JPS56120177A - Semiconductor luminescence device - Google Patents
Semiconductor luminescence deviceInfo
- Publication number
- JPS56120177A JPS56120177A JP2371280A JP2371280A JPS56120177A JP S56120177 A JPS56120177 A JP S56120177A JP 2371280 A JP2371280 A JP 2371280A JP 2371280 A JP2371280 A JP 2371280A JP S56120177 A JPS56120177 A JP S56120177A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- casing
- light
- transmittible
- yield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004020 luminiscence type Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000004904 shortening Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Abstract
PURPOSE:To intend to increase the yield by sticking a spherical lens inside a light introducing window of a casing and sealing airtightly against a luminous zone of a semiconductor element. CONSTITUTION:A part of a sphere lense is worked evenly and fixedly adhered to the light introducing window 4 of the casing 5 with a light transmittible silicone resin adhesive 6. The casing 5 is arranged on a stem 3 on which the luminous element 2 is fixed. After setting the position of a lens with the luminous zone of the element 2, the airtight sealing is performed. According to this construction, since an aperture occurs between the element 2 and the lens 1, the element characteristics can be fully taken out without causing the stress to the element. Further, since the optical positioning can be performed simply, there is no need of treating a small lens or an element directly, and the simplification of the work and the increase of the yield are possible. Furthermore, the shortening the distance between the lens and the element is effectively performed by setting a impact buffer material 8 such as a light transmittible silicon resin group adhesive or the like between the element and the lens.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2371280A JPS56120177A (en) | 1980-02-27 | 1980-02-27 | Semiconductor luminescence device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2371280A JPS56120177A (en) | 1980-02-27 | 1980-02-27 | Semiconductor luminescence device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56120177A true JPS56120177A (en) | 1981-09-21 |
Family
ID=12117949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2371280A Pending JPS56120177A (en) | 1980-02-27 | 1980-02-27 | Semiconductor luminescence device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56120177A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593930A1 (en) * | 1986-01-24 | 1987-08-07 | Radiotechnique Compelec | OPTOELECTRONIC DEVICE FOR SURFACE MOUNTING |
JPS6444088A (en) * | 1987-08-12 | 1989-02-16 | Seiko Epson Corp | Semiconductor laser |
JPH0245657U (en) * | 1988-09-22 | 1990-03-29 | ||
WO1998037603A1 (en) * | 1997-02-18 | 1998-08-27 | Siemens Aktiengesellschaft | Laser device |
-
1980
- 1980-02-27 JP JP2371280A patent/JPS56120177A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593930A1 (en) * | 1986-01-24 | 1987-08-07 | Radiotechnique Compelec | OPTOELECTRONIC DEVICE FOR SURFACE MOUNTING |
JPS6444088A (en) * | 1987-08-12 | 1989-02-16 | Seiko Epson Corp | Semiconductor laser |
JPH0245657U (en) * | 1988-09-22 | 1990-03-29 | ||
WO1998037603A1 (en) * | 1997-02-18 | 1998-08-27 | Siemens Aktiengesellschaft | Laser device |
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