JPS5440378A - Method and device for cutting-off by laser - Google Patents

Method and device for cutting-off by laser

Info

Publication number
JPS5440378A
JPS5440378A JP10665177A JP10665177A JPS5440378A JP S5440378 A JPS5440378 A JP S5440378A JP 10665177 A JP10665177 A JP 10665177A JP 10665177 A JP10665177 A JP 10665177A JP S5440378 A JPS5440378 A JP S5440378A
Authority
JP
Japan
Prior art keywords
gas
workpiece
processed part
reverse side
processing advance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10665177A
Other languages
Japanese (ja)
Other versions
JPS5933079B2 (en
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP52106651A priority Critical patent/JPS5933079B2/en
Publication of JPS5440378A publication Critical patent/JPS5440378A/en
Publication of JPS5933079B2 publication Critical patent/JPS5933079B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To prevent projections from adhering to the reverse side of a workpiece, by jetting gas from the processing advance part of the reverse side of the workpiece to the opposite side of processed part and supplying gas from the processing advance part of the obverse side of the workpiece and crossing the direction of the gas supply with that of the gas jet. CONSTITUTION:Gas is supplied from an inlet port 7 at the laser processing advance part 10a of the obverse side 10 of the workpiece to an exhaust part 34 behind the processed part 4 through the opening 9 of a passage member 6 along the processed part 4. Gas is jetted from the processing advance part 10d of the reverse side 10c of the workpiece to the reverse side 11 of the processed part through a nozzle 24 along an optical axis 5. A portion of the gas supplied flows along the processed part 4 to the rear 10b thereof, and another portion of the gas flows from the opening 9 to the processed part 4 to scatter a molten matter behind the processed part 10b. Another molten matter having flown down is blown up, heated and evaporated by the gas ejected from the nozzle 24 and then scattered together with the exhaust gas.
JP52106651A 1977-09-07 1977-09-07 Laser cutting method and device Expired JPS5933079B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52106651A JPS5933079B2 (en) 1977-09-07 1977-09-07 Laser cutting method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52106651A JPS5933079B2 (en) 1977-09-07 1977-09-07 Laser cutting method and device

Publications (2)

Publication Number Publication Date
JPS5440378A true JPS5440378A (en) 1979-03-29
JPS5933079B2 JPS5933079B2 (en) 1984-08-13

Family

ID=14439007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52106651A Expired JPS5933079B2 (en) 1977-09-07 1977-09-07 Laser cutting method and device

Country Status (1)

Country Link
JP (1) JPS5933079B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732890A (en) * 1980-08-07 1982-02-22 Mitsubishi Heavy Ind Ltd Laser piercing method
JPS6127188A (en) * 1984-07-17 1986-02-06 Mitsubishi Electric Corp Laser welding device
US7009633B2 (en) * 2002-05-22 2006-03-07 Agfa-Gevaert System and method for laser marking
JP2007038274A (en) * 2005-08-04 2007-02-15 Kawamura Seiki Kk Method for cutting prepreg
JP2010188361A (en) * 2009-02-16 2010-09-02 Seidensha Electronics Co Ltd Laser beam machining apparatus and laser beam machining method
DE102020123147B4 (en) 2019-09-06 2022-01-27 Cericom GmbH Method, device, control device and computer program product for making a cut in a glass workpiece

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176888U (en) * 1986-04-28 1987-11-10
JP2001269793A (en) * 2000-03-27 2001-10-02 Ricoh Microelectronics Co Ltd Method of laser beam machining
CN103878482B (en) * 2014-04-03 2016-03-30 东莞台一盈拓科技股份有限公司 The laser cutting method of non-crystaline amorphous metal
CN104043904A (en) * 2014-06-09 2014-09-17 江苏大学 Back side-blown gas-assisted laser cutting method and device
CN110497097A (en) * 2019-08-07 2019-11-26 浙江锋源氢能科技有限公司 Laser cutting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732890A (en) * 1980-08-07 1982-02-22 Mitsubishi Heavy Ind Ltd Laser piercing method
JPS6127188A (en) * 1984-07-17 1986-02-06 Mitsubishi Electric Corp Laser welding device
US7009633B2 (en) * 2002-05-22 2006-03-07 Agfa-Gevaert System and method for laser marking
JP2007038274A (en) * 2005-08-04 2007-02-15 Kawamura Seiki Kk Method for cutting prepreg
JP2010188361A (en) * 2009-02-16 2010-09-02 Seidensha Electronics Co Ltd Laser beam machining apparatus and laser beam machining method
DE102020123147B4 (en) 2019-09-06 2022-01-27 Cericom GmbH Method, device, control device and computer program product for making a cut in a glass workpiece

Also Published As

Publication number Publication date
JPS5933079B2 (en) 1984-08-13

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