JPS5739548A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5739548A JPS5739548A JP55115069A JP11506980A JPS5739548A JP S5739548 A JPS5739548 A JP S5739548A JP 55115069 A JP55115069 A JP 55115069A JP 11506980 A JP11506980 A JP 11506980A JP S5739548 A JPS5739548 A JP S5739548A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- film
- bonding pad
- pad
- aluminum alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
- H01L2224/02165—Reinforcing structures
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
- H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To increase the bonding strength of a bonding pad in a semiconductor device by forming uneven surface on the bonding pad formed via an insulating film on a semiconductor substrate. CONSTITUTION:A CVD SiO2 film 13 is formed via a thermally oxidized film 12 on an Si substrate 11, uneven shape is formed by etching on the surface, aluminum alloy is then deposited to form a bonding pad 14 having uneven shape on the surface, the peripheral edge of the pad 14 is covered with a passivation film 15, e.g., a PSG or the like, and a spherical part 17 formed at the end of a bonding wire 16 made of Au or the like is bonded. Since the surface is readily deformed if the bonding pad of aluminum alloy or the like is used and the oxidized film is damaged to expose the new surface in this manner, the bonding strength to the bonding wire can be sufficiently increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55115069A JPS5739548A (en) | 1980-08-21 | 1980-08-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55115069A JPS5739548A (en) | 1980-08-21 | 1980-08-21 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5739548A true JPS5739548A (en) | 1982-03-04 |
Family
ID=14653404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55115069A Pending JPS5739548A (en) | 1980-08-21 | 1980-08-21 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5739548A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6249640A (en) * | 1985-08-29 | 1987-03-04 | Mitsubishi Electric Corp | Gold electrode structure |
US7030496B2 (en) | 2003-07-11 | 2006-04-18 | Denso Corporation | Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
JP2009131665A (en) * | 2009-03-16 | 2009-06-18 | Hitachi Appliances Inc | Vacuum cleaner |
USRE40819E1 (en) | 1995-12-21 | 2009-07-07 | Micron Technology, Inc. | Semiconductor device with improved bond pads |
EP1132961B1 (en) * | 1991-07-24 | 2011-01-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for producing a circuit substrate having a mounted semiconductor element |
US11437290B2 (en) * | 2019-05-09 | 2022-09-06 | Ibiden Co., Ltd. | Electronic component built-in wiring board and method for manufacturing the same |
-
1980
- 1980-08-21 JP JP55115069A patent/JPS5739548A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6249640A (en) * | 1985-08-29 | 1987-03-04 | Mitsubishi Electric Corp | Gold electrode structure |
JPH0525176B2 (en) * | 1985-08-29 | 1993-04-12 | Mitsubishi Electric Corp | |
EP1132961B1 (en) * | 1991-07-24 | 2011-01-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for producing a circuit substrate having a mounted semiconductor element |
USRE40819E1 (en) | 1995-12-21 | 2009-07-07 | Micron Technology, Inc. | Semiconductor device with improved bond pads |
US7030496B2 (en) | 2003-07-11 | 2006-04-18 | Denso Corporation | Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
JP2009131665A (en) * | 2009-03-16 | 2009-06-18 | Hitachi Appliances Inc | Vacuum cleaner |
US11437290B2 (en) * | 2019-05-09 | 2022-09-06 | Ibiden Co., Ltd. | Electronic component built-in wiring board and method for manufacturing the same |
US11935801B2 (en) | 2019-05-09 | 2024-03-19 | Ibiden Co., Ltd. | Electronic component built-in wiring board and method for manufacturing the same |
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