JPS5735353A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5735353A
JPS5735353A JP11063380A JP11063380A JPS5735353A JP S5735353 A JPS5735353 A JP S5735353A JP 11063380 A JP11063380 A JP 11063380A JP 11063380 A JP11063380 A JP 11063380A JP S5735353 A JPS5735353 A JP S5735353A
Authority
JP
Japan
Prior art keywords
semiconductor device
connecting terminal
external connecting
ceramics
collision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11063380A
Other languages
Japanese (ja)
Inventor
Ikuo Enokida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP11063380A priority Critical patent/JPS5735353A/en
Publication of JPS5735353A publication Critical patent/JPS5735353A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To avoid cracks and breakage of ceramics due to collision by providing a metal piece on the side, which has no external connecting terminal, of a ceramic container for the semiconductor device. CONSTITUTION:The ceramics 1 and 1' are fused and connected to the external connecting terminal 2 via a fusing and connecting part 3. On the side of the container, which does not have the external connecting terminal 2, the metal piece 4 is provided. In this constitution, the cracks and breadkage of the ceramics due to the collision by the containers with each other can be avoided.
JP11063380A 1980-08-12 1980-08-12 Semiconductor device Pending JPS5735353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11063380A JPS5735353A (en) 1980-08-12 1980-08-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11063380A JPS5735353A (en) 1980-08-12 1980-08-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5735353A true JPS5735353A (en) 1982-02-25

Family

ID=14540686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11063380A Pending JPS5735353A (en) 1980-08-12 1980-08-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5735353A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383386A (en) * 1986-09-29 1988-04-14 トステム株式会社 Production of wooden sash
EP0351602A2 (en) * 1988-07-18 1990-01-24 Motorola, Inc. Ceramic semiconductor package having crack arrestor patterns

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383386A (en) * 1986-09-29 1988-04-14 トステム株式会社 Production of wooden sash
EP0351602A2 (en) * 1988-07-18 1990-01-24 Motorola, Inc. Ceramic semiconductor package having crack arrestor patterns

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