JPS5737250U - - Google Patents

Info

Publication number
JPS5737250U
JPS5737250U JP1980113385U JP11338580U JPS5737250U JP S5737250 U JPS5737250 U JP S5737250U JP 1980113385 U JP1980113385 U JP 1980113385U JP 11338580 U JP11338580 U JP 11338580U JP S5737250 U JPS5737250 U JP S5737250U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980113385U
Other versions
JPS5918677Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980113385U priority Critical patent/JPS5918677Y2/ja
Publication of JPS5737250U publication Critical patent/JPS5737250U/ja
Application granted granted Critical
Publication of JPS5918677Y2 publication Critical patent/JPS5918677Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1980113385U 1980-08-12 1980-08-12 ワイヤボンデイング装置 Expired JPS5918677Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980113385U JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980113385U JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5737250U true JPS5737250U (ja) 1982-02-27
JPS5918677Y2 JPS5918677Y2 (ja) 1984-05-30

Family

ID=29474404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980113385U Expired JPS5918677Y2 (ja) 1980-08-12 1980-08-12 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5918677Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130433A (ja) * 1983-01-17 1984-07-27 Toshiba Corp ワイヤボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130433A (ja) * 1983-01-17 1984-07-27 Toshiba Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPS5918677Y2 (ja) 1984-05-30

Similar Documents

Publication Publication Date Title
FR2475849B1 (ja)
FR2474309B1 (ja)
FR2472931B1 (ja)
FR2473847B1 (ja)
FR2473816B1 (ja)
DE3152509T1 (ja)
DE3050591T1 (ja)
FR2474076B1 (ja)
FR2473351B1 (ja)
FR2473482B1 (ja)
FR2473777B3 (ja)
FR2475778B1 (ja)
FR2475734B1 (ja)
FR2473538B1 (ja)
FR2476127B1 (ja)
FR2473886B1 (ja)
FR2493660B1 (ja)
DE3148629T1 (ja)
FR2475941B1 (ja)
FR2473982B1 (ja)
FR2457100B1 (ja)
FR2473383B1 (ja)
FR2473938B1 (ja)
FR2475793B3 (ja)
FR2474776B1 (ja)