JPS6482652A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6482652A JPS6482652A JP62242105A JP24210587A JPS6482652A JP S6482652 A JPS6482652 A JP S6482652A JP 62242105 A JP62242105 A JP 62242105A JP 24210587 A JP24210587 A JP 24210587A JP S6482652 A JPS6482652 A JP S6482652A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- cracking
- etched
- bonding
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent an internal element from cracking and to improve reliability by providing an insulating resin film in a first opening, and providing a bonding second opening inside the first opening. CONSTITUTION:Metal wirings 3 made of aluminum or the like are provided on a thermal oxide film 2 provided on a semiconductor substrate 1. Then, an insulating film 4 is deposited on a surface including the wirings 3, and etched to form an opening 5. The surface including the opening 5 is coated thickly with an insulating resin film 6, and etched to form a bonding opening 7 inside the opening 5. Thus, it can absorb a stress due to resin sealing, prevents an internal element from cracking, and enhance its reliability without deteriorating electric characteristics.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242105A JPS6482652A (en) | 1987-09-25 | 1987-09-25 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242105A JPS6482652A (en) | 1987-09-25 | 1987-09-25 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482652A true JPS6482652A (en) | 1989-03-28 |
Family
ID=17084371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62242105A Pending JPS6482652A (en) | 1987-09-25 | 1987-09-25 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482652A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050963A (en) * | 2003-07-31 | 2005-02-24 | Seiko Epson Corp | Semiconductor device, electronic device, electronic apparatus and manufacturing method of semiconductor device |
JP2007294605A (en) * | 2006-04-24 | 2007-11-08 | Oki Data Corp | Semiconductor device, led head, and image forming apparatus |
JP2009538537A (en) * | 2006-05-23 | 2009-11-05 | フリースケール セミコンダクター インコーポレイテッド | Passivation and contact surrounded by polyimide and method of manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62214625A (en) * | 1986-03-17 | 1987-09-21 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
-
1987
- 1987-09-25 JP JP62242105A patent/JPS6482652A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62214625A (en) * | 1986-03-17 | 1987-09-21 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050963A (en) * | 2003-07-31 | 2005-02-24 | Seiko Epson Corp | Semiconductor device, electronic device, electronic apparatus and manufacturing method of semiconductor device |
JP2007294605A (en) * | 2006-04-24 | 2007-11-08 | Oki Data Corp | Semiconductor device, led head, and image forming apparatus |
JP2009538537A (en) * | 2006-05-23 | 2009-11-05 | フリースケール セミコンダクター インコーポレイテッド | Passivation and contact surrounded by polyimide and method of manufacturing the same |
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