JPS5732890A - Laser piercing method - Google Patents

Laser piercing method

Info

Publication number
JPS5732890A
JPS5732890A JP10876880A JP10876880A JPS5732890A JP S5732890 A JPS5732890 A JP S5732890A JP 10876880 A JP10876880 A JP 10876880A JP 10876880 A JP10876880 A JP 10876880A JP S5732890 A JPS5732890 A JP S5732890A
Authority
JP
Japan
Prior art keywords
hole
piercing
high pressure
work
pressure fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10876880A
Other languages
Japanese (ja)
Inventor
Takashi Omae
Yasuyuki Yoshida
Satoshi Suzuki
Shinji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryomei Engineering Co Ltd
Mitsubishi Heavy Industries Ltd
Original Assignee
Ryomei Engineering Co Ltd
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryomei Engineering Co Ltd, Mitsubishi Heavy Industries Ltd filed Critical Ryomei Engineering Co Ltd
Priority to JP10876880A priority Critical patent/JPS5732890A/en
Publication of JPS5732890A publication Critical patent/JPS5732890A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/005—Devices for removing chips by blowing

Abstract

PURPOSE:To prevent clogging of a through-hole in laser piercing and improve the accuracy of piercing by piercing the work while acting high pressure fluid upon the rear surface thereof and blowing the melt in the hole to the front side when the through-hole is formed. CONSTITUTION:A vessel 7 is hermetically fixed to the work 3 in a position opposing to the piercing section on its rear, and high pressure fluid 8 using water, air or the like is sealed thereon. While a laser beam 1 is being irradiated to the front of the work 3, piercing is carried out. At the same instant when a through-hole F is formed, the melt produced in the through-hole F is blown forcibly toward the out side surface of hole by the high pressure fluid 8. According to this method, there will be no melt left in the hole at all, whereby clogging is fully prevented and the accuracy of piercing is considerably improved.
JP10876880A 1980-08-07 1980-08-07 Laser piercing method Pending JPS5732890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10876880A JPS5732890A (en) 1980-08-07 1980-08-07 Laser piercing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10876880A JPS5732890A (en) 1980-08-07 1980-08-07 Laser piercing method

Publications (1)

Publication Number Publication Date
JPS5732890A true JPS5732890A (en) 1982-02-22

Family

ID=14492990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10876880A Pending JPS5732890A (en) 1980-08-07 1980-08-07 Laser piercing method

Country Status (1)

Country Link
JP (1) JPS5732890A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937460A1 (en) * 1989-11-10 1990-11-08 Daimler Benz Ag Producing burr-free openings in liq. conduit - using laser beam with bubble-free liq. running through conduit to remove residue during cutting
JP2001269793A (en) * 2000-03-27 2001-10-02 Ricoh Microelectronics Co Ltd Method of laser beam machining
JP2009045832A (en) * 2007-08-20 2009-03-05 Toshiba Tec Corp Inkjet head manufacturing method
JP2011206791A (en) * 2010-03-29 2011-10-20 Honda Motor Co Ltd Laser boring method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5440378A (en) * 1977-09-07 1979-03-29 Toshiba Corp Method and device for cutting-off by laser

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5440378A (en) * 1977-09-07 1979-03-29 Toshiba Corp Method and device for cutting-off by laser

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937460A1 (en) * 1989-11-10 1990-11-08 Daimler Benz Ag Producing burr-free openings in liq. conduit - using laser beam with bubble-free liq. running through conduit to remove residue during cutting
JP2001269793A (en) * 2000-03-27 2001-10-02 Ricoh Microelectronics Co Ltd Method of laser beam machining
JP2009045832A (en) * 2007-08-20 2009-03-05 Toshiba Tec Corp Inkjet head manufacturing method
JP4676466B2 (en) * 2007-08-20 2011-04-27 東芝テック株式会社 Inkjet head manufacturing method
JP2011206791A (en) * 2010-03-29 2011-10-20 Honda Motor Co Ltd Laser boring method

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