |
CN104249201B (en) * | 2013-06-28 | 2017-04-12 | 佳能市场营销日本株式会社 | Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate |
US9707636B2 (en) | 2013-06-28 | 2017-07-18 | Canon Marketing Japan Kabushiki Kaisha | Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate |
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