JPS5742152A - Resin sealed type semiconductor and manufacture thereof - Google Patents

Resin sealed type semiconductor and manufacture thereof

Info

Publication number
JPS5742152A
JPS5742152A JP55117979A JP11797980A JPS5742152A JP S5742152 A JPS5742152 A JP S5742152A JP 55117979 A JP55117979 A JP 55117979A JP 11797980 A JP11797980 A JP 11797980A JP S5742152 A JPS5742152 A JP S5742152A
Authority
JP
Japan
Prior art keywords
light transmitting
glass
window
pellet
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55117979A
Other languages
Japanese (ja)
Other versions
JPS6130743B2 (en
Inventor
Natsuki Kadokanou
Koji Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55117979A priority Critical patent/JPS5742152A/en
Publication of JPS5742152A publication Critical patent/JPS5742152A/en
Publication of JPS6130743B2 publication Critical patent/JPS6130743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a resin sealing body having light transmitting window which is characterized by excellent productivity, by bonding one end of a light transmitting member to the surface of the semiconductor by using a light transmitting bonding agent, and exposing other surface to the outside. CONSTITUTION:A pellet 4 is mounted on a tab 2'' of a lead frame, and connected to leads 2' with gold wires 7. Ultraviolet rays transmitting glass 14 is bonded to the surface of the pellet 4 with the bonding agent 15 having excellent ultraviolet rays transmittance. Then, a tape 16 for lift off is applied on the glass 14. The device is sealed by epoxy resin 17. The tape is removed, and an ultraviolet ray erasing type PROM with a light transmitting window is obtained. In this constitution, conventional high temperature heating treatment is not required, and workability is enhanced. Inexpensive UV glass is good enough as a light transmitting material. The window is bonded to only the necessary part, and the intrusion of various light beams which erase memory can be reduced.
JP55117979A 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof Granted JPS5742152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55117979A JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55117979A JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5742152A true JPS5742152A (en) 1982-03-09
JPS6130743B2 JPS6130743B2 (en) 1986-07-15

Family

ID=14725003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55117979A Granted JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5742152A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207656A (en) * 1982-05-28 1983-12-03 Fujitsu Ltd Resin-sealed type semiconductor device
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US7087295B2 (en) 2002-01-18 2006-08-08 Sumitomo Electric Industries, Ltd. Surface-coated cutting tool

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207656A (en) * 1982-05-28 1983-12-03 Fujitsu Ltd Resin-sealed type semiconductor device
JPH0312467B2 (en) * 1982-05-28 1991-02-20 Fujitsu Ltd
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US7087295B2 (en) 2002-01-18 2006-08-08 Sumitomo Electric Industries, Ltd. Surface-coated cutting tool

Also Published As

Publication number Publication date
JPS6130743B2 (en) 1986-07-15

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